Patents by Inventor Mengtao Yuan

Mengtao Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8312402
    Abstract: Systems and methods for modeling a multilayer integrated circuit include three-dimensional interconnect models in multilayered substrates for greater accuracy. Mesh models are used to resolve effects of nearby elements and grid models are used to resolve effects of far-away elements. Sidewall mesh elements of three-dimensional interconnects are projected onto parallel (or substantially parallel) grids between the top and bottom walls of the interconnects so that grid models can be used to resolve three-dimensional effects of interconnects in multilayered substrates.
    Type: Grant
    Filed: April 14, 2009
    Date of Patent: November 13, 2012
    Assignee: Cadence Design Systems, Inc.
    Inventors: Vladimir Okhmatovski, Mengtao Yuan, Rodney Phelps
  • Patent number: 8255849
    Abstract: Systems and methods for modeling a multilayer integrated circuit include three-dimensional interconnect models in multilayered substrates for greater accuracy. Mesh models are used to resolve effects of nearby elements and grid models are used to resolve effects of far-away elements. Sidewall mesh elements of three-dimensional interconnects are projected onto parallel (or substantially parallel) grids between the top and bottom walls of the interconnects so that grid models can be used to resolve three-dimensional effects of interconnects in multilayered substrates.
    Type: Grant
    Filed: April 14, 2009
    Date of Patent: August 28, 2012
    Assignee: Cadence Design Systems, Inc.
    Inventors: Vladimir Okhmatovski, Mengtao Yuan, Rodney Phelps