Patents by Inventor Menglu Li

Menglu Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12165956
    Abstract: Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of passive components and a molding compound encapsulating at least the plurality of passive components and the die.
    Type: Grant
    Filed: December 8, 2021
    Date of Patent: December 10, 2024
    Assignee: Apple Inc.
    Inventors: Kumar Nagarajan, Flynn P. Carson, Karthik Shanmugam, Menglu Li, Raymundo M. Camenforte, Scott D. Morrison
  • Publication number: 20240356225
    Abstract: An electronic device may be provided with a phased antenna array with antennas on an antenna module. The module may include a primary substrate and a secondary substrate mounted to the primary substrate by an interconnect. An antenna may include patch elements in the primary substrate and patch elements in the secondary substrate that are fed using conductive vias. Fences of conductive vias may couple the patch elements in the primary substrate to ground to isolate the patch elements in the primary substrate from the patch elements in the secondary substrate. The secondary substrate may be smaller than the primary substrate, allowing the secondary substrate to fit into relatively small portions of the electronic device while locating the patch elements in the secondary substrates closer to free space, thereby maximizing antenna performance.
    Type: Application
    Filed: April 24, 2023
    Publication date: October 24, 2024
    Inventors: Trang T. Thai, Jennifer M. Edwards, Sidharth S. Dalmia, Menglu Li, Taegui Kim, Hai H. Ta
  • Patent number: 12074077
    Abstract: Flexible packages and electronic devices with integrated flexible packages are described. In an embodiment, a flexibly package includes a first die and a second die encapsulated in a molding compound layer. A compliant redistribution layer (RDL) spans the molding compound layer and both dies, and includes electrical routing formed directly on landing pads of the dies. A notch is formed in the molding compound layer between the dies to facilitate flexure of the compliant RDL.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: August 27, 2024
    Assignee: Apple Inc.
    Inventors: Karthik Shanmugam, Flynn P. Carson, Jun Zhai, Raymundo M. Camenforte, Menglu Li
  • Publication number: 20240229101
    Abstract: The present invention provides a method for evaluating intracellular or extracellular enzyme activity of CYP enzyme group, including a step of measuring the number of molecules of oxidized CYP enzyme group.
    Type: Application
    Filed: June 22, 2022
    Publication date: July 11, 2024
    Applicants: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, OSAKA UNIVERSITY
    Inventors: Yasunori NAWA, Menglu LI, Seiichi ISHIDA, Yasunari KANDA, Satoshi FUJITA, Katsumasa FUJITA
  • Publication number: 20230178458
    Abstract: Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of passive components and a molding compound encapsulating at least the plurality of passive components and the die.
    Type: Application
    Filed: December 8, 2021
    Publication date: June 8, 2023
    Inventors: Kumar Nagarajan, Flynn P. Carson, Karthik Shanmugam, Menglu Li, Raymundo M. Camenforte, Scott D. Morrison
  • Publication number: 20220157680
    Abstract: Flexible packages and electronic devices with integrated flexible packages are described. In an embodiment, a flexibly package includes a first die and a second die encapsulated in a molding compound layer. A compliant redistribution layer (RDL) spans the molding compound layer and both dies, and includes electrical routing formed directly on landing pads of the dies. A notch is formed in the molding compound layer between the dies to facilitate flexure of the compliant RDL.
    Type: Application
    Filed: November 19, 2020
    Publication date: May 19, 2022
    Inventors: Karthik Shanmugam, Flynn P. Carson, Jun Zhai, Raymundo M. Camenforte, Menglu Li