Patents by Inventor Mi-Cheng Cheng

Mi-Cheng Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structure and electronic device using the same
    Patent number: 7812433
    Abstract: A package structure and an electronic device using the same are provided. The package structure includes a chip module and a cover. The chip module covered by the cover is used for receiving a first signal. The chip module includes a substrate, a heat sink and a first chip. The substrate has a first surface, a second surface and an opening. The first surface is opposite to the second surface. The opening penetrates the first surface and the second surface. The heat sink is disposed on the first surface of the substrate and covers the opening. The first chip is disposed on the heat sink and is positioned inside the opening. A bottom surface of the first chip flatly contacts the heat sink. The cover has a window element. The first signal passes through the window element to contact with the chip module.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: October 12, 2010
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Mi-Cheng Cheng, Kuo-Hua Chen
  • Package structure and electronic device using the same
    Publication number: 20080290489
    Abstract: A package structure and an electronic device using the same are provided. The package structure includes a chip module and a cover. The chip module covered by the cover is used for receiving a first signal. The chip module includes a substrate, a heat sink and a first chip. The substrate has a first surface, a second surface and an opening. The first surface is opposite to the second surface. The opening penetrates the first surface and the second surface. The heat sink is disposed on the first surface of the substrate and covers the opening. The first chip is disposed on the heat sink and is positioned inside the opening. A bottom surface of the first chip flatly contacts the heat sink. The cover has a window element. The first signal passes through the window element to contact with the chip module.
    Type: Application
    Filed: March 27, 2008
    Publication date: November 27, 2008
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Mi-Cheng Cheng, Kuo-Hua Chen