Patents by Inventor Mi Ran HWANG

Mi Ran HWANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Variable inductance inductor and variable inductance inductor module
    Patent number: 10204728
    Abstract: A variable inductance inductor includes an inductor unit having a coil pattern; and at least one inductance controlling unit configured to vary a contact area between the coil pattern and a moveable conductor unit to change a current path.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: February 12, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Mi Ran Hwang, Seong Jong Cheon
  • Printed circuit board and method of manufacturing the same
    Patent number: 10193055
    Abstract: A printed circuit board includes: insulating layers and wiring layers arranged in stacked configuration; a cavity disposed in a first insulating layer among the insulating layers; a piezoelectric substrate disposed in the cavity; an electrode disposed on the piezoelectric substrate and configured to convert an electrical signal into an elastic wave or to convert an elastic wave into an electrical signal; and a sealing part disposed on the piezoelectric substrate, the sealing part enclosing the electrode and forming an air gap around the electrode.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: January 29, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Mi Ran Hwang, Se Jong Kim
  • VARIABLE INDUCTANCE INDUCTOR AND VARIABLE INDUCTANCE INDUCTOR MODULE
    Publication number: 20160372247
    Abstract: A variable inductance inductor includes an inductor unit having a coil pattern; and at least one inductance controlling unit configured to vary a contact area between the coil pattern and a moveable conductor unit to change a current path.
    Type: Application
    Filed: January 29, 2016
    Publication date: December 22, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Mi Ran HWANG, Seong Jong CHEON
  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160156333
    Abstract: A printed circuit board includes: insulating layers and wiring layers arranged in stacked configuration; a cavity disposed in a first insulating layer among the insulating layers; a piezoelectric substrate disposed in the cavity; an electrode disposed on the piezoelectric substrate and configured to convert an electrical signal into an elastic wave or to convert an elastic wave into an electrical signal; and a sealing part disposed on the piezoelectric substrate, the sealing part enclosing the electrode and forming an air gap around the electrode.
    Type: Application
    Filed: November 30, 2015
    Publication date: June 2, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Mi Ran HWANG, Se Jong KIM