Patents by Inventor Micallaef Ivan

Micallaef Ivan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lid for micro-electro-mechanical device and method for fabricating the same
    Patent number: 8610006
    Abstract: A lid for a micro-electro-mechanical device and a method for fabricating the same are provided. The lid includes a board with opposite first and second surfaces and a first conductor layer. The first surface has a first metal layer thereon. The first metal layer and the board have a recess formed therein. The recess has a bottom surface and a side surface adjacent thereto. The first conductor layer is formed on the first metal layer and the bottom and side surfaces of the recess. The shielding effect of the side surface of the board is enhanced because of the recess integral to the board, the homogeneous bottom and side surfaces of the recess, and the first conductor layer covering the first metal layer, the bottom and side surfaces of the recess.
    Type: Grant
    Filed: October 23, 2009
    Date of Patent: December 17, 2013
    Assignee: Unimicron Technology Corporation
    Inventors: Shih-Ping Hsu, Kun-Chen Tsai, Micallaef Ivan
  • LID FOR MICRO-ELECTRO-MECHANICAL DEVICE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20100108345
    Abstract: A lid for a micro-electro-mechanical device and a method for fabricating the same are provided. The lid includes a board with opposite first and second surfaces and a first conductor layer. The first surface has a first metal layer thereon. The first metal layer and the board have a recess formed therein. The recess has a bottom surface and a side surface adjacent thereto. The first conductor layer is formed on the first metal layer and the bottom and side surfaces of the recess. The shielding effect of the side surface of the board is enhanced because of the recess integral to the board, the homogeneous bottom and side surfaces of the recess, and the first conductor layer covering the first metal layer, the bottom and side surfaces of the recess. Hence, the shielding effect upon the micro-electro-mechanical device is enhanced.
    Type: Application
    Filed: October 23, 2009
    Publication date: May 6, 2010
    Applicant: UNIMICRON TECHNOLOGY CORPORATION
    Inventors: Shih-Ping Hsu, Kun-Chen Tsai, Micallaef Ivan