Patents by Inventor Mexx Chen

Mexx Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8102323
    Abstract: An antenna arrangement implemented within a printed circuit board (PCB) having three metal coplanar layers, for use in multiple input multiple output (MIMO) communication systems. The antenna arrangement comprises a first dipole antenna and second dipole antenna, substantially symmetrical to the first dipole antenna a slot antenna positioned substantially between the first and the second dipole antennas. The antenna arrangement is implemented in three coplanar metal layers. The antennas are used for MIMO communication systems, specifically complying with IEEE 802.11n and are shaped such that their combined radiation pattern exhibits a substantially omni-directional radiation pattern.
    Type: Grant
    Filed: August 12, 2010
    Date of Patent: January 24, 2012
    Assignee: Lantiq Deutschland GmbH
    Inventor: Mexx Chen
  • Publication number: 20100302115
    Abstract: An antenna arrangement implemented within a printed circuit board (PCB) having three metal co planar layers, for use in multiple input multiple output (MIMO) communication systems. The antenna arrangement comprises a first dipole antenna and second dipole antenna, substantially symmetrical to the first dipole antenna a slot antenna positioned substantially between the first and the second dipole antennas. The antenna arrangement is implemented in three coplanar metal layers. The antennas are used for MIMO communication systems, specifically complying with IEEE 802.11n and are shaped such that their combined radiation pattern exhibits a substantially omni-directional radiation pattern.
    Type: Application
    Filed: August 12, 2010
    Publication date: December 2, 2010
    Inventor: Mexx CHEN
  • Patent number: 7786942
    Abstract: An antenna arrangement implemented within a printed circuit board (PCB) having three metal co planar layers, for use in multiple input multiple output (MIMO) communication systems. The antenna arrangement comprises a first dipole antenna and second dipole antenna, substantially symmetrical to the first dipole antenna a slot antenna positioned substantially between the first and the second dipole antennas. The antenna arrangement is implemented in three coplanar metal layers. The antennas are used for MIMO communication systems, specifically complying with IEEE 802.11n and are shaped such that their combined radiation pattern exhibits a substantially omni directional radiation pattern.
    Type: Grant
    Filed: January 4, 2008
    Date of Patent: August 31, 2010
    Inventor: Mexx Chen
  • Publication number: 20090174617
    Abstract: An antenna arrangement implemented within a printed circuit board (PCB) having three metal co planar layers, for use in multiple input multiple output (MIMO) communication systems. The antenna arrangement comprises a first dipole antenna and second dipole antenna, substantially symmetrical to the first dipole antenna a slot antenna positioned substantially between the first and the second dipole antennas. The antenna arrangement is implemented in three coplanar metal layers. The antennas are used for MIMO communication systems, specifically complying with IEEE 802.11n and are shaped such that their combined radiation pattern exhibits a substantially omni directional radiation pattern.
    Type: Application
    Filed: January 4, 2008
    Publication date: July 9, 2009
    Inventor: Mexx CHEN