Abstract: Apparatus for mounting an impedance bond or other device between a pair of spaced, concrete railroad ties employs a clamping plate which overlies and spans the ties, and a pair of clamping feet that are installed between the ties. Components interconnecting the plate and the feet draw the plate and feet toward one another to securely clamp the ties therebetween. The device to be mounted between the ties is secured to the undersurface of the plate and is thus held in a fixed position in the space between the ties. The spacing between the feet may be varied to accommodate different tie spacings, and the entire installation is accomplished without embedding fasteners in the concrete tie material.