Abstract: An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising

Abstract: An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising: (a) a main portion which comprises a main part of the first electrode, a main part of the second electrode, and a main part of the resistive element; and (b) a first connection leg which extends away from the main portion and which comprises a first leg part of the first electrode which is integral with the main part of the first electrode, and a first leg part of the resistive element which is integral with the main part of the resistive element. Such devices can be secured to circuit boards in a variety of ways, and to elastically deformed terminals. Preferably preferred devices contain two laminar electrodes, with a PTC element between them, and a cross-conductor which passes through the thickness of the device and contacts one only of the two electrodes.

Abstract: A surface mountable PTC chip comprising a cuboidal body having opposite ends or end surfaces and formed by at least two conductive PTC polymer sheets and top and bottom and at least one intermediate conductive metal foil interlacing with the polymer sheets to form a multi-layered structure. Each top/bottom metal foil is divided by a gap to form a pair of larger and smaller electrodes at opposite positions as compared between top and the bottom body surfaces. The intermediate metal foil extends from one body end surface and reaches short of the opposite end surface to permit integral inter-connection of the polymer sheets. A pair of electrical terminals are located at respective opposite body ends, each of which covers the entire respective body end surface and covers and is in electrical contact with adjoining portions of the larger and smaller electrodes on the top and bottom body surfaces.

Abstract: A direct extrusion process for manufacturing conductive polymer articles of manufacture employs a twin screw compounding extruder that compounds a polymeric mixture from materials received, in predetermined proportions, from gravimetric feeders, then extrudes a compounded conductive polymeric material in the melt phase. The extrudate is then fed into a gear pump that allows the extruder to discharge the compounded material, while it is still in the melt stage, at a relatively low pressure. The gear pump produces a substantially constant volumetric output of the compounded "melt phase" material at sufficiently high pressure for delivery into a sheet die. The sheet die forms the compounded material, while still in the melt phase, into a continuous web.

Abstract: A direct extrusion process for manufacturing conductive polymer articles of manufacture employs a twin screw compounding extruder that compounds a polymeric mixture from materials received, in predetermined proportions, from gravimetric feeders, then extrudes a compounded conductive polymeric material in the melt phase. The extrudate is then fed into a gear pump that allows the extruder to discharge the compounded material, while it is still in the melt stage, at a relatively low pressure. The gear pump produces a substantially constant volumetric output of the compounded "melt phase" material at sufficiently high pressure for delivery into a sheet die. The sheet die forms the compounded material, while still in the melt phase, into a continuous web.

Abstract: A conductive polymer device includes an active element comprising a conductive polymeric layer laminated between a pair of electrodes to which terminal leads are attached. The active element is enclosed in an insulative package. Each of the electrodes may be formed integrally with its associated terminal lead in a single lead frame, with a layer of conductive polymeric material laminated between two such lead frames. Alternatively, a conductive polymeric layer may be laminated between two electrodes, with a terminal lead then being soldered to each electrode. The insulative package for the active element may be either an over-molded housing encasing the active element, or a pre-molded housing having a cavity into which the active element is installed, and which is then hermetically sealed with a suitable sealant material.