Patents by Inventor Mengyang XIAN

Mengyang XIAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220326830
    Abstract: Provided a touch display panel and a touch display device. The touch display panel includes a signal transmission layer, an insulation layer, and a touch layer disposed in stack in a thickness direction of the touch display panel. The insulation layer is provided with insulation openings penetrating therethrough, and the touch layer is electrically connected to the signal transmission layer through the insulation openings. The insulation openings include a first opening close to a side of the signal transmission layer and a second opening close to a side of the touch layer, and an opening area of the first opening is larger than an opening area of the second opening. The touch display panel provided can increase the contact area between the touch layer and the signal transmission layer, ensure reliability and stability of the connection, and improve the process yield and touch performance of the display panel.
    Type: Application
    Filed: June 24, 2022
    Publication date: October 13, 2022
    Applicant: Wuhan Tianma Microelectronics Co., Ltd.
    Inventors: Wanqiu ZHANG, Mengyang XIAN, Xin XIONG, Jiancheng ZHAO
  • Publication number: 20220029140
    Abstract: The present disclosure provides a cutting method of a display module, including: providing a display module to be cut, the display module to be cut including a display panel and a spacing layer on the display panel, and the display panel including a region to be cut, the spacing layer being provided with a first through hole exposing the region to be cut, and the first through hole being provided therein with an encapsulation adhesive; and performing laser cutting on the display module to be cut at a position of the region to be cut so as to remove the region to be cut to form a cutting groove. In the laser cutting, at least part of the encapsulation adhesive is melted and covers a sidewall of the cutting groove.
    Type: Application
    Filed: August 6, 2020
    Publication date: January 27, 2022
    Inventors: Huan WU, Meishan XU, Wanbin LI, Jie XIANG, Ruqin ZHANG, Mengyang XIAN