Patents by Inventor Mengmeng LU

Mengmeng LU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging method, electronic device, and packaging apparatus
    Patent number: 11482689
    Abstract: Embodiments of the present disclosure provide a packaging method, an electronic device, and a packaging apparatus. The packaging method includes: providing a first substrate and a second substrate; and cell-assembling the first substrate and the second substrate to sandwich a filling glue between the first substrate and the second substrate to form a packaging structure, the filling glue is mixed with electrophoretic liquid encapsulated by a capsule, and the electrophoretic liquid includes an electrophoretic particle; in a process of cell-assembling the first substrate and the second substrate, applying an electric field to control the electrophoretic particle to move directionally to deform the capsule.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: October 25, 2022
    Assignees: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
    Inventors: Mengmeng Lu, Sha Feng, Bo Zhou, Yongzhi Song
  • OLED display device, and method for controlling the OLED display device
    Patent number: 11200837
    Abstract: The application discloses an OLED display device and a method for controlling the OLED display device. The OLED display device includes: a first switch element electrically connected respectively with a standby voltage terminal of the power board, and a standby voltage terminal of the main chip, and configured to control the standby voltage terminal of the power board to connect with or disconnect from the standby voltage terminal of the main chip; and a first control element electrically connected respectively with the first switch element, the power board, and the main chip, and configured to receive an AC detection signal output by the power board, and a DC detection signal output by the main chip, and to control the first switch element to turn on or cut off.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: December 14, 2021
    Assignee: HISENSE VISUAL TECHNOLOGY CO., LTD.
    Inventors: Weijing Yu, Mengmeng Lu, Xiyu Wang, Yang He, Guanghua Xue, Shaofeng Tan, Zaijing Zhang, Zhi Cheng, Xiaodong Bai
  • PACKAGING METHOD, ELECTRONIC DEVICE, AND PACKAGING APPARATUS
    Publication number: 20210367182
    Abstract: Embodiments of the present disclosure provide a packaging method, an electronic device, and a packaging apparatus. The packaging method includes: providing a first substrate and a second substrate; and cell-assembling the first substrate and the second substrate to sandwich a filling glue between the first substrate and the second substrate to form a packaging structure, the filling glue is mixed with electrophoretic liquid encapsulated by a capsule, and the electrophoretic liquid includes an electrophoretic particle; in a process of cell-assembling the first substrate and the second substrate, applying an electric field to control the electrophoretic particle to move directionally to deform the capsule.
    Type: Application
    Filed: December 6, 2018
    Publication date: November 25, 2021
    Inventors: Mengmeng LU, Sha FENG, Bo ZHOU, Yongzhi SONG
  • OLED DISPLAY DEVICE, AND METHOD FOR CONTROLLING THE OLED DISPLAY DEVICE
    Publication number: 20200098309
    Abstract: The application discloses an OLED display device and a method for controlling the OLED display device. The OLED display device includes: a first switch element electrically connected respectively with a standby voltage terminal of the power board, and a standby voltage terminal of the main chip, and configured to control the standby voltage terminal of the power board to connect with or disconnect from the standby voltage terminal of the main chip; and a first control element electrically connected respectively with the first switch element, the power board, and the main chip, and configured to receive an AC detection signal output by the power board, and a DC detection signal output by the main chip, and to control the first switch element to turn on or cut off.
    Type: Application
    Filed: October 24, 2019
    Publication date: March 26, 2020
    Applicant: Qingdao Hisense Electronics Co.,Ltd.
    Inventors: Weijing YU, Mengmeng LU, Xiyu WANG, Yang HE, Guanghua XUE, Shaofeng TAN, Zaijing ZHANG, Zhi CHENG, Xiaodong BAI