Patents by Inventor Mengxin Zhao

Mengxin Zhao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130269614
    Abstract: The present invention provides a hot plate and substrate processing equipment using the same, wherein the hot plate comprises a central sub hot plate and at least one outer ring sub hot plate located around the central sub hot plate; thermal insulation parts are provided between the central sub hot plate and the outer ring sub hot plate and between two adjacent outer ring sub hot plates, so that the heat conduction between the adjacent sub hot plates can be effectively prevented or reduced by means of the thermal insulation parts. The hot plate and the substrate processing equipment using the same provided in the present invention can effectively compensate for the heat losses in the edge region of the substrate, so as to keep the heating rate the same in each region of the substrate.
    Type: Application
    Filed: November 23, 2011
    Publication date: October 17, 2013
    Applicant: Beijing NMC Co., Ltd.
    Inventors: Mengxin Zhao, Xu Liu, Peijun Ding, Hougong Wang, Wei Xia, Lihui Wen
  • Publication number: 20130256129
    Abstract: A plasma processing apparatus includes a chamber (20) and a target (25) above the chamber (20). The surface of the target (25) contacts the processing area of the chamber (20). The chamber (20) includes an insulating sub-chamber (21) and a first conductive sub-chamber (22), which are superposed. The first conductive sub-chamber (22) is provided under the insulating sub-chamber (21). The insulating sub-chamber (21) is made of insulating material, and the first conductive sub-chamber (22) is made of metal material. A Faraday shield component (10) which is made of metal material or insulating material electroplated with conductive coatings and includes at least one slit is provided in the insulating sub-chamber (21). An inductance coil (13) surrounds the exterior of the insulating sub-chamber (21). The problem about the wafer contamination due to particles formed on the surface of the coil during the sputtering process can be solved by using the plasma processing apparatus.
    Type: Application
    Filed: December 22, 2010
    Publication date: October 3, 2013
    Applicant: Beijing NMC Co., Ltd.
    Inventors: Peng Chen, Mengxin Zhao, Gang Wei, Liang Zhang, Bai Yang, Guilong Wu, Peijun Ding