Patents by Inventor Mi Kyoung Choi

Mi Kyoung Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240347411
    Abstract: In one example, a semiconductor device, comprises a substrate having a top side and a conductor on the top side of the substrate, an electronic device on the top side of the substrate connected to the conductor on the top side of the substrate via an internal interconnect, a lid covering a top side of the electronic device, and a thermal material between the top side of the electronic device and the lid, wherein the lid has a through-hole. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: June 25, 2024
    Publication date: October 17, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Keun Soo Kim, Yu Jin Jeon, Mi Kyoung Choi, Young Ik Kwon
  • Patent number: 12021005
    Abstract: In one example, a semiconductor device includes a substrate having a top side and a conductor on the top side of the substrate, an electronic device on the top side of the substrate connected to the conductor on the top side of the substrate via an internal interconnect, a lid covering a top side of the electronic device, and a thermal material between the top side of the electronic device and the lid, wherein the lid has a through-hole. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: June 25, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Keun Soo Kim, Yu Jin Jeon, Mi Kyoung Choi, Young Ik Kwon
  • Publication number: 20220352129
    Abstract: In one example, a semiconductor structure comprises a frontside substrate comprising a conductive structure, a backside substrate comprising a base substrate and a cavity substrate contacting the base substrate, wherein the backside substrate is over a top side of the frontside substrate and has a cavity and an internal interconnect contacting the frontside substrate, and a first electronic component over the top side of the frontside substrate and in the cavity. The first electronic component is coupled with the conductive structure, and an encapsulant is in the cavity and on the top side of the frontside substrate, contacting a lateral side of the first electronic component, a lateral side of the cavity, and a lateral side of the internal interconnect. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: July 14, 2022
    Publication date: November 3, 2022
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gi Tae Lim, Jae Yun Kim, Myung Jae Choi, Min Hwa Chang, Mi Kyoung Choi
  • Publication number: 20220208638
    Abstract: In one example, a semiconductor device, comprises a substrate having a top side and a conductor on the top side of the substrate, an electronic device on the top side of the substrate connected to the conductor on the top side of the substrate via an internal interconnect, a lid covering a top side of the electronic device, and a thermal material between the top side of the electronic device and the lid, wherein the lid has a through-hole. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: March 18, 2022
    Publication date: June 30, 2022
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Keun Soo Kim, Yu Jin Jeon, Mi Kyoung Choi, Young Ik Kwon
  • Patent number: 11282763
    Abstract: In one example, a semiconductor device, includes a substrate having a top side and a conductor on the top side of the substrate, an electronic device on the top side of the substrate connected to the conductor on the top side of the substrate via an internal interconnect, a lid covering a top side of the electronic device, and a thermal material between the top side of the electronic device and the lid, wherein the lid has a through-hole. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: March 22, 2022
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Keun Soo Kim, Young Ik Kwon, Yu Jin Jeon, Mi Kyoung Choi
  • Publication number: 20200402885
    Abstract: In one example, a semiconductor device, comprises a substrate having a top side and a conductor on the top side of the substrate, an electronic device on the top side of the substrate connected to the conductor on the top side of the substrate via an internal interconnect, a lid covering a top side of the electronic device, and a thermal material between the top side of the electronic device and the lid, wherein the lid has a through-hole. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: June 24, 2019
    Publication date: December 24, 2020
    Applicant: Amkor Technology Korea, Inc.
    Inventors: Keun Soo Kim, Young Ik Kwon, Yu Jin Jeon, Mi Kyoung Choi