Patents by Inventor Mengqi Ye
Mengqi Ye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240093345Abstract: The present disclosure provides a fixed-position defect doping method for a micro-nanostructure based on a self-alignment process, including: S1, sequentially forming a sacrificial layer and a photoresist layer on a surface of a crystal substrate; S2, performing a lithography on the photoresist layer to form a mask hole according to a micro-nano pattern; S3, performing an isotropic etching on the sacrificial layer through the mask hole, and amplifying the micro-nano pattern to the sacrificial layer; S4, performing an ion implantation doping on an exposed crystal surface below the mask hole; S5, removing the photoresist layer, and depositing a mask material; S6, removing the sacrificial layer, and transferring a micro-nano amplified pattern in the sacrificial layer to a mask material pattern; and S7, etching an exposed crystal surface, and removing the mask material on the surface and forming a specific defect by annealing.Type: ApplicationFiled: November 30, 2020Publication date: March 21, 2024Inventors: Mengqi Wang, Ya Wang, Haoyu Sun, Xiangyu Ye, Pei Yu, Hangyu Liu, Pengfei Wang, Fazhan Shi, Jiangfeng Du
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Publication number: 20130327641Abstract: Sputtering in a physical vapor deposition (PVD) chamber may, in one embodiment, utilize a target laterally offset from and tilted with respect to the substrate. In another aspect, target power may be reduced to enhance film protection. In yet another aspect, magnetron magnets may be relatively strong and well balanced to enhance film protection. In another aspect, a shutter may be provided to protect the substrate in start up conditions. Other embodiments are described and claimed.Type: ApplicationFiled: May 20, 2013Publication date: December 12, 2013Inventors: Mengqi YE, Zhendong LIU, Peijun DING
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Patent number: 8500963Abstract: A plasma sputtering method for metal chalcogenides, such as germanium antimony telluride (GST), useful in forming phase-change memories. The substrate is held at a selected temperature at which the material deposits in either an amorphous or crystalline form. GST has a low-temperature amorphous range and a high-temperature crystalline range separated by a transition band of 105-120° C. Bipolar pulsed sputtering with less than 50% positive pulses of less than 10:s pulse width cleans the target while maintain the sputtering plasma. The temperature of chamber shields is maintained at a temperature favoring crystalline deposition or they may be coated with arc-spray aluminum or with crystallographically aligned copper or aluminum.Type: GrantFiled: July 17, 2007Date of Patent: August 6, 2013Assignee: Applied Materials, Inc.Inventors: Mengqi Ye, Keith A. Miller, Peijun Ding, Goichi Yoshidome, Rong Tao
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Patent number: 8460519Abstract: Sputtering in a physical vapor deposition (PVD) chamber may, in one embodiment, utilize a target laterally offset from and tilted with respect to the substrate. In another aspect, target power may be reduced to enhance film protection. In yet another aspect, magnetron magnets may be relatively strong and well balanced to enhance film protection. In another aspect, a shutter may be provided to protect the substrate in start up conditions. Other embodiments are described and claimed.Type: GrantFiled: March 23, 2006Date of Patent: June 11, 2013Assignee: Applied Materials Inc.Inventors: Mengqi Ye, Zhendong Liu, Peijun Ding
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Patent number: 8454804Abstract: Sputtering in a physical vapor deposition (PVD) chamber may, in one embodiment, utilize a target laterally offset from and tilted with respect to the substrate. In another aspect, target power may be reduced to enhance film protection. In yet another aspect, magnetron magnets may be relatively strong and well balanced to enhance film protection. In another aspect, a shutter may be provided to protect the substrate in start up conditions. Other embodiments are described and claimed.Type: GrantFiled: October 28, 2005Date of Patent: June 4, 2013Assignee: Applied Materials Inc.Inventors: Mengqi Ye, Zhendong Liu, Peijun Ding
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Publication number: 20120175245Abstract: Methods and apparatus are provided for depositing phase-change materials. In one embodiment, a method is provided for processing a substrate including positioning a substrate in a processing chamber having a phase change material-based target coupled to a first power source, one or more coils coupled to a second power source, a substrate support coupled to a third power source, providing a processing gas to the processing chamber, biasing the phase change material-based target with continuous DC or pulsed DC power, applying power to the coils to generate an inductively coupled plasma, applying a bias to the substrate support, sputtering material from the target, ionizing the sputtered materials, and depositing the sputtered materials on the substrate surface.Type: ApplicationFiled: March 16, 2012Publication date: July 12, 2012Inventors: Mengqi Ye, Hua Chung, Goichi Yoshidome, Philip Fulmer
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Patent number: 7884032Abstract: A system, method and apparatus is capable of producing layers of various materials stacked on one another on a substrate without exposing the substrate to the pressure and contaminants of ambient air until the stack is complete. In one aspect, the stack of layers can include both an insulative layer of one or more insulative films, and a conductive metal layer of one or more conductive metal layer films. In another aspect, a bias signal of positive and negative voltage pulses may be applied to a target of a deposition chamber to facilitate deposition of the target material in a suitable fashion. In yet another aspect, one or more of the deposition chambers may have associated therewith a pump which combines a turbomolecular pump and a cryogenic pump to generate an ultra high vacuum in that chamber. Other features are described and claimed.Type: GrantFiled: October 28, 2005Date of Patent: February 8, 2011Assignee: Applied Materials, Inc.Inventors: Mengqi Ye, Peijun Ding, Hougong Wang, Zhendong Liu
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Publication number: 20100096255Abstract: Methods and apparatus are provided for depositing phase-change materials. In one embodiment, a method is provided for processing a substrate including positioning a substrate in a processing chamber having a phase change material-based target coupled to a first power source, one or more coils coupled to a second power source, a substrate support coupled to a third power source, providing a processing gas to the processing chamber, biasing the phase change material-based target with continuous DC or pulsed DC power, applying power to the coils to generate an inductively coupled plasma, applying a bias to the substrate support, sputtering material from the target, ionizing the sputtered materials, and depositing the sputtered materials on the substrate surface.Type: ApplicationFiled: October 22, 2008Publication date: April 22, 2010Inventors: MENGQI YE, Hua Chung, Goichi Yoshidome, Philip Fulmer
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Publication number: 20090107834Abstract: A sputtering target for a sputtering chamber comprises a sputtering plate composed of a chalcogenide material comprising an average yield strength of from about 40 MPa to about 120 MPa and a thermal conductivity of at least about 2.8 W/(m·K). In one version the sputtering plate is composed of a chalcogenide material with a stoichiometric ratio that varies by less than about 5% throughout the body of the sputtering plate. In another version, the sputtering plate is composed of a chalcogenide material having an average grain size of at least 20 microns, and an oxygen content of less than 600 weight ppm. The sputtering target is sputtered by applying a pulsed DC voltage to the sputtering target.Type: ApplicationFiled: October 29, 2007Publication date: April 30, 2009Inventors: Mengqi Ye, Rong Tao, Hua Chung, Goichi Yoshidome, William Rhodes, Peijun Ding
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Publication number: 20080116067Abstract: The invention relates to physical vapor deposition (PVD) chambers having a rotatable substrate pedestal and at least one moveable tilted target. Embodiments of the invention facilitate deposition of highly uniform thin films.Type: ApplicationFiled: December 5, 2007Publication date: May 22, 2008Inventors: Ilya Lavitsky, Michael Rosenstein, Goichi Yoshidome, Hougong Wang, Zhendong Liu, Mengqi Ye
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Publication number: 20080099326Abstract: A plasma sputtering method for metal chalcogenides, such as germanium antimony telluride (GST), useful in forming phase-change memories. The substrate is held at a selected temperature at which the material deposits in either an amorphous or crystalline form. GST has a low-temperature amorphous range and a high-temperature crystalline range separated by a transition band of 105-120° C. Bipolar pulsed sputtering with less than 50% positive pulses of less than 10:s pulse width cleans the target while maintain the sputtering plasma. The temperature of chamber shields is maintained at a temperature favoring crystalline deposition or they may be coated with arc-spray aluminum or with crystallographically aligned copper or aluminum.Type: ApplicationFiled: July 17, 2007Publication date: May 1, 2008Applicant: Applied Meterials, Inc.Inventors: MENGQI YE, Keith A. Miller, Peijun Ding, Goichi Yoshidome, Rong Tao
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Publication number: 20070099438Abstract: A system, method and apparatus is capable of producing layers of various materials stacked on one another on a substrate without exposing the substrate to the pressure and contaminants of ambient air until the stack is complete. In one aspect, the stack of layers can include both an insulative layer of one or more insulative films, and a conductive metal layer of one or more conductive metal layer films. In another aspect, a bias signal of positive and negative voltage pulses may be applied to a target of a deposition chamber to facilitate deposition of the target material in a suitable fashion. In yet another aspect, one or more of the deposition chambers may have associated therewith a pump which combines a turbomolecular pump and a cryogenic pump to generate an ultra high vacuum in that chamber. Other features are described and claimed.Type: ApplicationFiled: October 28, 2005Publication date: May 3, 2007Inventors: Mengqi Ye, Peijun Ding, Hougong Wang, Zhendong Liu
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Publication number: 20070095650Abstract: Sputtering in a physical vapor deposition (PVD) chamber may, in one embodiment, utilize a target laterally offset from and tilted with respect to the substrate. In another aspect, target power may be reduced to enhance film protection. In yet another aspect, magnetron magnets may be relatively strong and well balanced to enhance film protection. In another aspect, a shutter may be provided to protect the substrate in start up conditions. Other embodiments are described and claimed.Type: ApplicationFiled: October 28, 2005Publication date: May 3, 2007Inventors: Mengqi Ye, Zhendong Liu, Peijun Ding
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Publication number: 20070095651Abstract: Sputtering in a physical vapor deposition (PVD) chamber may, in one embodiment, utilize a target laterally offset from and tilted with respect to the substrate. In another aspect, target power may be reduced to enhance film protection. In yet another aspect, magnetron magnets may be relatively strong and well balanced to enhance film protection. In another aspect, a shutter may be provided to protect the substrate in start up conditions. Other embodiments are described and claimed.Type: ApplicationFiled: March 23, 2006Publication date: May 3, 2007Inventors: Mengqi Ye, Zhendong Liu, Peijun Ding
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Publication number: 20060096851Abstract: The invention relates to physical vapor deposition (PVD) chambers having a rotatable substrate pedestal and at least one moveable tilted target. Embodiments of the invention facilitate deposition of highly uniform thin films.Type: ApplicationFiled: November 8, 2004Publication date: May 11, 2006Inventors: Ilya Lavitsky, Michael Rosenstein, Goichi Yoshidome, Hougong Wang, Zhendong Liu, Mengqi Ye
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Publication number: 20060096857Abstract: The invention relates to physical vapor deposition (PVD) chambers having a rotatable substrate pedestal. Embodiments of the invention facilitate deposition of highly uniform thin films. In further embodiments, one or more sputtering targets are movably disposed above the pedestal. The orientation of the targets relative to the pedestal may be adjusted laterally, vertically or angularly. In one embodiment, the target may be adjusted between angles of about 0 to 45 degreees relative to an axis of pedestal rotation.Type: ApplicationFiled: November 8, 2004Publication date: May 11, 2006Inventors: Ilya Lavitsky, Michael Rosenstein, Goichi Yoshidome, Hougong Wang, Zhendong Liu, Mengqi Ye