Abstract: The present disclosure provides a memory device, a semiconductor device, and a method of operating a memory device. A memory device includes a memory cell, a bit line, a word line, a select transistor, a fuse element, and a heater. The bit line is connected to the memory cell. The word line is connected to the memory cell. The select transistor is disposed in the memory cell. A gate of the select transistor is connected to the word line. The fuse element is disposed in the memory cell. The fuse element is connected to the bit line and the select transistor. The heater is configured to heat the fuse element.

Abstract: Structures and methods of forming fan-out packages are provided. The packages described herein may include a cavity substrate, one or more semiconductor devices located in a cavity of the cavity substrate, and one or more redistribution structures. Embodiments include a cavity preformed in a cavity substrate. Various devices, such as integrated circuit dies, packages, or the like, may be placed in the cavity. Redistribution structures may also be formed.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a device package and a shielding layer. The device package includes an electronic device unit and has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface. The shielding layer is disposed on the first surface and the second surface of the device package. A common edge of the second surface and the third surface includes a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface includes a second portion exposed from the shielding layer by a second length that is different from the first length.

Abstract: The present disclosure is directed to methods and devices for devices including multiple die. A wafer is received having a plurality of die and a plurality of scribe lines. A dicing process is performed on the wafer. The dicing process includes identifying a first scribe line of the plurality of scribe lines, the first scribe line interposing a first die and a second die of the plurality of die; and performing a partial cut on the first scribe line. In embodiments, other scribe lines of the wafer are, during the dicing process, fully cut. After the dicing, the first die and the second die are mounted on a substrate such as an interposer. The first die and the second die are connected by a portion of the first scribe line, e.g., remaining from the partial cut, during the mounting.

Abstract: An integrated circuit package includes an interposer, the interposer including: a first redistribution layer, a second redistribution layer over the first redistribution layer in a central region of the interposer, a dielectric layer over the first redistribution layer in a periphery of the interposer, the dielectric layer surrounding the second redistribution layer in a top-down view, a third redistribution layer over the second redistribution layer and the dielectric layer, and a first direct via extending through the dielectric layer. A conductive feature of the third redistribution layer is coupled to a conductive feature of the first redistribution layer through the first direct via.

Abstract: A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.

Abstract: An optical lens used for fundus photography includes a first plastic aspheric lens with a positive refractive power, a second plastic aspheric lens, a third plastic aspheric lens, and a fourth plastic aspheric lens with a positive refractive power arranged in order from an object side to an image side. The number of lenses with refractive powers is less than 9, each lens of the optical lens is a singlet lens, a length between respective optical centers of outermost lens surfaces at opposite ends of the optical lens is within a range of 50 mm to 130 mm, and a back focal length is greater than 20 mm.

Abstract: A display device includes a display panel and a backlight module. The backlight module is arranged under the display panel. The backlight module includes a matrix of light sources and a reflective sheet. The reflective sheet is disposed around or on at least one corner of the matrix of light sources. The reflective sheet has an upper edge, a reflective surface and a lower edge. The upper edge is far away from the matrix of light sources relative to the lower edge. A light conversion coating having a plurality of dots of different sizes is formed on the reflective surface. The matrix of light sources emits a first light toward the reflective sheet, and the first light is changed by the light conversion coating to form a second light, wherein the first light and the second light are of different colors.

Abstract: A display device includes a display panel and a backlight module. The backlight module is arranged under the display panel. The backlight module includes a matrix of light sources and a reflective sheet. The reflective sheet is disposed around or on at least one corner of the matrix of light sources. The reflective sheet has an upper edge, a reflective surface and a lower edge. The upper edge is far away from the matrix of light sources relative to the lower edge. A light conversion coating having a plurality of dots of different sizes is formed on the reflective surface. The matrix of light sources emits a first light toward the reflective sheet, and the first light is changed by the light conversion coating to form a second light, wherein the first light and the second light are of different colors.

Abstract: The present invention relates to a method for size estimation by image recognition of a specific target using a given scale. First, a reference objected is recognized in an image and the corresponding scale is established. Then the specific target is searched and the size of the specific target is estimated according to the acquired scale.

Abstract: An imaging lens including an aperture and a lens with refractive power arranged from a zoom-in side to a zoom-out side along an optical axis is provided. The aperture includes a substrate and a light-shielding layer. The substrate includes a first middle region and a first outer edge region surrounding the first middle region. The first outer edge region allows visible light and infrared light to substantially pass therethrough. The light-shielding layer includes a second middle region and a second outer edge region surrounding the second middle region. The second outer edge region allows infrared light to substantially pass therethrough and substantially shields visible light. A thickness of the aperture is between 0.01 mm and 0.3 mm along a direction of an optical axis. Furthermore, an imaging lens and a manufacturing method of a light-shielding element are also provided.

Abstract: A lens including a filter, an aperture stop, and a lens set sequentially arranged along a first direction is provided. The filter includes a central region and a peripheral region. The central region has a first light transmission band for a wavelength range of a visible light and a second light transmission band for a wavelength range of an infrared light. The peripheral region surrounds the central region. The peripheral region has a third light transmission band for the wavelength range of the infrared light and is substantially opaque to the visible light, and an area of one portion of the central region surrounded by the peripheral region is tapered toward the first direction.

Abstract: A light source module includes a circuit substrate, a plurality of light emitting units, a plurality of microstructures and a wavelength converting layer. The circuit substrate includes a first surface and has a recessed portion recessed inwardly from the first surface. The circuit substrate forms a bottom and a sidewall in the recessed portion. The light emitting units are disposed on the bottom and located in the recessed portion. The microstructures are disposed on at least one of the bottom and the sidewall. The wavelength converting unit covers the light emitting units, and fills the recessed portion.

Abstract: A display device including a display panel, a light guide plate and a light emitting module is disclosed. The light guide plate is opposite to the display panel and has a light incident surface. The light emitting module emits a light to the light incident surface. The light emitting module includes a substrate, multiple first light emitting elements and multiple second light emitting elements. The first light emitting elements are disposed on the substrate along the first direction and divided into multiple first luminous areas. Each first luminous area includes at least two first light emitting elements. The second light emitting elements are disposed on the substrate along the first direction and divided into multiple second luminous areas. Each second luminous area includes at least two second light emitting elements. The first and second luminous areas are staggered along the second direction perpendicular to the first direction.

Abstract: The present invention relates to a method for size estimation by image recognition of a specific target using a given scale. First, a reference objected is recognized in an image and the corresponding scale is established. Then the specific target is searched and the size of the specific target is estimated according to the acquired scale.

Abstract: A backlight module includes a circuit board, a plurality of light emitting units, a support frame, a reflector, and a diffusion plate. The light emitting units are disposed on the circuit board. The support frame includes a plurality of first support members, wherein the first support members are disposed on the circuit board in parallel. The reflector is disposed on the support frame. The reflector includes a plurality of reflecting grids, wherein the reflecting grids are accommodated between the first support members and the light emitting units are located in the reflecting grids. The diffusion plate is disposed above the reflector.

Abstract: An imaging lens including an aperture and a lens with refractive power arranged from a zoom-in side to a zoom-out side along an optical axis is provided. The aperture includes a substrate and a light-shielding layer. The substrate includes a first middle region and a first outer edge region surrounding the first middle region. The first outer edge region allows visible light and infrared light to substantially pass therethrough. The light-shielding layer includes a second middle region and a second outer edge region surrounding the second middle region. The second outer edge region allows infrared light to substantially pass therethrough and substantially shields visible light. A thickness of the aperture is between 0.01 mm and 0.3 mm along a direction of an optical axis. Furthermore, an imaging lens and a manufacturing method of a light-shielding element are also provided.

Abstract: A wearable device and a power saving method are proposed. The wearable device includes a sensor and a first processing unit. The sensor has a buffer. The first processing unit is coupled to the sensor. The first processing unit in a first hibernate mode is woken up after receiving a first signal, wherein the first processing unit includes an interrupting module. The interrupting module makes the first processing unit enter the first hibernate mode after commands, in response to the first signal, the sensor to start sensing so as to generate sense data, wherein the sensor wakes up the first processing unit from the first hibernate mode based on an amount of the sense data exceeding a threshold of the buffer, and the first processing unit enters the first hibernate mode after processing the sense data.

Abstract: A wearable device and a power saving method are proposed. The wearable device includes a sensor and a first processing unit. The sensor has a buffer. The first processing unit is coupled to the sensor. The first processing unit in a first hibernate mode is woken up after receiving a first signal, wherein the first processing unit includes an interrupting module. The interrupting module makes the first processing unit enter the first hibernate mode after commands, in response to the first signal, the sensor to start sensing so as to generate sense data, wherein the sensor wakes up the first processing unit from the first hibernate mode based on an amount of the sense data exceeding a threshold of the buffer, and the first processing unit enters the first hibernate mode after processing the sense data.