Abstract: Embodiments of this application disclose a package structure and a communications device to which the package structure is applied. The package structure includes a substrate, a die, and a bonding layer configured to bond the die to the substrate. Charged particles are disposed in the bonding layer. An electrode is disposed on a surface of the die away from the bonding layer. A potential of the electrode is opposite to that of the charged particle. The package structure further includes a first shielding structure. A potential of the substrate is zero. The first shielding structure is located on an outer surface of the die and is located between the bonding layer and the electrode, to prevent the charged particles from migrating to the electrode.

Abstract: A package structure is disclosed, the package structure includes a substrate, a chip, a bonding layer, and a coating. A plurality of grooves are disposed on the substrate. Silver bonding materials are disposed in the grooves and on a surface of the substrate, to form the bonding layer. The chip is connected to the substrate by using the bonding layer. The grooves are symmetrically arranged along a first and a second axis that are perpendicular to each other, a vertical projection of the chip on the substrate is centrosymmetric about the first and the second axis, and the vertical projection of the chip on the substrate covers a partial area of an outer-ring groove which faces a periphery of the chip. The coating covers a surface that is of the bonding layer and not in contact with the substrate or the chip, used to prevent migration of silver ions.

Abstract: A broom and a manufacturing method thereof, the broom comprising at least a broom handle (1) and a broom core; the bottom of the broom handle (1) is provided with a transverse plate (2); the broom core is fixed on the transverse plate (2), and comprises more than one bundle of brushes; the brushes are provided with dispersed slender resilient strips (9) thereon for cleaning the ground; the resilient strips (9) take up more than ½ the length of the brushes; the side surface of the resilient strips (9) is arc-shaped, and tapers from top to bottom; the bottom end of the resilient strips (9) is a thickened layer.

Abstract: A broom and a manufacturing method thereof, the broom comprising at least a broom handle (1) and a broom core; the bottom of the broom handle (1) is provided with a transverse plate (2; the broom core is fixed on the transverse plate (2), and comprises more than one bundle of brushes; the brushes are provided with dispersed slender resilient strips (9) thereon for cleaning the ground; the resilient strips (9) take up more than ½ the length of the brushes; the side surface of the resilient strips (9) is arc-shaped, and tapers from top to bottom; the bottom end of the resilient strips (9) is a thickened layer.