Patents by Inventor Miao-Wen Chen

Miao-Wen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing multi-chip package
    Patent number: 9887102
    Abstract: A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: February 6, 2018
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Tai-Tsung Hsu, Cheng-Yu Chiang, Miao-Wen Chen, Wen-Jung Chiang, Hsin-Hung Lee
  • METHOD FOR MANUFACTURING MULTI-CHIP PACKAGE
    Publication number: 20160181126
    Abstract: A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.
    Type: Application
    Filed: February 26, 2016
    Publication date: June 23, 2016
    Inventors: Tai-Tsung Hsu, Cheng-Yu Chiang, Miao-Wen Chen, Wen-Jung Chiang, Hsin-Hung Lee
  • Multi-chip package and method for manufacturing the same
    Patent number: 9305885
    Abstract: A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.
    Type: Grant
    Filed: August 6, 2013
    Date of Patent: April 5, 2016
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Tai-Tsung Hsu, Cheng-Yu Chiang, Miao-Wen Chen, Wen-Jung Chiang, Hsin-Hung Lee
  • MULTI-CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140231972
    Abstract: A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.
    Type: Application
    Filed: August 6, 2013
    Publication date: August 21, 2014
    Applicant: Siliconware Precision Industries Co., Ltd.
    Inventors: Tai-Tsung Hsu, Cheng-Yu Chiang, Miao-Wen Chen, Wen-Jung Chiang, Hsin-Hung Lee