Patents by Inventor Mi-Ra Im

Mi-Ra Im has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9761832
    Abstract: Provided are a substrate for an organic electronic device (OED) and a use thereof. The substrate may have excellent interfacial cohesive property by preventing interlayer delamination between the organic material layer and the inorganic material layer when being applied to manufacture a flexible device including a structure in which an organic material layer and an inorganic material layer are present together. In addition, when the substrate for an OED is used, an OED may have excellent durability and an excellent another required physical property such as light extraction efficiency.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: September 12, 2017
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Ji Hee Kim, Hang Ah Park, Sang Jun Lee, Hye Won Jeong, Jung Hyoung Lee, Bo Ra Shin, Mi Ra Im
  • Patent number: 9590197
    Abstract: Provided are a substrate for an organic electronic device (OED), an OED, and lighting. The substrate capable of forming an OED may have excellent performances including light extraction efficiency and prevent penetration of moisture or a gas from an external environment, and thus an OED having excellent performance and durability may be provided.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: March 7, 2017
    Assignee: LG CHEM, LTD.
    Inventors: Min Choon Park, Jung Ho Jo, Sang Woo Kim, Mi Ra Im
  • Publication number: 20160056411
    Abstract: Provided are a substrate for an organic electronic device (OED) and a use thereof. The substrate may have excellent interfacial cohesive property by preventing interlayer delamination between the organic material layer and the inorganic material layer when being applied to manufacture a flexible device including a structure in which an organic material layer and an inorganic material layer are present together. In addition, when the substrate for an OED is used, an OED may have excellent durability and an excellent another required physical property such as light extraction efficiency.
    Type: Application
    Filed: September 30, 2014
    Publication date: February 25, 2016
    Inventors: Ji Hee KIM, Hang Ah PARK, Sang Jun LEE, Hye Won JEONG, Jung Hyoung LEE, Bo Ra SHIN, Mi Ra IM
  • Patent number: 9268221
    Abstract: Provided is a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a first polybenzoxazole precursor including a repeating unit represented by Chemical Formula 1 and a repeating unit represented by Chemical Formula 2, and having a thermally polymerizable functional group at least one terminal end; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound; and (E) a solvent. A photosensitive resin film fabricated using the positive photosensitive resin composition is provided.
    Type: Grant
    Filed: July 26, 2011
    Date of Patent: February 23, 2016
    Assignee: Cheil Industries Inc.
    Inventors: Ji-Young Jeong, Min-Kook Chung, Jong-Hwa Lee, Mi-Ra Im, Hyun-Yong Cho, Myoung-Hwan Cha, Hwan-Sung Cheon
  • Patent number: 9023559
    Abstract: Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a novolac resin including a repeating unit represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, a photosensitive resin film prepared by using the positive photosensitive resin composition, and a semiconductor device including the photosensitive resin film.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: May 5, 2015
    Assignee: Cheil Industries Inc.
    Inventors: Jong-Hwa Lee, Hyun-Yong Cho, Mi-Ra Im, Hwan-Sung Cheon, Min-Kook Chung, Ji-Young Jeong, Myoung-Hwan Cha
  • Publication number: 20150008425
    Abstract: Provided are a substrate for an organic electronic device (OED), an OED, and lighting. The substrate capable of forming an OED may have excellent performances including light extraction efficiency and prevent penetration of moisture or a gas from an external environment, and thus an OED having excellent performance and durability may be provided.
    Type: Application
    Filed: September 26, 2014
    Publication date: January 8, 2015
    Inventors: Min Choon PARK, Jung Ho JO, Sang Woo KIM, Mi Ra IM
  • Publication number: 20140296408
    Abstract: The present invention relates to insulating material for an electronic device that may inhibit damage to an electronic device due to a high temperature curing process, and simultaneously exhibit excellent properties and reliability. The insulating material for an electronic device comprises soluble polyimide resin comprising a specific repeat unit, exhibits imidization degree of 70% or more after curing at a temperature of 250° C., and comprises a low boiling point solvent having boiling point of 130 to 180° C. as a residual solvent.
    Type: Application
    Filed: January 11, 2013
    Publication date: October 2, 2014
    Applicant: LG CHEM, LTD.
    Inventors: Sang-Woo Kim, Mi-Ra Im, Kyung-Jun Kim, Chan-Hyo Park, Kyou-Hyun Nam
  • Patent number: 8841064
    Abstract: Disclosed are a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a dissolution controlling agent including the compound represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, and a photosensitive resin film prepared by using the same.
    Type: Grant
    Filed: November 11, 2011
    Date of Patent: September 23, 2014
    Assignee: Cheil Industries Inc.
    Inventors: Myoung-Hwan Cha, Jong-Hwa Lee, Mi-Ra Im, Min-Kook Chung, Ji-Young Jeong, Hyun-Yong Cho, Hwan-Sung Cheon
  • Publication number: 20140256876
    Abstract: The present invention relates to insulating material for an electronic device that may inhibit damage to electronic devices by a high temperature curing process, and simultaneously contribute to improvement in reliability of electronic devices. The insulating material for an electronic device comprises soluble polyimide resin comprising a specific repeat unit, and a residual solvent comprising a low boiling point solvent having boiling point of 130 to 180° C., wherein after curing at a temperature of 250° C. or less, the amount of outgassing is 4 ppm or less based on total weight of the soluble polyimide resin, and the amount of outgassing derived from water or alcohol is less than 0.1 ppm.
    Type: Application
    Filed: January 11, 2013
    Publication date: September 11, 2014
    Applicant: LG CHEM, LTD.
    Inventors: Sang-Woo Kim, Mi-Ra Im, Kyung-Jun Kim, Chan-Hyo Park, Kyou-Hyun Nam
  • Patent number: 8487069
    Abstract: Disclosed is a liquid crystal photo-alignment agent including polyamic acid or a polyimide including a first structural unit derived from a photo-diamine represented by the following Chemical Formula 1, a second structural unit represented by the following Chemical Formula 2 or a polymer compound combination thereof, and a solvent. In Chemical Formulae 1 and 2, each substituent is the same as defined in the detailed description.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: July 16, 2013
    Assignee: Cheil Industries Inc.
    Inventors: Jae-Deuk Yang, Hee-Young Oh, Myoung-Youp Shin, Mi-Ra Im, Guk-Pyo Jo, Eun-Ha Kim
  • Patent number: 8329264
    Abstract: Disclosed are a liquid crystal alignment agent, and a liquid crystal alignment film and a liquid crystal display (LCD) including the same. The liquid crystal alignment agent includes a polymer of polyamic acid, a polyimide, or a combination thereof, and an epoxy compound represented by the following Chemical Formula 1. In the above Chemical Formula 1, each substituent is the same as defined in the specification.
    Type: Grant
    Filed: August 19, 2009
    Date of Patent: December 11, 2012
    Assignee: Cheil Industries Inc.
    Inventors: Bum-Jin Lee, Won-Seok Dong, Mi-Ra Im, Dong-Seon Uh
  • Publication number: 20120171614
    Abstract: Disclosed are a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a dissolution controlling agent including the compound represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, and a photosensitive resin film prepared by using the same.
    Type: Application
    Filed: November 11, 2011
    Publication date: July 5, 2012
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Myoung-Hwan CHA, Jong-Hwa LEE, Mi-Ra IM, Min-Kook CHUNG, Ji-Young JEONG, Hyun-Yong CHO, Hwan-Sung CHEON
  • Publication number: 20120171610
    Abstract: Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a novolac resin including a repeating unit represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, a photosensitive resin film prepared by using the positive photosensitive resin composition, and a semiconductor device including the photosensitive resin film.
    Type: Application
    Filed: November 23, 2011
    Publication date: July 5, 2012
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Jong-Hwa LEE, Hyun-Yong CHO, Mi-Ra IM, Hwan-Sung CHEON, Min-Kook CHUNG, Ji-Young JEONG, Myoung-Hwan CHA
  • Publication number: 20120171609
    Abstract: Provided is a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a first polybenzoxazole precursor including a repeating unit represented by Chemical Formula 1 and a repeating unit represented by Chemical Formula 2, and having a thermally polymerizable functional group at least one terminal end; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound; and (E) a solvent. A photosensitive resin film fabricated using the positive photosensitive resin composition is provided.
    Type: Application
    Filed: July 26, 2011
    Publication date: July 5, 2012
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Ji-Young JEONG, Min-Kook CHUNG, Jong-Hwa LEE, Mi-Ra IM, Hyun-Yong CHO, Myoung-Hwan CHA, Hwan-Sung CHEON
  • Publication number: 20110144299
    Abstract: Disclosed is a liquid crystal photo-alignment agent including polyamic acid or a polyimide including a first structural unit derived from a photo-diamine represented by the following Chemical Formula 1, a second structural unit represented by the following Chemical Formula 2 or a polymer compound combination thereof, and a solvent. In Chemical Formulae 1 and 2, each substituent is the same as defined in the detailed description.
    Type: Application
    Filed: September 1, 2010
    Publication date: June 16, 2011
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Jae-Deuk YANG, Hee-Young OH, Myoung-Youp SHIN, Mi-Ra IM, Guk-Pyo JO, Eun-Ha KIM
  • Publication number: 20100136264
    Abstract: Disclosed are a liquid crystal alignment agent, and a liquid crystal alignment film and a liquid crystal display (LCD) including the same. The liquid crystal alignment agent includes a polymer of polyamic acid, a polyimide, or a combination thereof, and an epoxy compound represented by the following Chemical Formula 1. In the above Chemical Formula 1, each substituent is the same as defined in the specification.
    Type: Application
    Filed: August 19, 2009
    Publication date: June 3, 2010
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Bum-Jin LEE, Won-Seok DONG, Mi-Ra IM, Dong-Seon UH