Abstract: A service identifying and processing method using a wireless terminal message according to an exemplary embodiment of the present invention includes (a) receiving a wireless terminal message by a first entity which is a mobile device; and (b) expressing, by a first agent which is an information processing application program installed on the first entity, entity information of second entity based on the wireless terminal message and service confirmation information related to service provided by the second entity, through an application screen by the first agent.

Abstract: The austenitic stainless steel that does not cause defects such as aging crack or delayed fracture even after the expansion and curling process of 5 steps or more is disclosed. In accordance with an aspect of the present disclosure, an austenitic stainless steel with excellent pipe expanding workability and aging crack resistance includes, in percent (%) by weight of the entire composition, C: 0.01 to 0.04%, Si: 0.1 to 1.0%, Mn: 0.1 to 2.0%, Cr: 16 to 20%, Ni: 6 to 10%, Cu: 0.1 to 2.0%, Mo: 0.2% or less, N: 0.035 to 0.07%, the remainder of iron (Fe) and other inevitable impurities, and the C+N satisfies 0.1% or less, the product of the Md30 (° C.) value and average grain size (?m) satisfies less than ?500.

Abstract: A stainless steel with a yield strength of 2,200 MPa or more is disclosed through the generation of the strain-induced martensite phase and the increase of the martensite phase strength. A high strength stainless steel according to an embodiment of present disclosure includes, in percent (%) by weight of the entire composition, C: 0.14 to 0.20%, Si: 0.8 to 1.0%, Mn: more than 0 and 0.5% or less, Cr: 15.0 to 17.0%, Ni: 4.0 to 5.0%, Mo: 0.6 to 0.8%, Cu: 0.5% or less, N: 0.05 to 0.11%, the remainder of iron (Fe) and other inevitable impurities, and C+N: 0.25% or more and Md30 value satisfies 40° C. or more.

Abstract: A frame structure for a vehicle includes: an inner panel connected to a side member and defining an inner side of a rear part of the side member; an outer panel connected to a rear side of the side member and coupled to an outer side of the inner panel defining a closed cross-section together with the inner panel and defining an outer side of the rear part of the side member; an opening portion formed below the inner and outer panels partially opening the closed cross-section so that a front end of a rear suspension arm can be inserted into the opening portion; and a reinforcing member disposed in the opening portion defining the closed cross-section together with the outer panel and the inner panel and configured to close an internal space in the outer and inner panels.

Abstract: A semiconductor package includes a semiconductor chip having a plurality of contact pads on a surface thereof, a plurality of main bumps on the contact pads, respectively. Each of the plurality of main bumps includes a first pillar layer on one of the contact pads and a first solder layer on the first pillar layer, and the first solder layer includes an upper portion having an overhang portion.

Abstract: A wafer cleaning apparatus preferably includes a first plate configured to hold a wafer. The first plate may have a first supply pipe configured to supply a cleaning solution to a first surface of the wafer. A second plate preferably has a second supply pipe configured to supply the cleaning solution to a second surface of the wafer. A megasonic vibrator can be provided in the second plate. A plurality of heaters are preferably arranged in communication with one or both of the first and second plates. The plurality of heaters can be configured to heat the cleaning solution supplied to the first and second surfaces of the wafer. Using a wafer cleaning apparatus constructed according to principles of the present invention, a temperature difference of a cleaning solution can be reduced. An etch rate difference caused by the cleaning solution temperature difference can also be reduced to achieve a more uniform cleaning efficiency.