Abstract: Disclosed herein are a microorganism with excellent deacetoxycephalosporin C (DAOC) productivity and a use thereof. A mutant microorganism with improved DAOC productivity and a use thereof for producing 7-aminodeacetoxycephalosporanic acid (7-ADCA) are provided.

Abstract: The present invention provides a functional peptide having excellent antioxidant activity, the peptide having excellent biocompatibility and significantly better antioxidant activity than conventional GSHs in order to overcome the limitation of the weak antioxidant activity of existing peptides. The peptide of the present invention can promote antioxidant activity or effectively repair biological tissue or cell damage caused by reactive oxygen species generated due to oxidative stress. Therefore, the peptide having such antioxidant activity effectively acts on cell damage caused by oxidative stress, and can thus be used to prevent and repair cell damage.

Abstract: Provided is a method of patterning a catalyst using nano imprint lithography. The method includes slurrying a catalyst, preparing a stamp for forming a catalyst pattern, forming the catalyst pattern by coating a substrate with the catalyst slurry, imprinting the stamp on the catalyst slurry and performing patterning simultaneously with calcination through nano imprint lithography, and drying the patterned catalyst. As the catalyst pattern is formed through the nano imprint lithography, a surface area of the catalyst increases and it is easy to pattern the catalyst according to the shape of the stamp.

Abstract: Provided are a method of manufacturing nanoelectrode lines. The method includes the steps of: sequentially forming an insulating layer, a first photoresist layer, and a drop-shaped second photoresist on a substrate; disposing an imprint mold having a plurality of molding patterns over the second photoresist; applying pressure to the mold to allow the second photoresist to flow into the mold patterns; irradiating ultraviolet (UV) light onto the mold to cure the second photoresist; removing the mold from the cured second photoresist and patterning the second photoresist; patterning the first photoresist layer using the patterned second photoresist as a mask; patterning the insulating layer; and forming a metal layer between the patterned insulating layers. In this method, metal electrode lines are formed between insulating layers using an imprint lithography process, so that nanoelectronic devices can be freed from crosstalk between the metal electrode lines.

Abstract: Provided is a method of patterning a catalyst using nano imprint lithography. The method includes slurrying a catalyst, preparing a stamp for forming a catalyst pattern, forming the catalyst pattern by coating a substrate with the catalyst slurry, imprinting the stamp on the catalyst slurry and performing patterning simultaneously with calcination through nano imprint lithography, and drying the patterned catalyst. As the catalyst pattern is formed through the nano imprint lithography, a surface area of the catalyst increases and it is easy to pattern the catalyst according to the shape of the stamp.

Abstract: Provided are a method of manufacturing nanoelectrode lines. The method includes the steps of: sequentially forming an insulating layer, a first photoresist layer, and a drop-shaped second photoresist on a substrate; disposing an imprint mold having a plurality of molding patterns over the second photoresist; applying pressure to the mold to allow the second photoresist to flow into the mold patterns; irradiating ultraviolet (UV) light onto the mold to cure the second photoresist; removing the mold from the cured second photoresist and patterning the second photoresist; patterning the first photoresist layer using the patterned second photoresist as a mask; patterning the insulating layer; and forming a metal layer between the patterned insulating layers. In this method, metal electrode lines are formed between insulating layers using an imprint lithography process, so that nanoelectronic devices can be freed from crosstalk between the metal electrode lines.