Patents by Inventor Mi Jeong Yun
Mi Jeong Yun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240121375Abstract: The present disclosure relates to a stereoscopic surface display device, and more particularly, to a stereoscopic surface display device including: a light source unit including a plurality of optical elements; and a stereoscopic display unit disposed on the light source unit. The stereoscopic display unit includes: a polymer layer; and a light absorption layer buried in the polymer layer. The stereoscopic display unit includes a plurality of cell areas arranged in two-dimension, the light absorption layer is disposed in the plurality of cell areas, the plurality of optical elements vertically overlap the plurality of cell areas, respectively, and each of the plurality of cell areas has a stereoscopic shape.Type: ApplicationFiled: October 6, 2023Publication date: April 11, 2024Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Sung Ryul YUN, Seongcheol MUN, Inwook HWANG, Mi Jeong CHOI
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Patent number: 11921929Abstract: Provided is a stereoscopic surface display device including a stereoscopic display unit having a cell area, wherein the stereoscopic display unit includes a first flexible layer, a first optical waveguide and a first optical output unit in the first flexible layer, wherein the first optical output unit are disposed in the cell area, a first light source disposed on a side of the stereoscopic display unit, wherein the first optical waveguide connects the first light source and the first optical output unit, a first photothermal response layer on the first flexible layer, wherein the first photothermal response layer is configured to receive output light emitted from the first optical output unit and emit thermal energy, and a shape deformation layer on the first photothermal response layer, wherein the shape deformation layer is configured to generate bending deformation by receiving the thermal energy from the first photothermal response layer.Type: GrantFiled: February 7, 2023Date of Patent: March 5, 2024Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Sung Ryul Yun, Seung Koo Park, Inwook Hwang, Seongcheol Mun, Mi Jeong Choi
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Patent number: 11631791Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.Type: GrantFiled: March 29, 2021Date of Patent: April 18, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi Jeong Yun, Jong Sup Song
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Publication number: 20210217933Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.Type: ApplicationFiled: March 29, 2021Publication date: July 15, 2021Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi Jeong YUN, Jong Sup SONG
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Patent number: 10964854Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.Type: GrantFiled: September 14, 2020Date of Patent: March 30, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi Jeong Yun, Jong Sup Song
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Publication number: 20200411732Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.Type: ApplicationFiled: September 14, 2020Publication date: December 31, 2020Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi Jeong YUN, Jong Sup Song
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Patent number: 10777712Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.Type: GrantFiled: August 22, 2018Date of Patent: September 15, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi Jeong Yun, Jong Sup Song
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Publication number: 20180366621Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.Type: ApplicationFiled: August 22, 2018Publication date: December 20, 2018Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi Jeong YUN, Jong Sup SONG
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Patent number: 10084118Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.Type: GrantFiled: December 31, 2015Date of Patent: September 25, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi Jeong Yun, Jong Sup Song
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Patent number: 9680074Abstract: An optical device may include a first surface having a shape of a quadrangle; and a second surface disposed to be opposite to the first surface and comprising a convex curved surface. The optical device has an aspherical shape in a cross-section taken along a diagonal direction of the quadrangle and has a semicircular shape in a cross-section taken along a direction connecting a central portion of a first side of the quadrangle and a central portion of a second side opposite to the first side of the quadrangle. In a cross-sectional view of the optical device, the second surface is continuously varied between the semicircular shape of the cross-section and the aspherical shape of the cross-section.Type: GrantFiled: March 2, 2016Date of Patent: June 13, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji Hoon Yun, Jong Sup Song, Soo Hwan Lee, Saesil Kim, Mi Jeong Yun
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Patent number: 9594207Abstract: A light emitting diode (LED) package includes: a main body mounted on a substrate; a light emitting diode that is mounted in the main body and emits light; and a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted. A backlight unit includes: a light guide plate configured to allow a light source to proceed to a liquid crystal panel; a light emitting diode (LED) mounted in a main body mounted on a substrate and generating a light source; and an LED package having a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted, and being mounted on the light guide plate.Type: GrantFiled: March 25, 2015Date of Patent: March 14, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Geun-Young Kim, Tomohisa Onishi, Jung-Hun Lee, Young-Taek Kim, Jong-Jin Park, Mi-Jeong Yun, Young-Sam Park, Hun-Joo Hahm, Hyung-Suk Kim, Seong-Yeon Han, Do-Hun Kim, Dae-Yeon Kim, Dae-Hyun Kim, Jung-Kyu Park
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Patent number: 9548426Abstract: A semiconductor light-emitting device includes a light-emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, and a selective transmission-reflection layer disposed on the light-emitting structure and including a plurality of dielectric layers having different optical thicknesses alternately stacked at least once. The sum of an optical thickness of a dielectric layer having a maximum optical thickness and an optical thickness of a dielectric layer having a minimum optical thickness is in the range of 0.75 to 0.80.Type: GrantFiled: May 22, 2015Date of Patent: January 17, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Myeong Ha Kim, Chan Mook Lim, Masaaki Sofue, Sang Yeob Song, Mi Jeong Yun
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Publication number: 20160380169Abstract: An optical device may include a first surface having a shape of a quadrangle; and a second surface disposed to be opposite to the first surface and comprising a convex curved surface. The optical device has an aspherical shape in a cross-section taken along a diagonal direction of the quadrangle and has a semicircular shape in a cross-section taken along a direction connecting a central portion of a first side of the quadrangle and a central portion of a second side opposite to the first side of the quadrangle. In a cross-sectional view of the optical device, the second surface is continuously varied between the semicircular shape of the cross-section and the aspherical shape of the cross-section.Type: ApplicationFiled: March 2, 2016Publication date: December 29, 2016Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji Hoon YUN, Jong Sup SONG, Soo Hwan LEE, Saesil KIM, Mi Jeong YUN
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Publication number: 20160240746Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.Type: ApplicationFiled: December 31, 2015Publication date: August 18, 2016Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi Jeong YUN, Jong Sup SONG
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Publication number: 20160087159Abstract: A semiconductor light-emitting device includes a light-emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, and a selective transmission-reflection layer disposed on the light-emitting structure and including a plurality of dielectric layers having different optical thicknesses alternately stacked at least once. The sum of an optical thickness of a dielectric layer having a maximum optical thickness and an optical thickness of a dielectric layer having a minimum optical thickness is in the range of 0.75 to 0.80.Type: ApplicationFiled: May 22, 2015Publication date: March 24, 2016Inventors: Myeong Ha KIM, Chan Mook LIM, Masaaki SOFUE, Sang Yeob SONG, Mi Jeong YUN
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Publication number: 20150198762Abstract: A light emitting diode (LED) package includes: a main body mounted on a substrate; a light emitting diode that is mounted in the main body and emits light; and a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted. A backlight unit includes: a light guide plate configured to allow a light source to proceed to a liquid crystal panel; a light emitting diode (LED) mounted in a main body mounted on a substrate and generating a light source; and an LED package having a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted, and being mounted on the light guide plate.Type: ApplicationFiled: March 25, 2015Publication date: July 16, 2015Inventors: Geun-Young KIM, Tomohisa ONISHI, Jung-Hun LEE, Young-Taek KIM, Jong-Jin PARK, Mi-Jeong YUN, Young-Sam PARK, Hun-Joo HAHM, Hyung-Suk KIM, Seong-Yeon HAN, Do-Hun KIM, Dae-Yeon KIM, Dae-Hyun KIM, Jung-Kyu PARK
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Publication number: 20150129833Abstract: A light emitting device package includes a package substrate, a light emitting device, a resin portion and a light scattering agent. The light emitting device is disposed on the package substrate and includes a plurality of light emitting nanostructures. The resin portion is disposed on the package substrate and seals the light emitting device. The light scattering agent is dispersed in the resin portion and includes a material having a refractive index greater than a refractive index of a material forming the resin portion.Type: ApplicationFiled: August 7, 2014Publication date: May 14, 2015Inventors: Mi Jeong YUN, Joong Kon SON, Yoichi KUROKAWA, Kyung Wook HWANG
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Patent number: 9022632Abstract: A light emitting diode (LED) package includes: a main body mounted on a substrate; a light emitting diode that is mounted in the main body and emits light; and a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted. A backlight unit includes: a light guide plate configured to allow a light source to proceed to a liquid crystal panel; a light emitting diode (LED) mounted in a main body mounted on a substrate and generating a light source; and an LED package having a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted, and being mounted on the light guide plate.Type: GrantFiled: July 3, 2009Date of Patent: May 5, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Geun-Young Kim, Tomohisa Onishi, Jung-Hun Lee, Young-Taek Kim, Jong-Jin Park, Mi-Jeong Yun, Young-Sam Park, Hun-Joo Hahm, Hyung-Suk Kim, Seong-Yeon Han, Do-Hun Kim, Dae-Yeon Kim, Dae-Hyun Kim, Jung-Kyu Park
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Patent number: 8269239Abstract: A light emitting diode (LED) chip package including: a package body; an LED chip mounted on the package body and emitting an excited light; a phosphor layer including a phosphor absorbing the excited light and emitting a wavelength conversion light obtained by converting a wavelength of the excited light and a phosphor resin mixed with the phosphor; and a reflector layer including a reflector formed between the LED chip and the phosphor layer, transmitting the excited light to the phosphor layer, and reflecting the wavelength conversion light from the phosphor layer, and a reflector resin mixed with the reflector.Type: GrantFiled: January 16, 2008Date of Patent: September 18, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Sergiy Shylo, Mi Jeong Yun
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Publication number: 20110199787Abstract: A light emitting diode (LED) package includes: a main body mounted on a substrate; a light emitting diode that is mounted in the main body and emits light; and a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted. A backlight unit includes: a light guide plate configured to allow a light source to proceed to a liquid crystal panel; a light emitting diode (LED) mounted in a main body mounted on a substrate and generating a light source; and an LED package having a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted, and being mounted on the light guide plate.Type: ApplicationFiled: July 3, 2009Publication date: August 18, 2011Applicant: SAMSUNG LED CO., LTD.Inventors: Geun-Young Kim, Tomohisa Onishi, Jung-Hun Lee, Young-Taek Kim, Jong-Jin Park, Mi-Jeong Yun, Young-Sam Park, Hun-Joo Hahm, Hyung-Suk Kim, Seong-Yeon Han, Do-Hun Kim, Dae-Yeon Kim, Dae-Hyun Kim, Jung-Kyu Park