Abstract: The present disclosure relates to a multilayer laminate structure may include a glass substrate having a thickness of not greater than about 300 microns, a fluoropolymer based layer, and an adhesive layer in contact with the fluoropolymer based layer and between the glass substrate and the fluoropolymer based layer. The adhesive layer comprises an adhesive component and a first adhesive layer ultraviolet (UV) absorber component. The multilayer laminate structure may have a lower ultraviolet light transmission (L-UVLT) of not greater than 1.0%, a high ultraviolet light transmission (H-UVLT) of not greater than 5.0%, and a visual light transmission (VLT) of at least about 50.0%.

Abstract: The present disclosure relates to a multilayer film may include a fluoropolymer based layer that may include a fluoropolymer based material, and an adhesive layer in contact with the fluoropolymer based layer. The adhesive layer may include a first ultra-violet (UV) absorber component. The multilayer film may have a lower ultra-violet light transmission (L-UVLT) of not greater than 1.0%, where the L-UVLT of the multilayer film is defined as the percent transmission between 200 nm and 360 nm. The multilayer film may further have a high ultra-violet light transmission (H-UVLT) of not greater than 5.0%, where the H-UVLT of the multilayer film is defined as the percent transmission between 360 nm and 380 nm. The multilayer film may include a visual light transmission (VLT) of at least about 50.0%, where the VLT of the multilayer film is defined as the percent transmission between 400 nm and 1100 nm.

Abstract: The present disclosure relates to a multilayer laminate structure may include a glass substrate having a thickness of not greater than about 300 microns, a fluoropolymer based layer, and an adhesive layer in contact with the fluoropolymer based layer and between the glass substrate and the fluoropolymer based layer. The fluoropolymer based layer may include a fluoropolymer based material and a first fluoropolymer based layer ultraviolet (UV) component. The multilayer laminate structure may have a lower ultraviolet light transmission (L-UVLT) of not greater than 1.0%, a high ultraviolet light transmission (H-UVLT) of not greater than 5.0%, and a visual light transmission (VLT) of at least about 50.0%.

Abstract: A novel method of producing an encapsulated light emitting device. A preferred mold release film that can be used during the encapsulation of a LED chip has an elastic modulus and a glass transition temperature that are low enough as compared to the desired molding temperature that the release film will closely conform to the interior of the molding cavities used to form a protective lens surrounding an LED chip. A preferred release film according to embodiments of the present invention comprises a fully fluorinated polymer, such as a perfluoroalkoxy polymer, including MFA, or fluorinated ethylene propylene.

Abstract: A silicone-free release film comprises a linear ethylenic polymer having a density from 0.865 to 0.900 g/cc and an index of polydispersity of less than 5.0 and yields a maximum release force value of 39 g/cm at a film thickness of 0.10 to 0.15 mm in an adhesive peel test. The film is useful in manufacturing rolls and sheets of pressure-sensitive adhesive tape.

Abstract: A silicone-free release film comprises a linear ethylenic polymer having a density from 0.865 to 0.900 g/cc and an index of polydispersity of less than 5.0 and yields a maximum release force value of 39 g/cm at a film thickness of 0.10 to 0.15 mm in an adhesive peel test. The film is useful in manufacturing rolls and sheets of pressure-sensitive adhesive tape.