Patents by Inventor Meng-Ying Chaung

Meng-Ying Chaung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive Structure With Hybrid Adhesive Layer
    Publication number: 20150004345
    Abstract: An adhesive structure is disclosed. The adhesive structure includes a first layer, a second layer, and a hybrid adhesive layer for adhering the first layer to the second layer. The hybrid adhesive layer includes two or more adhesive units made of different adhesive materials, and the two or more adhesive units are arranged in a planar pattern.
    Type: Application
    Filed: June 26, 2013
    Publication date: January 1, 2015
    Inventors: Meng-Ying Chaung, Kuo-Feng Chen, Chih-Chia Chang, Chen-Pang Kung