Abstract: A vertical smelting system is disclosed by the present disclosure. The vertical smelting system comprises a high-temperature heating device, a reaction sample loading device, a reaction product receiving device, a cooling device, and a transmission device. The reaction sample loading device is detachably connected to the high-temperature heating device, and extends downwardly from the high-temperature heating device. The reaction product receiving device located below the reaction sample loading device is detachably connected to the reaction sample loading device. The cooling device is located below the high-temperature heating device. The transmission device respectively connected to the reaction sample loading device and the reaction product receiving device is configured to drive the reaction sample loading device to move relative to the high-temperature heating device, and is further configured to drive the reaction product receiving device to move relative to the reaction sample loading device.

Abstract: A high temperature reaction system includes a reaction tube including a heating space, a discharge unit, a cooling unit, a feeding unit and an observation and analysis unit. The discharge unit is disposed opposite to an inlet of the heating space and has a discharge space communicating the heating space, and an observation window and a discharge opening which communicate the discharge space. The cooling unit has a cooling space communicating the discharge opening. The feeding unit includes a carrier holding a sample, and a moving module for moving the carrier and the sample. The observation and analysis unit includes an image capture module and an analysis module for analyzing gas released by the sample.

Abstract: A high temperature reaction system includes a reaction tube including a heating space, a discharge unit, a cooling unit, a feeding unit and an observation and analysis unit. The discharge unit is disposed opposite to an inlet of the heating space and has a discharge space communicating the heating space, and an observation window and a discharge opening which communicate the discharge space. The cooling unit has a cooling space communicating the discharge opening. The feeding unit includes a carrier holding a sample, and a moving module for moving the carrier and the sample. The observation and analysis unit includes an image capture module and an analysis module for analyzing gas released by the sample.

Abstract: Methods of manufacturing a flexible force sensor include forming a first sensor part providing a plurality of spaced first electrode plates in an electrically non-conductive material. A second sensor part is also formed and includes a plurality of second electrode plates in an electrically non-conductive material. The second electrode plates are identical to the first electrode plates at least in terms of spacing. The first part is assembled to the second part such that each of the first electrode plates are aligned with and parallel to, yet spaced from, respective ones of the second electrode plates, establishing a plurality of capacitive sensing components. The first electrode plates are movable relative to the corresponding second electrode plates, establishing a variable gap therebetween. The sensor parts can be ring-shaped. The sensor parts can be formed via MEMS techniques, with the non-conductive material being a polymer.

Abstract: Methods of manufacturing a flexible force sensor include forming a first sensor part providing a plurality of spaced first electrode plates in an electrically non-conductive material. A second sensor part is also formed and includes a plurality of second electrode plates in an electrically non-conductive material. The second electrode plates are identical to the first electrode plates at least in terms of spacing. The first part is assembled to the second part such that each of the first electrode plates are aligned with and parallel to, yet spaced from, respective ones of the second electrode plates, establishing a plurality of capacitive sensing components. The first electrode plates are movable relative to the corresponding second electrode plates, establishing a variable gap therebetween. The sensor parts can be ring-shaped. The sensor parts can be formed via MEMS techniques, with the non-conductive material being a polymer.

Abstract: Methods of manufacturing a flexible force sensor include forming a first sensor part providing a plurality of spaced first electrode plates in an electrically non-conductive material. A second sensor part is also formed and includes a plurality of second electrode plates in an electrically non-conductive material. The second electrode plates are identical to the first electrode plates at least in terms of spacing. The first part is assembled to the second part such that each of the first electrode plates are aligned with and parallel to, yet spaced from, respective ones of the second electrode plates, establishing a plurality of capacitive sensing components. The first electrode plates are movable relative to the corresponding second electrode plates, establishing a variable gap therebetween. The sensor parts can be ring-shaped. The sensor parts can be formed via MEMS techniques, with the non-conductive material being a polymer.

Abstract: Methods of manufacturing a flexible force sensor include forming a first sensor part providing a plurality of spaced first electrode plates in an electrically non-conductive material. A second sensor part is also formed and includes a plurality of second electrode plates in an electrically non-conductive material. The second electrode plates are identical to the first electrode plates at least in terms of spacing. The first part is assembled to the second part such that each of the first electrode plates are aligned with and parallel to, yet spaced from, respective ones of the second electrode plates, establishing a plurality of capacitive sensing components. The first electrode plates are movable relative to the corresponding second electrode plates, establishing a variable gap therebetween. The sensor parts can be ring-shaped. The sensor parts can be formed via MEMS techniques, with the non-conductive material being a polymer.

Abstract: An independently detachable light-emitting diode light source module adapted to be installed in a luminaire's casing having an opening and an accommodating cavity, is provided. The independently detachable light-emitting diode light source module includes an installing device, a light-emitting diode array, and a secondary optical light guide plate. The light-emitting diode array and the secondary optical light guide plate are disposed in the installing device. The light source module is disposed inside the accommodating cavity and is assembled in the luminaire's casing via the installing device, and the opening exposes the light-emitting diode light source module.

Abstract: Methods of manufacturing a flexible force sensor include forming a first sensor part providing a plurality of spaced first electrode plates in an electrically non-conductive material. A second sensor part is also formed and includes a plurality of second electrode plates in an electrically non-conductive material. The second electrode plates are identical to the first electrode plates at least in terms of spacing. The first part is assembled to the second part such that each of the first electrode plates are aligned with and parallel to, yet spaced from, respective ones of the second electrode plates, establishing a plurality of capacitive sensing components. The first electrode plates are movable relative to the corresponding second electrode plates, establishing a variable gap therebetween. The sensor parts can be ring-shaped. The sensor parts can be formed via MEMS techniques, with the non-conductive material being a polymer.

Abstract: An optical module for LED luminaire is provided. The optical module can be used with LED arrays so that the luminaire with LED arrays can utilize the present invention to improve the luminance, brightness, luminance uniformity and coefficient of utilization to meet the user's demands. The optical module includes at least a radiation guiding unit and at least an anti-glare unit. The radiation guiding units are arranged abreast to adjust the radiation pattern to fit the coverage range. The anti-glare unit is formed on the both sides of the radiation guiding unit to prevent glare. The optical module of the present invention, when used in a luminaire, can form the expected distribution curve according to the objects to be lighted.

Abstract: An independently detachable light-emitting diode light source module adapted to be installed in a luminarie having an opening and an accommodating cavity, is provided. The independently detachable light-emitting diode light source module includes an installing device, a light-emitting diode array, and a secondary optical light guide plate. The light-emitting diode array and the secondary optical light guide plate are disposed on the installing device. The light source module is disposed inside the accommodating cavity and is assembled in the luminarie via the installing device, and the opening exposes the light-emitting diode light source module.

Abstract: An optical module for LED luminarie is provided. The optical module can be used with LED arrays so that the luminarie with LED arrays can utilize the present invention to improve the luminance, brightness, luminance uniformity and coefficient of utilization to meet the user's demands. The optical module includes at least a radiation guiding unit and at least an anti-glare unit. The radiation guiding units are arranged abreast to adjust the radiation pattern to fit the coverage range. The anti-glare unit is formed on the both sides of the radiation guiding unit to prevent glare. The optical module of the present invention, when used in a luminarie, can form the expected distribution curve according to the objects to be lighted.

Abstract: A light emitting diode luminaire includes an installing device, a light emitting diode array, a secondary optical light guide plate, a thermal conduction-dissipation device, and a carrier. The light emitting diode array and the secondary optical light guide plate are disposed on the installing device. The thermal conduction-dissipation device includes a thermal dissipation element and a thermal conduction element. The thermal conduction element has a heat absorption portion and at least one heat dissipation portion. The heat absorption portion is thermally coupled to the light emitting diode array, while the heat dissipation portion extends outward. The installing device is assembled on the carrier, and the light emitting diode array and the second optical light guide plate are assembled on the carrier via the installing device.