Abstract: Disclosed embodiments concern histochemical process compositions comprising at least one nanoparticle in an amount effective to reduce or substantially eliminate the average number of spots per slide that result from a sample staining protocol. The nanoparticle can be any of various nanoparticles, or combinations thereof, including metals, metal alloys, metal oxides, ceramics, functionalized metals or metalloids, and other miscellaneous nanoparticles, such as carbon nanoparticles and diamond nanoparticles. Typically, the nanoparticle concentration is from greater than zero to at least about 25 parts per million, more typically from about 2 parts per million to about 20 parts per million. Embodiments of a method for using process nanosolutions also are disclosed. One embodiment concerns applying a histochemical process composition to a sample, followed by performing a staining protocol on the sample.

Abstract: Disclosed embodiments concern histochemical process compositions comprising at least one nanoparticle in an amount effective to reduce or substantially eliminate the average number of spots per slide that result from a sample staining protocol. The nanoparticle can be any of various nanoparticles, or combinations thereof, including metals, metal alloys, metal oxides, ceramics, functionalized metals or metalloids, and other miscellaneous nanoparticles, such as carbon nanoparticles and diamond nanoparticles. Typically, the nanoparticle concentration is from greater than zero to at least about 25 parts per million, more typically from about 2 parts per million to about 20 parts per million. Embodiments of a method for using process nanosolutions also are disclosed. One embodiment concerns applying a histochemical process composition to a sample, followed by performing a staining protocol on the sample.

Abstract: Histochemical process compositions comprising at least one nanoparticle in an amount effective to reduce or substantially eliminate the average number of spots per slide that result from a sample staining protocol are disclosed. Various nanoparticles, or combinations thereof, including metals, metal alloys, metal oxides, ceramics, functionalized metals or metalloids, and other miscellaneous nanoparticles, such as carbon nanoparticles and diamond nanoparticles, can be used. The nanoparticle concentration typically is from about 2 parts per million to about 20 parts per million. One embodiment of a disclosed method concerns applying a histochemical process composition to a sample, followed by performing a staining protocol on the sample. Particular embodiments concern dispensing a nanosolution onto a sample using an automated system, heating the sample, and performing a sample staining process.

Abstract: Histochemical process compositions comprising at least one nanoparticle in an amount effective to reduce or substantially eliminate the average number of spots per slide that result from a sample staining protocol are disclosed. Various nanoparticles, or combinations thereof, including metals, metal alloys, metal oxides, ceramics, functionalized metals or metalloids, and other miscellaneous nanoparticles, such as carbon nanoparticles and diamond nanoparticles, can be used. The nanoparticle concentration typically is from about 2 parts per million to about 20 parts per million. One embodiment of a disclosed method concerns applying a histochemical process composition to a sample, followed by performing a staining protocol on the sample. Particular embodiments concern dispensing a nanosolution onto a sample using an automated system, heating the sample, and performing a sample staining process.

Abstract: An electrical component includes a conductive substrate, a tin layer formed on the substrate, and a barrier coating formed on the tin layer to impede tin whisker growth. The barrier coating includes a polymer matrix, and abrasive particles that are dispersed about the matrix.

Abstract: An electrical component includes a conductive substrate, a tin layer formed on the substrate, and a barrier coating formed on the tin layer to impede tin whisker growth. The barrier coating includes a polymer matrix, and abrasive particles that are dispersed about the matrix.

Abstract: An electrical component includes a conductive substrate, a tin layer formed on the substrate, and a barrier coating formed on the tin layer to impede tin whisker growth. The barrier coating includes a polymer matrix, and abrasive particles that are dispersed about the matrix.

Abstract: A passive thermal switch assembly simply, easily, and inexpensively controls electronic system component temperatures within normal operating ranges during normal system operations, and reduces heat dissipation from the system during a cold startup, to thereby enable a relatively rapid component temperature rise. The passive thermal switch includes a heat pipe and a thermally activated switch coupled to the condenser end of the heat pipe. The switch thermally couples and decouples the heat pipe from a heat sink based on the temperature of a contact within the switch.