Patents by Inventor Mi Ok PARK
Mi Ok PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11776746Abstract: A multilayer capacitor includes a capacitor body in which a first capacitor portion and a second capacitor portion are disposed to face each other with a connection region disposed therebetween, the connection portion having a predetermined thickness in which an internal electrode is not formed. The first capacitor portion comprises first and second internal electrodes that are alternately disposed with a dielectric layer interposed therebetween, and the second capacitor portion comprises third and fourth internal electrodes that are alternately disposed with a dielectric layer interposed therebetween. First and second external electrodes connected to the internal electrodes respectively comprise first and second internal layers containing copper (Cu), and first and second external layers containing silver (Ag) or nickel (Ni), and palladium (Pd).Type: GrantFiled: July 15, 2022Date of Patent: October 3, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong In Kim, Min Jun Kim, Byung Kil Seo, Mi Ok Park
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Patent number: 11728093Abstract: A multilayer capacitor includes a capacitor body in which a first capacitor portion and a second capacitor portion are disposed to face each other with a connection region disposed therebetween, the connection portion having a predetermined thickness in which an internal electrode is not formed. The first capacitor portion comprises first and second internal electrodes that are alternately disposed with a dielectric layer interposed therebetween, and the second capacitor portion comprises third and fourth internal electrodes that are alternately disposed with a dielectric layer interposed therebetween. First and second external electrodes connected to the internal electrodes respectively comprise first and second internal layers containing copper (Cu), and first and second external layers containing silver (Ag) or nickel (Ni), and palladium (Pd).Type: GrantFiled: July 15, 2022Date of Patent: August 15, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong In Kim, Min Jun Kim, Byung Kil Seo, Mi Ok Park
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Patent number: 11515091Abstract: A multilayer capacitor includes a capacitor body in which a first capacitor portion and a second capacitor portion are disposed to face each other with a connection region disposed therebetween, the connection portion having a predetermined thickness in which an internal electrode is not formed. The first capacitor portion comprises first and second internal electrodes that are alternately disposed with a dielectric layer interposed therebetween, and the second capacitor portion comprises third and fourth internal electrodes that are alternately disposed with a dielectric layer interposed therebetween. First and second external electrodes connected to the internal electrodes respectively comprise first and second internal layers containing copper (Cu), and first and second external layers containing silver (Ag) or nickel (Ni), and palladium (Pd).Type: GrantFiled: June 15, 2020Date of Patent: November 29, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong In Kim, Min Jun Kim, Byung Kil Seo, Mi Ok Park
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Publication number: 20220351904Abstract: A multilayer capacitor includes a capacitor body in which a first capacitor portion and a second capacitor portion are disposed to face each other with a connection region disposed therebetween, the connection portion having a predetermined thickness in which an internal electrode is not formed. The first capacitor portion comprises first and second internal electrodes that are alternately disposed with a dielectric layer interposed therebetween, and the second capacitor portion comprises third and fourth internal electrodes that are alternately disposed with a dielectric layer interposed therebetween. First and second external electrodes connected to the internal electrodes respectively comprise first and second internal layers containing copper (Cu), and first and second external layers containing silver (Ag) or nickel (Ni), and palladium (Pd).Type: ApplicationFiled: July 15, 2022Publication date: November 3, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong In KIM, Min Jun KIM, Byung Kil SEO, Mi Ok PARK
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Publication number: 20210082621Abstract: A multilayer capacitor includes a capacitor body in which a first capacitor portion and a second capacitor portion are disposed to face each other with a connection region disposed therebetween, the connection portion having a predetermined thickness in which an internal electrode is not formed. The first capacitor portion comprises first and second internal electrodes that are alternately disposed with a dielectric layer interposed therebetween, and the second capacitor portion comprises third and fourth internal electrodes that are alternately disposed with a dielectric layer interposed therebetween. First and second external electrodes connected to the internal electrodes respectively comprise first and second internal layers containing copper (Cu), and first and second external layers containing silver (Ag) or nickel (Ni), and palladium (Pd).Type: ApplicationFiled: June 15, 2020Publication date: March 18, 2021Inventors: Jeong In KIM, Min Jun KIM, Byung Kil SEO, Mi Ok PARK
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Patent number: 10748708Abstract: A multilayer ceramic capacitor includes a body, and first and second external electrodes respectively disposed on opposing surfaces of the body in a longitudinal direction.Type: GrantFiled: June 8, 2018Date of Patent: August 18, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong Bong Park, Se Hwan Bong, Mi Ok Park, Kyeong Jun Kim, Hang Kyu Cho
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Patent number: 10580582Abstract: A multilayer electronic component includes a multilayer capacitor including a pair of external electrodes respectively formed on both ends opposing each other, and a pair of frame terminals having coupling holes allowing the external electrodes of the multilayer capacitor to be inserted, and separating the multilayer capacitor from a mounting surface, wherein band portions of the external electrodes are bonded to inner surfaces of the coupling holes.Type: GrantFiled: May 8, 2018Date of Patent: March 3, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyeong Jun Kim, Se Hwan Bong, Mi Ok Park, Jeong Bong Park, Hang Kyu Cho
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Publication number: 20190189351Abstract: A multilayer electronic component includes a multilayer capacitor including a pair of external electrodes respectively formed on both ends opposing each other, and a pair of frame terminals having coupling holes allowing the external electrodes of the multilayer capacitor to be inserted, and separating the multilayer capacitor from a mounting surface, wherein band portions of the external electrodes are bonded to inner surfaces of the coupling holes.Type: ApplicationFiled: May 8, 2018Publication date: June 20, 2019Inventors: Kyeong Jun KIM, Se Hwan BONG, Mi Ok PARK, Jeong Bong PARK, Hang Kyu CHO
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Publication number: 20190157004Abstract: A multilayer ceramic capacitor includes a body, and first and second external electrodes respectively disposed on opposing surfaces of the body in a longitudinal direction.Type: ApplicationFiled: June 8, 2018Publication date: May 23, 2019Inventors: Jeong Bong PARK, Se Hwan BONG, Mi Ok PARK, Kyeong Jun KIM, Hang Kyu CHO
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Patent number: 9685271Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers; an active part including first and second internal electrodes which are exposed to both end surfaces of the ceramic body in a length direction thereof, and floating electrodes which are partially overlapped with the first and second internal electrodes; upper and lower cover parts including the dielectric layers and disposed above and below the active part; dummy electrodes disposed in the upper and lower cover parts to be overlapped with the floating electrodes; and first and second external electrodes.Type: GrantFiled: March 19, 2015Date of Patent: June 20, 2017Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sun Cheol Lee, Hyoung Wook Lim, Mi Ok Park, Jae Yeol Choi, Ji Hee Moon
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Patent number: 9646768Abstract: A chip component includes: a ceramic body including a capacitance forming part in which first and second dielectric layers are alternately disposed; and external electrodes disposed on both end surfaces of the ceramic body, wherein the capacitance forming part includes first and second internal electrodes spaced apart from each other on the first dielectric layers and exposed to the end surfaces of the ceramic body to thereby be connected to the external electrodes; and floating electrodes disposed on the second dielectric layers and overlapped with portions of the first and second internal electrodes, the ceramic body includes protective parts disposed between upper and lower surfaces thereof and the capacitance forming part and having third dielectric layers on which first and second dummy electrodes exposed to the end surfaces of the ceramic body are disposed, and the protective parts include third dummy electrodes disposed between the first and second dummy electrodes.Type: GrantFiled: April 2, 2015Date of Patent: May 9, 2017Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sun Cheol Lee, Seung Yul Lee, Bok Goo Heo, Kyung Pyo Hong, Min Hyang Kim, Kyoung Hoon Kim, Hyoung Wook Lim, Sang Hyun Park, Mi Ok Park
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Publication number: 20160111216Abstract: A chip component includes: a ceramic body including a capacitance forming part in which first and second dielectric layers are alternately disposed; and external electrodes disposed on both end surfaces of the ceramic body, wherein the capacitance forming part includes first and second internal electrodes spaced apart from each other on the first dielectric layers and exposed to the end surfaces of the ceramic body to thereby be connected to the external electrodes; and floating electrodes disposed on the second dielectric layers and overlapped with portions of the first and second internal electrodes, the ceramic body includes protective parts disposed between upper and lower surfaces thereof and the capacitance forming part and having third dielectric layers on which first and second dummy electrodes exposed to the end surfaces of the ceramic body are disposed, and the protective parts include third dummy electrodes disposed between the first and second dummy electrodes.Type: ApplicationFiled: April 2, 2015Publication date: April 21, 2016Inventors: Sun Cheol LEE, Seung Yul LEE, Bok Goo HEO, Kyung Pyo HONG, Min Hyang KIM, Kyoung Hoon KIM, Hyoung Wook LIM, Sang Hyun PARK, Mi Ok PARK
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Publication number: 20160099105Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers; an active part including first and second internal electrodes which are exposed to both end surfaces of the ceramic body in a length direction thereof, and floating electrodes which are partially overlapped with the first and second internal electrodes; upper and lower cover parts including the dielectric layers and disposed above and below the active part; dummy electrodes disposed in the upper and lower cover parts to be overlapped with the floating electrodes; and first and second external electrodes.Type: ApplicationFiled: March 19, 2015Publication date: April 7, 2016Inventors: Sun Cheol LEE, Hyoung Wook LIM, Mi Ok PARK, Jae Yeol CHOI, Ji Hee MOON