Patents by Inventor Meta Rohde
Meta Rohde has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7612296Abstract: A printed circuit board having one or more vias disposed in the surface area of a pad. The pad may serve as a connection point between the printed circuit board and another circuit board and is disposed along the edge of the board such that the vias do not form half vias.Type: GrantFiled: August 31, 2005Date of Patent: November 3, 2009Assignee: Synergy Microwave CorporationInventors: Meta Rohde, Ajay Kumar Poddar, Klaus Juergen Schoepf, Reimund Rebel
-
Publication number: 20060042831Abstract: A printed circuit board having one or more vias disposed in the surface area of a pad. The pad may serve as a connection point between the printed circuit board and another circuit board and is disposed along the edge of the board such that the vias do not form half vias.Type: ApplicationFiled: August 31, 2005Publication date: March 2, 2006Applicant: Synergy Microwave CorporationInventors: Meta Rohde, Klaus Schoepf, Ajay Poddar, Reimund Rebel
-
Patent number: 6917265Abstract: A microwave frequency device includes: a first substrate having a dielectric layer and a conductive film disposed on opposing first and second sides of the dielectric layer, the conductive film on the first side of the dielectric layer of the first substrate including at least one signal line; and a second substrate having a dielectric layer, conductive film disposed on at least one of first and second opposing sides of the dielectric layer, and at least one cut-out where the dielectric layer and conductive film have been removed, wherein the first and second substrates are bonded together to form a bonded assembly such that (i) a portion of the signal line of the first substrate is sandwiched between the dielectric layers of the first and second substrates, and (ii) the at least one cut-out exposes a portion of the signal line, thereby forming a microstrip portion. A method of forming same is also disclosed.Type: GrantFiled: May 22, 2003Date of Patent: July 12, 2005Assignee: Synergy Microwave CorporationInventors: Antonio Almeida, Shankar Joshi, Meta Rohde, Mahadevan Sridharan
-
Publication number: 20040233024Abstract: A microwave frequency device includes: a first substrate having a dielectric layer and a conductive film disposed on opposing first and second sides of the dielectric layer, the conductive film on the first side of the dielectric layer of the first substrate including at least one signal line; and a second substrate having a dielectric layer, conductive film disposed on at least one of first and second opposing sides of the dielectric layer, and at least one cut-out where the dielectric layer and conductive film have been removed, wherein the first and second substrates are bonded together to form a bonded assembly such that (i) a portion of the signal line of the first substrate is sandwiched between the dielectric layers of the first and second substrates, and (ii) the at least one cut-out exposes a portion of the signal line, thereby forming a microstrip portion. A method of forming same is also disclosed.Type: ApplicationFiled: May 22, 2003Publication date: November 25, 2004Inventors: Antonio Almeida, Shankar Joshi, Meta Rohde, Mahadevan Sridharan
-
Patent number: 5805431Abstract: A surface mount package particularly suitable for transformers and other components having numerous windings of fragile, difficult to handle wire has a housing which includes openings along the lower edge, the housing being plated with an electrically conductive material on portions of the lower edge and in areas surrounding the opening. A component is held within the housing, and the leads of the component are disposed in the openings at a point above the lower edge of the housing, and the leads are electrically connected to the plating surrounding the openings and the plating at the flat portions of the lower edge. The plating on the flat portions of the lower edge can be at any suitable location, i.e., remote from or adjacent to the openings. Additional components can be stacked on the exterior of the housing, as connected to the plating surrounding the openings.Type: GrantFiled: January 17, 1996Date of Patent: September 8, 1998Assignee: Synergy Microwave CorporationInventors: Shankar R. Joshi, Meta Rohde
-
Patent number: 5390349Abstract: A manner of using a plurality of transformers having cylindrical cores such that operation of the transformers at high frequencies allows the cores of the transformers to be disposed parallel to each other and in relatively close proximity without substantial interference.Type: GrantFiled: August 26, 1992Date of Patent: February 14, 1995Assignee: Synergy Microwave CorporationInventors: Shankar R. Joshi, Meta Rohde
-
Patent number: 5381084Abstract: A mass of dielectric material intimately surrounds a high frequency circuit having plural transformers in relative close proximity to one anther and provides mechanical stability and electrical protection to the circuit. The mass of dielectric material surrounding the circuit has a dielectric constant less than about 2.6 and a loss tangent less than about 0.009.Type: GrantFiled: January 12, 1993Date of Patent: January 10, 1995Assignee: Synergy Microwave CorporationInventors: Shankar R. Joshi, Meta Rohde
-
Patent number: 5160810Abstract: A hermetically sealed surface mount electronic component package can be manufactured by converting standard, readily available flat-packs. The package has a base, with an opening through which a primary transmission lead extends, a glass-to-metal seal surrounding the transmission lead in the opening, and a secondary transmission lead extends from the primary transmission lead so that it is spaced from the base and its end is at least flush with the bottom of the base. An insulator can be provided between the primary transmission lead and the secondary transmission lead. A method of converting a standard flat-pack by providing a composite piece having a dielectric insulator, a secondary transmission lead for connection to the transmission lead of the flat-pack, and a connecting member for connecting the insulator and secondary transmission lead to the base of the flat-pack is also described.Type: GrantFiled: January 21, 1992Date of Patent: November 3, 1992Assignee: Synergy Microwave CorporationInventors: Meta Rohde, Shankar R. Joshi
-
Patent number: 5122621Abstract: A hermetically sealed surface mount electronic component package can be manufactured by converting standard, readily available flat-packs. The package has a base, with an opening through which a primary transmission lead extends, a glass-to-metal seal surrounding the transmission lead in the opening, and a secondary transmission lead extends from the primary transmission lead so that it is spaced from the base and its end is at least flush with the bottom of the base. An insulator can be provided between the primary transmission lead and the secondary transmission lead. A method of converting a standard flat-pack by providing a composite piece having a dielectric insulator, a secondary transmission lead for connection to the transmission lead of the flat-pack, and a connecting member for connecting the insulator and secondary transmission lead to the base of the flat-pack is also described.Type: GrantFiled: May 7, 1990Date of Patent: June 16, 1992Assignee: Synergy Microwave CorporationInventors: Meta Rohde, Shankar R. Joshi