Patents by Inventor Mi Jeong JEON

Mi Jeong JEON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230337367
    Abstract: A method of manufacturing a printed circuit board includes: forming first and second resist films, respectively having first and second openings exposing a first metal layer disposed on one surface of an insulating layer; forming a second metal layer on the first metal layer, exposed through the first and second openings, to fill at least a portion of each of the first and second openings; and removing the first and second resist films. The first and second openings have different widths in a cross-section.
    Type: Application
    Filed: July 20, 2022
    Publication date: October 19, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Mi Jeong JEON, Tae Hee YOO, Hyun Seok YANG, In Jae CHUNG
  • Publication number: 20220386473
    Abstract: A method of manufacturing a printed circuit board includes: forming a resist layer; exposing first areas of the resist layer spaced apart from each other; after exposing the first areas, exposing second areas of the resist layer, the second areas being spaces between the first areas; forming first and second openings spaced apart from each other in the first and second areas by developing the resist layer; and forming a plurality of conductor patterns by filling the first and second openings with conductors.
    Type: Application
    Filed: March 1, 2022
    Publication date: December 1, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Jin Park, Jong Eun Park, Hyun Seok Yang, Sangik Cho, Hiroki Okada, Young Ook Cho, Mi Jeong Jeon, In Jae Chung
  • Publication number: 20220217842
    Abstract: A printed circuit board includes a first insulating layer, a metal layer disposed on one surface of the first insulating layer, a first circuit layer disposed inside the first insulating layer and having one surface exposed to the one surface of the first insulating layer so as to be in contact with one surface of the metal layer, a second circuit layer in contact with the other surface of the metal layer, and a second insulating layer disposed on the one surface of the first insulating layer to cover the metal layer and the second circuit layer. The first and second circuit layers respectively include a metal different from the metal layer.
    Type: Application
    Filed: October 14, 2021
    Publication date: July 7, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Jin Park, Young Ook Cho, Hyun Seok Yang, Ki Joo Sim, Won Seok Lee, Mi Jeong Jeon
  • Patent number: 10596960
    Abstract: The present invention relates to a transparent member for an automotive interior part. In one embodiment, the transparent member for the automotive interior part includes: a light source; an optical pattern layer formed over the light source; and a first light-transmitting skin layer formed on the optical pattern layer and including about 1 part by weight to about 25 parts of a first inorganic filler dispersed in 100 parts by weight of a first transparent resin matrix, wherein the first inorganic filler includes spherical calcium carbonate (CaCO3).
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: March 24, 2020
    Assignees: HYUDAI MOBIS CO., LTD., DAEWON CHEMICAL CO., LTD.
    Inventors: Sang Phil Park, Hyeon Don Kim, Jung Hwan Lee, Young Kyu Rhim, Mi Jeong Jeon
  • Publication number: 20190161003
    Abstract: The present invention relates to a transparent member for an automotive interior part. In one embodiment, the transparent member for the automotive interior part includes: a light source; an optical pattern layer formed over the light source; and a first light-transmitting skin layer formed on the optical pattern layer and including about 1 part by weight to about 25 parts of a first inorganic filler dispersed in 100 parts by weight of a first transparent resin matrix, wherein the first inorganic filler includes spherical calcium carbonate (CaCO3).
    Type: Application
    Filed: June 29, 2018
    Publication date: May 30, 2019
    Inventors: Sang Phil PARK, Hyeon Don KIM, Jung Hwan LEE, Young Kyu RHIM, Mi Jeong JEON