Patents by Inventor Menghua Long

Menghua Long has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9303861
    Abstract: The present invention provides a highly-protective, heat dissipating LED light source module that may be waterproof or non-waterproof. In an embodiment, the present invention provides an LED light source module comprising: a waterproof housing comprising a metal substrate and a plastic cover integrally disposed on one or more surfaces of the metal substrate; and at least one light emitting diode, electronic component, and power line disposed on and operably connected with the metal substrate and encapsulated thereon by the plastic cover. In other embodiments are provided LED light source modules comprising: a circuit board with at least two through holes disposed at selected positions; at least one light emitting diode, electronic component, and power line disposed on the circuit board and operably connected therewith; and a plastic cover comprising at least two pins disposed and shaped for interconnection with corresponding through holes of the circuit board.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: April 5, 2016
    Assignee: US VAOPTO, Inc.
    Inventors: Qing (Charles) Li, Yangcheng Huang, Haijun Wang, Guowen Lei, Cuie Wei, Menghua Long, GuiLin Wang
  • Patent number: 9157610
    Abstract: A manufacture method for a surface mounted power LED support comprises providing a wiring board having both sided metal layers. In addition, the method comprises forming a hole. Further, the method comprises setting a metal layer in the surface of the hole. Still further, the method comprises thickening the metal layer of the wiring board. The method also comprises etching the metal layer of the wiring board. Moreover, the method comprises cutting the wiring board to form single support unit. A surface mounted power LED support comprises a both sided wiring board, a hole formed in the wiring board and wiring layers set on the surface of the wiring board.
    Type: Grant
    Filed: August 25, 2010
    Date of Patent: October 13, 2015
    Assignees: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD., ZHU HAI BONTECH ELECTRONIC TECHNOLOGY CO., LTD.
    Inventors: Binhai Yu, Bairong Sun, Weiping Li, Xunli Xia, Cheng Li, Menghua Long, Lifang Liang
  • Publication number: 20130121007
    Abstract: A manufacture method for a surface mounted power LED support comprises providing a wiring board having both sided metal layers. In addition, the method comprises forming a hole. Further, the method comprises setting a metal layer in the surface of the hole. Still further, the method comprises thickening the metal layer of the wiring board. The method also comprises etching the metal layer of the wiring board. Moreover, the method comprises cutting the wiring board to form single support unit. A surface mounted power LED support comprises a both sided wiring board, a hole formed in the wiring board and wiring layers set on the surface of the wiring board.
    Type: Application
    Filed: August 25, 2010
    Publication date: May 16, 2013
    Applicants: ZHU HAI BONTECH ELECTRONIC TECHNOLOGY CO., LTD., FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
    Inventors: Binhai Yu, Bairong Sun, Weiping Li, Xunli Xia, Cheng Li, Menghua Long, Lifang Liang
  • Publication number: 20120002407
    Abstract: The present invention provides a highly-protective, heat dissipating LED light source module that may be waterproof or non-waterproof. In an embodiment, the present invention provides an LED light source module comprising: a waterproof housing comprising a metal substrate and a plastic cover integrally disposed on one or more surfaces of the metal substrate; and at least one light emitting diode, electronic component, and power line disposed on and operably connected with the metal substrate and encapsulated thereon by the plastic cover. In other embodiments are provided LED light source modules comprising: a circuit board with at least two through holes disposed at selected positions; at least one light emitting diode, electronic component, and power line disposed on the circuit board and operably connected therewith; and a plastic cover comprising at least two pins disposed and shaped for interconnection with corresponding through holes of the circuit board.
    Type: Application
    Filed: December 22, 2010
    Publication date: January 5, 2012
    Inventors: Qing (Charles) Li, Yangcheng Huang, Haijun Wang, Guowen Lei, Cuie Wei, Menghua Long, GuiLin Wang