Abstract: According to one method, a sample with cells contains a phototagging agent. The sample is imaged to identify at least one target cell to be isolated. The identified target cell in the sample is selectively irradiated with photo-activating light for selectively activating the phototagging agent in the target cell to change its fluorescence response. The irradiated target cell is isolated from other cells in the sample based on a difference in its fluorescence response compared to non-activated phototagging agent in the other cells. Further aspects are directed to a corresponding microscope system and chemical compound for use as the phototagging agent.

Abstract: Provided herein are photochemical crosslinkers and photocleavable crosslinkers and their uses in methods for cell selection from cell cultures. The photochemical crosslinkers comprise a fluorescent dye and a radical generator. The photocleavable crosslinkers comprise a photocleavable linker linking two electrophilic groups to each other. Also provided are systems for imaging cells comprising a plurality of cells crosslinked to extracellular matrix proteins using a crosslinker as described, an imaging apparatus, an illuminating apparatus, and software for image processing.

Abstract: Provided herein are photochemical crosslinkers and photocleavable crosslinkers and their uses in methods for cell selection from cell cultures. The photochemical crosslinkers comprise a fluorescent dye and a radical generator. The photocleavable crosslinkers comprise a photocleavable linker linking two electrophilic groups to each other. Also provided are systems for imaging cells comprising a plurality of cells crosslinked to extracellular matrix proteins using a crosslinker as described, an imaging apparatus, an illuminating apparatus, and software for image processing.

Abstract: The invention discloses novel morphology shifting micelles and amphiphilic coated metal nanofibers. Methods of using and making the same are also disclosed.

Abstract: A lamp tube switching circuit includes a first connector and a second connector for connecting either an LED lamp tube or a fluorescent type lamp tube, a switch module being a mechanical switch including first, second and third switches, a starter and ballast. Each of the first and second switches has a static terminal for connecting with a power supply, and four dynamic terminals for selectively connecting with the static terminal thereof. Different circuits can be configured by adjusting the connection between the static and dynamic terminals, wherein each circuit can drive a selected type of lamp tube to generate light.

Abstract: An illumination device includes a light tube holder including two connectors for receiving either a light-emitting diode (LED) tube or a fluorescent tube. One of the connectors includes a rotary member rotatably received in a through hole defined in a retainer, and four conductive elastic pieces positioned in the retainer around the through hole. Two of the conductive pieces are electrically connected to an LED tube drive circuit board and the other two are connected to a fluorescent tube drive circuit board. The rotary member can be rotated to first and second positions, wherein at the first position, the LED tube can be activated, and at the second position the fluorescent tube can be activated.

Abstract: An illumination device includes a light tube holder including two connectors for receiving either a light-emitting diode (LED) tube or a fluorescent tube. One of the connectors includes a rotary member rotatably received in a through hole defined in a retainer, and four conductive elastic pieces positioned in the retainer around the through hole. Two of the conductive pieces are electrically connected to an LED tube drive circuit board and the other two are connected to a fluorescent tube drive circuit board. The rotary member can be rotated to first and second positions, wherein at the first position, the LED tube can be activated, and at the second position the fluorescent tube can be activated.

Abstract: A lamp tube switching circuit includes a first connector and a second connector for connecting either an LED lamp tube or a fluorescent type lamp tube, a switch module being a mechanical switch including first, second and third switches, a starter and ballast. Each of the first and second switches has a static terminal for connecting with a power supply, and four dynamic terminals for selectively connecting with the static terminal thereof. Different circuits can be configured by adjusting the connection between the static and dynamic terminals, wherein each circuit can drive a selected type of lamp tube to generate light.

Abstract: The invention discloses novel morphology shifting micelles and amphiphilic coated metal nanofibers. Methods of using and making the same are also disclosed.

Abstract: A method of forming an underfilled semiconductor package comprises the steps of: providing a substrate (300) with raised terminal portions (305), disposing underfill compound (5) with filler (27) on the substrate (300), placing a bumped semiconductor die (40) on the substrate (300) with bumps (45) abutting upper surfaces (310) of the raised terminal portions (305), and reflowing the assembly. During the reflow process, the raised terminal portions (305) and the bumps (45) melt and displace the filler (27) in the underfill compound (5) away from between the bumps (45) and the raised terminal portions (305). This prevents the filler (27) from forming a barrier. The molten solder forms interconnects between the pads (46) and the raised terminal portions (305).

Abstract: A method of forming an underfilled semiconductor package comprises the steps of: providing a substrate (300) with raised terminal portions (305), disposing underfill compound (5) with filler (27) on the substrate (300), placing a bumped semiconductor die (40) on the substrate (300) with bumps (45) abutting upper surfaces (310) of the raised terminal portions (305), and reflowing the assembly. During the reflow process, the raised terminal portions (305) and the bumps (45) melt and displace the filler (27) in the underfill compound (5) away from between the bumps (45) and the raised terminal portions (305). This prevents the filler (27) from forming a barrier. The molten solder forms interconnects between the pads (46) and the raised terminal portions (305).