Abstract: Test structures and methods for superconducting bump bond electrical characterization are used to verify the superconductivity of bump bonds that electrically connect two superconducting integrated circuit chips fabricated using a flip-chip process, and can also ascertain the self-inductance of bump bond(s) between chips. The structures and methods leverage a behavioral property of superconducting DC SQUIDs to modulate a critical current upon injection of magnetic flux in the SQUID loop, which behavior is not present when the SQUID is not superconducting, by including bump bond(s) within the loop, which loop is split among chips. The sensitivity of the bump bond superconductivity verification is therefore effectively perfect, independent of any multi-milliohm noise floor that may exist in measurement equipment.

Abstract: One example includes a flux switch system. The system includes an input stage configured to provide an interrogation pulse. The system also includes a plurality of flux loops configured to receive an input current. Each of the flux loops includes a Josephson junction configured to trigger to generate an output pulse in response to a first polarity of the input current and to not trigger to generate no output pulse in response to a second polarity of the input current opposite the first polarity. The system further includes an output stage configured to propagate the output pulse to an output of the flux switch system.

Abstract: One example includes a flux switch system. The system includes an input stage configured to provide an interrogation pulse. The system also includes a plurality of flux loops configured to receive an input current. Each of the flux loops includes a Josephson junction configured to trigger to generate an output pulse in response to a first polarity of the input current and to not trigger to generate no output pulse in response to a second polarity of the input current opposite the first polarity. The system further includes an output stage configured to propagate the output pulse to an output of the flux switch system.

Abstract: Test structures and methods for superconducting bump bond electrical characterization are used to verify the superconductivity of bump bonds that electrically connect two superconducting integrated circuit chips fabricated using a flip-chip process, and can also ascertain the self-inductance of bump bond(s) between chips. The structures and methods leverage a behavioral property of superconducting DC SQUIDs to modulate a critical current upon injection of magnetic flux in the SQUID loop, which behavior is not present when the SQUID is not superconducting, by including bump bond(s) within the loop, which loop is split among chips. The sensitivity of the bump bond superconductivity verification is therefore effectively perfect, independent of any multi-milliohm noise floor that may exist in measurement equipment.

Abstract: Test structures and methods for superconducting bump bond electrical characterization are used to verify the superconductivity of bump bonds that electrically connect two superconducting integrated circuit chips fabricated using a flip-chip process, and can also ascertain the self-inductance of bump bond(s) between chips. The structures and methods leverage a behavioral property of superconducting DC SQUIDs to modulate a critical current upon injection of magnetic flux in the SQUID loop, which behavior is not present when the SQUID is not superconducting, by including bump bond(s) within the loop, which loop is split among chips. The sensitivity of the bump bond superconductivity verification is therefore effectively perfect, independent of any multi-milliohm noise floor that may exist in measurement equipment.

Abstract: Test structures and methods for superconducting bump bond electrical characterization are used to verify the superconductivity of bump bonds that electrically connect two superconducting integrated circuit chips fabricated using a flip-chip process, and can also ascertain the self-inductance of bump bond(s) between chips. The structures and methods leverage a behavioral property of superconducting DC SQUIDs to modulate a critical current upon injection of magnetic flux in the SQUID loop, which behavior is not present when the SQUID is not superconducting, by including bump bond(s) within the loop, which loop is split among chips. The sensitivity of the bump bond superconductivity verification is therefore effectively perfect, independent of any multi-milliohm noise floor that may exist in measurement equipment.

Abstract: One example includes a Josephson analog-to-digital converter (ADC) system. The system includes a control line inductively coupled to an input signal line on which an input analog signal is provided. The input signal line can be inductively coupled to the control line to propagate an induced input current that is based on the input analog signal on the control line. The system also includes at least one Josephson transmission line (JTL) stage that is biased via a DC bias current and is configured to generate an output pulse in response to the induced input current and the DC bias current exceeding a predetermined threshold current associated with the at least one JTL stage.

Abstract: Real-time reconfigurability of quantum object connectivity can be provided with one or more quantum routers that can each be configured as either or both of a single-pole double-throw switch and a cross-point switch. The quantum router includes variable-inductance coupling elements in RF-SQUIDs having inductors transformer-coupled to two control flux lines, one providing a static current and the other providing a dynamic current, the direction of which can be toggled to couple or uncouple quantum objects, such as qubits, based on the dynamic current direction to provide reconfigurable quantum routing.

Abstract: Real-time reconfigurability of quantum object connectivity can be provided with one or more quantum routers that can each be configured as either or both of a single-pole double-throw switch and a cross-point switch. The quantum router includes variable-inductance coupling elements in RF-SQUIDs having inductors transformer-coupled to two control flux lines, one providing a static current and the other providing a dynamic current, the direction of which can be toggled to couple or uncouple quantum objects, such as qubits, based on the dynamic current direction to provide reconfigurable quantum routing.

Abstract: A tunable bus-mediated coupling system is provided that includes a first input port coupled to a first end of a variable inductance coupling element through a first resonator and a second input port coupled to a second end of the variable inductance coupling element through a second resonator. The first input port is configured to be coupled to a first qubit, and the second output port is configured to be coupled to a second qubit. A controller is configured to control the inductance of the variable inductance coupling element between a low inductance state to provide strong coupling between the first qubit and the second qubit and a high inductance state to provide isolation between the first qubit and the second qubit.

Abstract: A tunable bus-mediated coupling system is provided that includes a first input port coupled to a first end of a variable inductance coupling element through a first resonator and a second input port coupled to a second end of the variable inductance coupling element through a second resonator. The first input port is configured to be coupled to a first qubit, and the second output port is configured to be coupled to a second qubit. A controller is configured to control the inductance of the variable inductance coupling element between a low inductance state to provide strong coupling between the first qubit and the second qubit and a high inductance state to provide isolation between the first qubit and the second qubit.