Patents by Inventor Miao Wen

Miao Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240122200
    Abstract: Provided is a functional edible oil (FEO), a preparation method therefor and use thereof. The FEO is prepared by ternary transesterification of medium-chain triglycerides (MCTs), oils rich in linoleic acid, and oils rich in linolenic acid. The fatty acid composition and distribution of the FEO were determined and optimized via comparative analysis of indexes such as melting point, and effect of improving glucose and lipid metabolism as determined by animal tests. The FEO has a mass ratio of 2.3 to 4.0 for medium chain fatty acids (MCFAs) in MCTs to long chain fatty acids (LCFAs) in the oils rich in linoleic acid, and oils rich in linolenic acid and a mass ratio of 0.5 to 1.0 for linoleic acid to linolenic acid in the LCFAs, by mass of fatty acids. The FEO is added to food products at ?18.00%.
    Type: Application
    Filed: October 14, 2021
    Publication date: April 18, 2024
    Inventors: Zheling ZENG, Guibing ZENG, Zhen OUYANG, Bo YANG, Ping YU, Jiaheng XIA, Maomao MA, Dongman WAN, Miao LUO, Cheng ZENG, Xuefang WEN
  • Patent number: 11940721
    Abstract: A projection display device and a projection display equipment are provided. The projection display device includes a display screen body, a photosensitive device, and a control module. The control module is electrically connected to the display screen body, the photosensitive device outputs a photosensitive signal when sensing a projection light beam, and the control module is electrically connected to the photosensitive device to receive the photosensitive signal and to control a section on the display screen body corresponding to a projection position of the projection light beam to be converted from a transparent state to an opaque state according to the photosensitive signal.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: March 26, 2024
    Assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventors: Lei Wen, Zhiqing Shi, Miao Jiang, Jiangbo Yao, Lixuan Chen, Xin Zhang
  • Publication number: 20240088395
    Abstract: An electrode plate includes an active material layer, a current collector including an insulating layer and first and second conductive layers sandwiching the insulating layer, and a conductive structure. The conductive structure includes a first conductive member including a first section arranged along a side of the first conductive layer and a second section extending from the first section and beyond the current collector in a direction away from the active material layer, and a second conductive member including a first connecting section connected to the second conductive layer, a bent section connected to the first connecting section and bent towards the first conductive member relative to the first connecting section, and a second connecting section bent backward relative to the bent section to be sandwiched between the first section and the first conductive layer.
    Type: Application
    Filed: November 23, 2023
    Publication date: March 14, 2024
    Inventors: Zige ZHANG, Wei LI, Jing LI, Qingrui XUE, Miao JIANG, Yuqian WEN, Long WANG
  • Publication number: 20240088396
    Abstract: A secondary battery includes an electrode assembly including current collecting sections, an electrode terminal, and an adapter sheet connecting the current collecting sections to the electrode terminal. The electrode assembly includes active material layer(s), current collector(s) each including an insulating layer and first and second conductive layers sandwiching the insulating layer, and conductive structures each including first and second conductive members. A portion of the first conductive member extending beyond the second conductive member forms a current collecting section. The current collecting sections are laminated with each other, with one of the current collecting sections directly contacting the adapter sheet. Neighboring ones of the current collecting sections directly contact each other, without any second conductive member arranged therebetween.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 14, 2024
    Inventors: Zige ZHANG, Wei LI, Jing LI, Qingrui XUE, Miao JIANG, Yuqian WEN, Long WANG
  • Publication number: 20240081360
    Abstract: Disclosed is a base oil for functional food oils and fats, a preparation method therefor and the use thereof. The base oil for functional food oils and fats is formed through ternary transesterification on medium-chain triglycerides, high-melting-point fat and oils rich in linolenic acid. The base oil for functional food oils and fats has a wide melting range, can significantly improve the glucose and lipid metabolism disorder, balance the essential and functional fatty acids in the body, and quickly replenish energy. Animal experiments were conducted and the fatty acid composition and distribution of the base oil were optimized and determined through comparative analysis based on evaluation indicators such as the improved effect in glucose and lipid metabolism and melting point.
    Type: Application
    Filed: December 31, 2021
    Publication date: March 14, 2024
    Applicant: Nanchang University
    Inventors: Zheling Zeng, Guibing Zeng, Zhen Ouyang, Bo Yang, Ping Yu, Jiaheng Xia, Maomao Ma, Dongman Wan, Miao Luo, Cheng Zeng, Xuefang Wen
  • Publication number: 20240058465
    Abstract: The present disclosure relates to antibodies and antibody conjugates, for instance antibody drug conjugates, with binding specificity for receptor tyrosine kinase orphan receptor 1 (ROR1) and its isoforms and homologs, and compositions comprising the antibodies or antibody conjugates, including pharmaceutical compositions. Also provided are methods of producing the antibodies and antibody conjugates and compositions thereof as well as methods of using the antibodies and antibody conjugates and compositions thereof, such as in therapeutic and diagnostic methods.
    Type: Application
    Filed: June 30, 2023
    Publication date: February 22, 2024
    Inventors: Amandeep Gakhal, Abigail Yu, Ryan Stafford, Jeffrey Hanson, Alice Yam, Krishna Bajjuri, Andreas Maderna, Cristina Abrahams, Xiaofan Li, Gang Yin, Miao Wen, Kristin Bedard, Daniel Calarese, Helena Kiefel
  • Publication number: 20240058467
    Abstract: The present disclosure relates to antibodies and antibody conjugates, for instance antibody drug conjugates, with binding specificity for receptor tyrosine kinase orphan receptor 1 (ROR1) and its isoforms and homologs, and compositions comprising the antibodies or antibody conjugates, including pharmaceutical compositions. Also provided are methods of producing the antibodies and antibody conjugates and compositions thereof as well as methods of using the antibodies and antibody conjugates and compositions thereof, such as in therapeutic and diagnostic methods.
    Type: Application
    Filed: July 10, 2023
    Publication date: February 22, 2024
    Inventors: AMANDEEP GAKHAL, ABIGAIL YU, RYAN STAFFORD, JEFFREY HANSON, ALICE YAM, KRISHNA BAJJURI, ANDREAS MADERNA, CRISTINA ABRAHAMS, XIAOFAN LI, GANG YIN, MIAO WEN, KRISTIN BEDARD, DANIEL CALARESE, HELENA KIEFEL
  • Patent number: 9887102
    Abstract: A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: February 6, 2018
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Tai-Tsung Hsu, Cheng-Yu Chiang, Miao-Wen Chen, Wen-Jung Chiang, Hsin-Hung Lee
  • Publication number: 20160181126
    Abstract: A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.
    Type: Application
    Filed: February 26, 2016
    Publication date: June 23, 2016
    Inventors: Tai-Tsung Hsu, Cheng-Yu Chiang, Miao-Wen Chen, Wen-Jung Chiang, Hsin-Hung Lee
  • Patent number: 9305885
    Abstract: A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.
    Type: Grant
    Filed: August 6, 2013
    Date of Patent: April 5, 2016
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Tai-Tsung Hsu, Cheng-Yu Chiang, Miao-Wen Chen, Wen-Jung Chiang, Hsin-Hung Lee
  • Publication number: 20140231972
    Abstract: A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.
    Type: Application
    Filed: August 6, 2013
    Publication date: August 21, 2014
    Applicant: Siliconware Precision Industries Co., Ltd.
    Inventors: Tai-Tsung Hsu, Cheng-Yu Chiang, Miao-Wen Chen, Wen-Jung Chiang, Hsin-Hung Lee
  • Publication number: 20140004597
    Abstract: The present disclosure provides optimized recombinant cells for the production of n-butanol. Methods for the use of these cells are also provided. Specifically, the utility of acylating aldehyde dehydrogenases and pyruvate:flavodoxin/ferredoxin-oxidoreductase for the improvement of n-butanol yields from recombinant cells is disclosed.
    Type: Application
    Filed: December 7, 2012
    Publication date: January 2, 2014
    Applicant: The Regents of the University of California
    Inventors: Michelle C.Y. CHANG, Brooks Bond-Watts, Miao Wen, Jeffrey A. Hanson