Patents by Inventor Miao TANG

Miao TANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250085691
    Abstract: A method using AI models to generate patterns or images on a pastry is provided. The method at least includes steps as follows: providing a UI module for user input of keywords and descriptions; generating black and white vector-style images based on this input using an AI-based image module; processing the 2D image into digital instructions via an image-transformer module; sending these instructions to a laser patterning module; and using the laser patterning module to apply the pattern to the cookie's surface.
    Type: Application
    Filed: August 29, 2024
    Publication date: March 13, 2025
    Inventors: Guijun LI, Kong Wai LEE, Yang XU, Yee Him Timothy CHAN, Miao TANG, Huan LIU, Yexin PAN, Qiaoyaxiao YUAN
  • Publication number: 20250043083
    Abstract: Embodiments of the present disclosure pertain to a rotaxane composition that includes macrocyclic rings and polymers, where the polymers are covalently appended to one or more macrocycle-binding molecules, where each of the macrocyclic rings includes a cavity that is threaded onto the polymers, where some of the threaded macrocyclic rings are individually threaded onto two polymers to form double-threaded macrocyclic rings with a plurality of different segments, where each of the plurality of different segments includes a plurality of double-threaded macrocyclic rings, and where the plurality of different segments associate with one another to form a crystalline network. Additional embodiments of the present disclosure pertain to sensors that include such compositions, methods of manufacturing a three-dimensional structure by applying such compositions onto a surface, and methods of forming such compositions.
    Type: Application
    Filed: August 2, 2024
    Publication date: February 6, 2025
    Applicant: Trustees of Dartmouth College
    Inventors: Chenfeng Ke, Miao Tang
  • Publication number: 20230174680
    Abstract: Embodiments of the present disclosure pertain to a composition that includes a rotaxane. The rotaxane includes a plurality of macrocyclic rings and a polymer with a molecular weight below 10,000 Da that is covalently appended to one or more sterically hindered molecules. The cavities of the macrocyclic rings are threaded onto the polymer. The plurality of threaded macrocyclic rings include a plurality of different segments that each include a plurality of threaded macrocyclic rings. Each of the plurality of different segments is in the form of a crystalline network. Further embodiments of the present disclosure pertain to methods of forming the rotaxanes by covalently appending one or more sterically hindered molecules onto a polymer and threading a plurality of macrocyclic rings onto the polymer. Additional embodiments of the present disclosure pertain to methods of manufacturing a three-dimensional structure by applying a composition of the present disclosure onto a surface.
    Type: Application
    Filed: May 10, 2021
    Publication date: June 8, 2023
    Applicant: Trustees of Dartmouth College
    Inventors: Chenfeng Ke, Qianming Lin, Longyu li, Miao Tang
  • Patent number: 10534552
    Abstract: An SR-IOV-supported storage resource access method is disclosed, the method includes: consolidating a storage medium as a unified storage resource, and dividing the unified storage resource into multiple storage sub-resources; allocating the storage sub-resources to at least one of a PF or a VF according to a preset allocation rule, and maintaining a resource allocation table including a mapping relationship between the storage sub-resources and at least one of PF or VF; receiving a host command sent by a virtual machine to a destination VF or by a virtual machine monitor to a destination PF; and searching the resource allocation table according to destination VF or destination PF, and performing, on a storage sub-resource corresponding to destination PF or destination VF and according to the mapping relationship between the storage sub-resources and the PF or the VF in the resource allocation table, an operation corresponding to the host command.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: January 14, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Haiyan Hu, Shaofeng Shen, Miao Tang
  • Publication number: 20170235510
    Abstract: An SR-IOV-supported storage resource access method is disclosed, the method includes: consolidating a storage medium as a unified storage resource, and dividing the unified storage resource into multiple storage sub-resources; allocating the storage sub-resources to at least one of a PF or a VF according to a preset allocation rule, and maintaining a resource allocation table including a mapping relationship between the storage sub-resources and at least one of PF or VF; receiving a host command sent by a virtual machine to a destination VF or by a virtual machine monitor to a destination PF; and searching the resource allocation table according to destination VF or destination PF, and performing, on a storage sub-resource corresponding to destination PF or destination VF and according to the mapping relationship between the storage sub-resources and the PF or the VF in the resource allocation table, an operation corresponding to the host command.
    Type: Application
    Filed: April 28, 2017
    Publication date: August 17, 2017
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Haiyan HU, Shaofeng SHEN, Miao TANG
  • Publication number: 20080157335
    Abstract: A semiconductor package has a substrate. The substrate comprises a set of interconnects. An dielectric material may be provided under one or more of the interconnects to adjust the impedance of transmission line.
    Type: Application
    Filed: December 28, 2006
    Publication date: July 3, 2008
    Inventors: Jia Miao Tang, Xiang Yin Zeng, Dao Qiang Lu, Jiang Qi He
  • Publication number: 20080157324
    Abstract: A method of forming a package, comprising providing a set of dies on a substrate. The dies may be stacked on the substrate and may be coupled to the substrate by an interconnect provided on a side surface of the stacked dies.
    Type: Application
    Filed: December 28, 2006
    Publication date: July 3, 2008
    Inventors: Jia Miao Tang, Xiang Yin Zeng, Dao Qiang Lu, Jiang Qi He
  • Publication number: 20080157322
    Abstract: A method of forming a package, comprising providing a set of dies on a substrate. The substrate may have a first die on its upper side and a second die on its lower side. A first interconnect may be provided in the substrate, wherein the first interconnect penetrates through the substrate to couple the dies to the substrate.
    Type: Application
    Filed: December 27, 2006
    Publication date: July 3, 2008
    Inventors: Jia Miao Tang, Xiang Yin Zeng, Daoqiang Lu, Jiangqi He