Abstract: A printed circuit board includes: a first metal layer; an organic insulating layer covering at least a portion of the first metal layer and having a via hole exposing at least a portion of an upper surface of the first metal layer; a first seed metal layer disposed on an upper surface of the organic insulating layer; a second seed metal layer disposed on the first seed metal layer and extending onto a wall surface of the via hole and the exposed upper surface of the first metal layer; and a second metal layer disposed on the second seed metal layer and filling at least a portion of the via hole, wherein the first seed metal layer includes a first sputtering layer including titanium (Ti), and the second seed metal layer includes an electroless plating layer.

Abstract: A coil component includes a body having a first surface and a second surface opposing each other in a first direction, a support member disposed in the body, the support member having a first surface and a second surface opposing each other, a coil disposed on the support member, a pad portion disposed on the first surface of the support member to be connected to the coil, an external electrode disposed on the first surface of the body, and a via electrode connecting the pad portion and the external electrode to each other.

Abstract: A coil component includes a body including magnetic metal powder particles and an insulating resin; a coil portion embedded in the body; and first and second external electrodes respectively disposed on the body to be spaced apart from each other and respectively connected to both end portions of the coil portion. A magnetic metal powder particle exposed from a surface of the body, among the magnetic metal powder particles, has a plating prevention film formed on at least a portion of a surface thereof and containing metal ions of the exposed magnetic metal powder particle.

Abstract: A coil component includes: a body including a coil unit disposed therein, and having first and second surfaces opposing each other with lead-out portions of the coil unit extending thereto, respectively, and fifth and sixth surfaces connected to the first and second surfaces and opposing each other; a first external electrode, and including a first connection portion covering the first surface of the body and a first pad portion covering the sixth surface of the body, the first pad portion having a smaller width than the first connection portion; a second external electrode, and including a second connection portion covering the second surface of the body and a second pad portion covering the sixth surface of the body, the second pad portion having a smaller width than the second connection portion; and an insulating layer covering the first and second connection portions.

Abstract: A coil component includes: a body having first and second surfaces opposing each other in a first direction, and third and fourth surfaces connecting the first and second surfaces to each other and opposing each other in a second direction; a substrate disposed in the body; a coil unit disposed on the substrate, and including a coil pattern, lead-out portions connected to the coil pattern and contacting the first surface of the body while being spaced apart from the third and fourth surfaces of the body, respectively, and sub lead-out portions spaced apart from the coil pattern; and external electrodes disposed on the first surface of the body and connected to the lead-out portions, respectively, wherein each of the sub lead-out portions occupies a smaller volume within the body than each of the lead-out portions.

Abstract: A coil component includes: a body containing magnetic metal particles and an insulating resin; a coil portion disposed in the body; and first and second external electrodes disposed on the body while being spaced apart from each other and connected to opposite end portions of the coil portion, respectively, wherein a surface of the body has first and second regions in which the first and second external electrodes are disposed, respectively, and a third region in which the first and second external electrodes are not disposed, some of the magnetic metal particles are exposed to the third region of the body, and a monomolecular organic material having a hydrophobic portion is disposed at an exposed surface of the magnetic metal particle exposed to the third region of the body.

Abstract: A coil component including: a body; a coil portion including first and second lead-out terminals and disposed in the body; an insulating film disposed between the coil portion and the body and containing a thermosetting resin having a vinyl group; and an external electrode portion disposed on the body and connected to each of the first and second lead-out terminals of the coil portion.

Abstract: A chip inductor includes a body having a coil and an insulating member on which the coil is disposed, and external electrodes disposed on external surfaces of the body. The insulating layers are disposed on one surface of the insulating member in the body and another surface opposing the one surface, respectively, and are made of a material different from a material of the insulating member. The insulating member and the insulating layers constitute a multilayer structure. The coil includes a top coil and a bottom coil disposed on a top surface and a bottom surface of the multilayer structure, respectively. The top and bottom coils are connected by a via penetrating through the top and bottom surfaces of the multilayer structure.

Abstract: A multilayered capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. Each of the external electrodes includes a conductive layer formed on the capacitor body and connected to the internal electrodes; an inner plated layer including nickel (Ni) and phosphorus (P), and covering the conductive layer; and an outer plated layer including palladium (Pd) and phosphorus (P), and covering the inner plated layer.

Abstract: A coil component includes a body including a magnetic metal powder; an internal insulating layer buried in the body; an internal coil portion disposed on the internal insulating layer, and having turns of which cross-sectional areas increase towards the internal insulating layer from externally of the internal insulating layer; an external insulating layer covering the internal coil portion; an external coil portion disposed on the external insulating layer, and having a greater number of turns than a number of turns of the internal coil portion; a connection via penetrating through the external insulating layer and connecting the internal coil portion and the external coil portion; and an insulating film surrounding the internal insulating layer, the internal coil portion, the external insulating layer, and the external coil portion.

Abstract: A coil component includes: a body in which a coil part is embedded, wherein the coil part includes: a support member; a pattern wall disposed on the support member; and a coil pattern extending between the pattern walls on the support member and including a plurality of winding turns. A width of an intermediate winding turn between innermost and outermost winding turns, among the plurality of winding turns of the coil pattern, is larger than widths of the innermost and outermost winding turns.

Abstract: An inductor includes a body including a support member, a coil, and an encapsulant encapsulating the support member and the coil and external electrodes disposed on an external surface of the body and connected to the coil, wherein the support member includes a through-hole and a via hole spaced apart from the through-hole, the coil includes a first coil disposed on one surface of the support member and a second coil disposed on the other surface of the support member opposing the one surface, the first and second coils are connected to each other by a via filling the via hole, and the via continuously covers an end surface of the first coil and an upper surface of the second coil.

Abstract: A multilayered capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. Each of the external electrodes includes a conductive layer formed on the capacitor body and connected to the internal electrodes; an inner plated layer including nickel (Ni) and phosphorus (P), and covering the conductive layer; and an outer plated layer including palladium (Pd) and phosphorus (P), and covering the inner plated layer.

Abstract: A multilayered capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. Each of the external electrodes includes a conductive layer formed on the capacitor body and connected to the internal electrodes; an inner plated layer including nickel (Ni) and phosphorus (P), and covering the conductive layer; and an outer plated layer including palladium (Pd) and phosphorus (P), and covering the inner plated layer.

Abstract: A coil component includes a body including a coil, and an external electrode disposed on an external surface of the body and connected to the coil, wherein the body includes a support member supporting the coil and including a through-hole and a via hole spaced apart from the through-hole, the coil includes a coil body and a lead portion connecting the coil body and the external electrode to each other, and a support thin film layer is interposed between one surface of the support member and one surface of the lead portion facing the one surface.

Abstract: An inductor includes a body and first and second external electrodes disposed on an external surface of the body. The body includes a support member, a first coil disposed on an upper surface of the support member, and a second coil disposed on the first coil. One end of the first coil is connected to a first connection portion directly connected to a first external electrode and one end of the second coil is connected to a second connection portion directly connected to a second external electrode.

Abstract: A multilayered capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. Each of the external electrodes includes a conductive layer formed on the capacitor body and connected to the internal electrodes; an inner plated layer including nickel (Ni) and phosphorus (P), and covering the conductive layer; and an outer plated layer including palladium (Pd) and phosphorus (P), and covering the inner plated layer.

Abstract: A coil component includes a body including magnetic metal powder particles and an insulating resin; a coil portion embedded in the body; and first and second external electrodes respectively disposed on the body to be spaced apart from each other and respectively connected to both end portions of the coil portion. A magnetic metal powder particle exposed from a surface of the body, among the magnetic metal powder particles, has a plating prevention film formed on at least a portion of a surface thereof and containing metal ions of the exposed magnetic metal powder particle.

Abstract: A coil component includes a body including a magnetic metal powder; an internal insulating layer buried in the body; an internal coil portion disposed on the internal insulating layer, and having turns of which cross-sectional areas increase towards the internal insulating layer from externally of the internal insulating layer; an external insulating layer covering the internal coil portion; an external coil portion disposed on the external insulating layer, and having a greater number of turns than a number of turns of the internal coil portion; a connection via penetrating through the external insulating layer and connecting the internal coil portion and the external coil portion; and an insulating film surrounding the internal insulating layer, the internal coil portion, the external insulating layer, and the external coil portion.

Abstract: A chip inductor includes a body having a coil and an insulating member on which the coil is disposed, and external electrodes disposed on external surfaces of the body. The insulating layers are disposed on one surface of the insulating member in the body and another surface opposing the one surface, respectively, and are made of a material different from a material of the insulating member. The insulating member and the insulating layers constitute a multilayer structure. The coil includes a top coil and a bottom coil disposed on a top surface and a bottom surface of the multilayer structure, respectively. The top and bottom coils are connected by a via penetrating through the top and bottom surfaces of the multilayer structure.