Abstract: An apparatus includes a wafer stage and a particle removing assembly. The wafer stage includes a cup adjacent to a wafer chuck. The particle removing assembly is configured to remove contaminant particles from the cup. In some embodiments, the particle removing assembly comprises a flexible ejecting member that includes one or more elongated tubes, a front tip, and a cleaning tip adapter configured to attach the front tip to each of the one or more elongated tubes. The front tip includes front openings and lateral openings from which pressurized cleaning material are introduced onto an unreachable area of the cup to remove the contaminant particles from the cup.

Abstract: An apparatus includes a wafer stage and a particle removing assembly. The wafer stage includes a cup adjacent to a wafer chuck. The particle removing assembly is configured to remove contaminant particles from the cup. In some embodiments, the particle removing assembly comprises a flexible ejecting member that includes one or more elongated tubes, a front tip, and a cleaning tip adapter configured to attach the front tip to each of the one or more elongated tubes. The front tip includes front openings and lateral openings from which pressurized cleaning material are introduced onto an unreachable area of the cup to remove the contaminant particles from the cup.

Abstract: The present disclosure discloses a device having multiple printing layers and a printing method thereof, wherein said method comprises: seriatim stack-printing at least one printing layer on a protective substrate in an ascending order of size, wherein the protective substrate has an open surface exposed outward and a laminating surface laminated with a plate, and wherein the printing layer is printed on a part of the laminating surface and the closer the printing layer is to the laminating surface, the smaller area the printing layer has so as to reduce height difference between printing layers and make for the following lamination.

Abstract: The present disclosure related to circuit structure of an electronic device, wherein the circuit structure comprises of a main line formed on a substrate; and at least an auxiliary line electrically connected to the main line to form a conductive return circuit used for a signal to pass through the auxiliary line when the main line is disconnected. Addition of the auxiliary line avoids any breaking of signal transmission due to partial disconnection of the main line. The present disclosure also relates to a method for manufacturing the circuit structure, wherein the method simplifies the manufacturing process and also reduces the rate of deformation or disconnection of lines.

Abstract: The present disclosure discloses a device having multiple printing layers and a printing method thereof, wherein said method comprises: seriatim stack-printing at least one printing layer on a protective substrate in an ascending order of size, wherein the protective substrate has an open surface exposed outward and a laminating surface laminated with a plate, and wherein the printing layer is printed on a part of the laminating surface and the closer the printing layer is to the laminating surface, the smaller area the printing layer has so as to reduce height difference between printing layers and make for the following lamination.

Abstract: The present disclosure related to circuit structure of an electronic device, wherein the circuit structure comprises of a main line formed on a substrate; and at least an auxiliary line electrically connected to the main line to form a conductive return circuit used for a signal to pass through the auxiliary line when the main line is disconnected. Addition of the auxiliary line avoids any breaking of signal transmission due to partial disconnection of the main line. The present disclosure also relates to a method for manufacturing the circuit structure, wherein the method simplifies the manufacturing process and also reduces the rate of deformation or disconnection of lines.