Patents by Inventor Miao-Chang Wu

Miao-Chang Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12358240
    Abstract: A tape laying device includes a tape transmission mechanism, a compaction head mechanism, a cutter mechanism, a heating mechanism and a motion mechanism. The tape transmission mechanism is configured to transmit the pre-impregnated tape. The compaction head mechanism, connected with the tape transmission mechanism, is configured to depress and drive the pre-impregnated tape transmitted by the tape transmission mechanism to follow a moving path so as to adhere the pre-impregnated tape onto the mould surface. The cutter mechanism is configured to cut the pre-impregnated tape. The heating mechanism, disposed downstream to the cutter mechanism, is configured to heat the pre-impregnated tape. The motion mechanism is used to have the cutter mechanism having an active path to move toward the moving path while the cutter mechanism cuts the pre-impregnated tape.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: July 15, 2025
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Teng-Yen Wang, Shun-Sheng Ko, Miao-Chang Wu, Tung-Ying Lin, Chao-Hong Hsu
  • Publication number: 20250108458
    Abstract: An ingot splitting method and an ingot splitting apparatus are provided. The ingot splitting method includes the following steps. A laser provided from a laser source is focused with a focusing lens group on a plane to be split of an ingot, and a focus point of the laser is used to scan the plane to be split. An opposing first side and second side of the ingot are fixed with a chuck table and an ultrasonic source. The plane to be split is located between the first side and the second side. A pulling force is applied to the second side in a direction away from the ingot with a tensioner, and ultrasonic waves are applied to vibrate the ingot with the ultrasonic source simultaneously, so that the ingot is divided into two parts from the plane to be split.
    Type: Application
    Filed: September 9, 2024
    Publication date: April 3, 2025
    Applicant: Industrial Technology Research Institute
    Inventors: Kun-Wei Lin, Tung-Ying Lin, Miao-Chang Wu
  • Publication number: 20240227324
    Abstract: A tape laying device includes a tape transmission mechanism, a compaction head mechanism, a cutter mechanism, a heating mechanism and a motion mechanism. The tape transmission mechanism is configured to transmit the pre-impregnated tape. The compaction head mechanism, connected with the tape transmission mechanism, is configured to depress and drive the pre-impregnated tape transmitted by the tape transmission mechanism to follow a moving path so as to adhere the pre-impregnated tape onto the mould surface. The cutter mechanism is configured to cut the pre-impregnated tape. The heating mechanism, disposed downstream to the cutter mechanism, is configured to heat the pre-impregnated tape. The motion mechanism is used to have the cutter mechanism having an active path to move toward the moving path while the cutter mechanism cuts the pre-impregnated tape.
    Type: Application
    Filed: December 7, 2022
    Publication date: July 11, 2024
    Inventors: TENG-YEN WANG, SHUN-SHENG KO, MIAO-CHANG WU, TUNG-YING LIN, CHAO-HONG HSU
  • Publication number: 20240131808
    Abstract: A tape laying device includes a tape transmission mechanism, a compaction head mechanism, a cutter mechanism, a heating mechanism and a motion mechanism. The tape transmission mechanism is configured to transmit the pre-impregnated tape. The compaction head mechanism, connected with the tape transmission mechanism, is configured to depress and drive the pre-impregnated tape transmitted by the tape transmission mechanism to follow a moving path so as to adhere the pre-impregnated tape onto the mould surface. The cutter mechanism is configured to cut the pre-impregnated tape. The heating mechanism, disposed downstream to the cutter mechanism, is configured to heat the pre-impregnated tape. The motion mechanism is used to have the cutter mechanism having an active path to move toward the moving path while the cutter mechanism cuts the pre-impregnated tape.
    Type: Application
    Filed: December 7, 2022
    Publication date: April 25, 2024
    Inventors: TENG-YEN WANG, SHUN-SHENG KO, MIAO-CHANG WU, TUNG-YING LIN, CHAO-HONG HSU
  • Patent number: 11835441
    Abstract: A sample classification device including a carrier, a first detection module, and a sample pipeline is provided. The first detection module includes a first light-emitting device, a second light-emitting device, and a first optical sensing device. The first light emitting device is located on the carrier and used to emit light of a first wavelength. The second light emitting device is located on the carrier and used to emit light of a second wavelength. The first wavelength is different from the second wavelength. The first optical sensing device is located on the carrier and between the first light emitting device and the second light emitting device. The sample pipeline is located above the carrier and passes above the first optical sensing device.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: December 5, 2023
    Assignee: Industrial Technology Research Institute
    Inventors: Chih-Hung Huang, Yuan-Fa Lee, Miao-Chang Wu, Sheng-Li Chang, Chih-Ching Liao
  • Publication number: 20220163439
    Abstract: A sample classification device including a carrier, a first detection module, and a sample pipeline is provided. The first detection module includes a first light-emitting device, a second light-emitting device, and a first optical sensing device. The first light emitting device is located on the carrier and used to emit light of a first wavelength. The second light emitting device is located on the carrier and used to emit light of a second wavelength. The first wavelength is different from the second wavelength. The first optical sensing device is located on the carrier and between the first light emitting device and the second light emitting device. The sample pipeline is located above the carrier and passes above the first optical sensing device.
    Type: Application
    Filed: May 5, 2021
    Publication date: May 26, 2022
    Applicant: Industrial Technology Research Institute
    Inventors: Chih-Hung Huang, Yuan-Fa Lee, Miao-Chang Wu, Sheng-Li Chang, Chih-Ching Liao