Patents by Inventor Mengru LIU

Mengru LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method for pcb with thermal conductor embedded therein, and pcb
    Patent number: 12171057
    Abstract: A method for manufacturing a PCB with an embedded thermal conductor and a PCB are provided. A sheet of copper-clad ceramic serves as a thermal conductor. A sheet of copper foil having no opening serves as an outer layer of a laminate. A part of the sheet of copper foil covering the thermal conductor is removed after a lamination process, to expose a conductive layer as the outer layer of the thermal conductor. Finally, the outer layer pattern is formed. The sheet of copper foil has no opening before the lamination process, so that the sheet of copper foil has good flatness during the lamination process, thereby avoiding wrinkles. Moreover, the sheet of copper-clad ceramic serves as the thermal conductor, so that a pattern is manufactured on the outer layer of the thermal conductor based on the exposed conductive layer.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: December 17, 2024
    Assignee: SHENGYI ELECTRONICS CO., LTD.
    Inventors: Lu Xiao, Hongyu Wu, Chengguang Ji, Mengru Liu, Zhengqing Chen, Hongbing Du, Haibo Tang
  • MANUFACTURING METHOD FOR PCB WITH THERMAL CONDUCTOR EMBEDDED THEREIN, AND PCB
    Publication number: 20220346217
    Abstract: A method for manufacturing a PCB with an embedded thermal conductor and a PCB are provided. A sheet of copper-clad ceramic serves as a thermal conductor. A sheet of copper foil having no opening serves as an outer layer of a laminate. A part of the sheet of copper foil covering the thermal conductor is removed after a lamination process, to expose a conductive layer as the outer layer of the thermal conductor. Finally, the outer layer pattern is formed. The sheet of copper foil has no opening before the lamination process, so that the sheet of copper foil has good flatness during the lamination process, thereby avoiding wrinkles. Moreover, the sheet of copper-clad ceramic serves as the thermal conductor, so that a pattern is manufactured on the outer layer of the thermal conductor based on the exposed conductive layer.
    Type: Application
    Filed: August 11, 2020
    Publication date: October 27, 2022
    Applicant: SHENGYI ELECTRONICS CO., LTD.
    Inventors: Lu XIAO, Hongyu WU, Chengguang JI, Mengru LIU, Zhengqing CHEN, Hongbing DU, Haibo TANG