Patents by Inventor Merwin M. Brown

Merwin M. Brown has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Per chiplet thermal control in a disaggregated multi-chiplet system
    Patent number: 11175709
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a plurality of chiplets, a plurality of resources, a system thermal engine, and at least one processor. The at least one processor is configured to cause the system thermal engine to monitor the plurality of chiplets, where the plurality of chiplets are part of a multi-chip module, determine that a first chiplet from the plurality of chiplets has reached a threshold temperature, and reduce power to the first chiplet without reducing power to the other chiplets in the plurality of chiplets.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: November 16, 2021
    Assignee: Intel Corporation
    Inventors: Amit Kumar Jain, Sameer Shekhar, Mark Carbone, Merwin M. Brown
  • PER CHIPLET THERMAL CONTROL IN A DISAGGREGATED MULTI-CHIPLET SYSTEM
    Publication number: 20190384367
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a plurality of chiplets, a plurality of resources, a system thermal engine, and at least one processor. The at least one processor is configured to cause the system thermal engine to monitor the plurality of chiplets, where the plurality of chiplets are part of a multi-chip module, determine that a first chiplet from the plurality of chiplets has reached a threshold temperature, and reduce power to the first chiplet without reducing power to the other chiplets in the plurality of chiplets.
    Type: Application
    Filed: August 26, 2019
    Publication date: December 19, 2019
    Applicant: Intel Corporation
    Inventors: Amit Kumar Jain, Sameer Shekhar, Mark Carbone, Merwin M. Brown
  • THERMAL MANAGEMENT FOR ELECTRONIC DEVICE
    Publication number: 20140168874
    Abstract: In one embodiment an assembly comprises a keyboard tray comprising a first side having a plurality of keys and a second side opposite the first side and a planar heat spreader to be in thermal communication with the second side of the keyboard tray. Other embodiments may be described.
    Type: Application
    Filed: December 19, 2012
    Publication date: June 19, 2014
    Inventors: Mark MacDonald, Carin L. Ruiz, Merwin M. Brown