Abstract: A die bonding method for a micro-LED. The method includes plating tin at a die bonding position of a printed circuit board (PCB) to obtain a tin-plated layer; adding a protective layer and a flux layer on the tin-plated layer in sequence to obtain a pretreated PCB; and transferring a flip-chip micro-LED to the pretreated PCB, reflowing and die bonding to complete die bonding of the micro-LED.

Abstract: A pixel structure, a display panel, and a display device. The pixel structure comprises a plurality of pixel groups arranged in an array and each comprises a first sub-pixel, a second sub-pixel, and a third sub-pixel; a line connecting the centers of the first sub-pixel, the second sub-pixel and the third sub-pixel forms a first virtual isosceles right triangle; in two adjacent pixel groups arranged in a row direction of the array, a line connecting the centers of the second sub-pixel and the third sub-pixel of one pixel group and the first sub-pixel of the other pixel group forms a second virtual isosceles right triangle; in two adjacent pixel groups in a column direction of the array, a line connecting the centers of the first sub-pixel and the second sub-pixel of one pixel group and the third sub-pixel of the other pixel group forms a third virtual isosceles right triangle.

Abstract: An LED is provided, the LED comprising a lighting assembly and a light bead. The light head encases the lighting assembly. A cross-section of an upper portion of the light bead is an asymmetric shape with respect to the projection of a normal of the lighting assembly on the cross-section of the upper portion of the light bead, while a cross-section at the lower portion of the light bead perpendicular to the axis is a symmetric shape with respect to the projection of the normal of the lighting assembly on the cross-section at the lower portion of the light bead. The lighting assembly is located at a symcenter of the lower portion of the light bead. The aforementioned LED can increase its visible range, and can ensure an even distribution of the internal stress surrounding the lighting assembly. An LED packaging method is also provided.

Abstract: An LED is provided, the LED comprising a lighting assembly and a light bead. The light bead encases the lighting assembly. A cross-section of an upper portion of the light bead is an asymmetric shape with respect to the projection of a normal of the lighting assembly on the cross-section of the upper portion of the light bead, while a cross-section at the lower portion of the light bead perpendicular to the axis is a symmetric shape with respect to the projection of the normal of the lighting assembly on the cross-section at the lower portion of the light bead. The lighting assembly is located at a symcenter of the lower portion of the light bead. The aforementioned LED can increase its visible range, and can ensure an even distribution of the internal stress surrounding the lighting assembly. An LED packaging method is also provided.