Patents by Inventor Michael A. Bayne
Michael A. Bayne has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7266889Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: GrantFiled: January 14, 2005Date of Patent: September 11, 2007Assignee: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Publication number: 20070074392Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: ApplicationFiled: December 1, 2006Publication date: April 5, 2007Inventors: Reed Gleason, Michael Bayne, Kenneth Smith
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Patent number: 7178236Abstract: A method for constructing a membrane probe that includes providing a substrate, and creating a depression within the substrate. Conductive material is located within the depression and a conductive trace is connected to the conductive material. A membrane is applied to support the conductive material and the substrate is removed from the conductive material.Type: GrantFiled: April 16, 2003Date of Patent: February 20, 2007Assignee: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith
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Publication number: 20050136562Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: ApplicationFiled: January 14, 2005Publication date: June 23, 2005Inventors: Reed Gleason, Michael Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Patent number: 6860009Abstract: A method of constructing a probe which includes providing a substrate and creating a first substantially asymmetrical recess within the substrate. A conductive material is located within the recess and a conductive trace is electrically connected with the conductive material. A membrane supports the conductive trace, wherein the conductive material is located between the membrane and the substrate. The substrate is removed from the conductive material.Type: GrantFiled: March 22, 2001Date of Patent: March 1, 2005Assignee: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Patent number: 6825677Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material islocated within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: GrantFiled: March 22, 2001Date of Patent: November 30, 2004Assignee: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Publication number: 20040154155Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: ApplicationFiled: February 3, 2004Publication date: August 12, 2004Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Publication number: 20040093716Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: ApplicationFiled: November 10, 2003Publication date: May 20, 2004Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Patent number: 6708386Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: GrantFiled: March 22, 2001Date of Patent: March 23, 2004Assignee: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Publication number: 20030192183Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: ApplicationFiled: April 16, 2003Publication date: October 16, 2003Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith
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Patent number: 6578264Abstract: A method for constructing a membrane probe that includes providing a substrate, and creating a depression within the substrate. Conductive material is located within the depression and a conductive trace is connected to the conductive material. A membrane is applied to support the conductive material and the substrate is removed from the conductive material.Type: GrantFiled: April 11, 2000Date of Patent: June 17, 2003Assignee: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith
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Publication number: 20010030549Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: ApplicationFiled: March 22, 2001Publication date: October 18, 2001Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Publication number: 20010010468Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: ApplicationFiled: March 22, 2001Publication date: August 2, 2001Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Publication number: 20010009061Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: ApplicationFiled: March 22, 2001Publication date: July 26, 2001Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Patent number: 6256882Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: GrantFiled: July 14, 1998Date of Patent: July 10, 2001Assignee: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Patent number: 4726967Abstract: In an isotope separation system in which hot, isotopically separated vapor is deposited on enriched product and depleted tails plates, deposit adherence is improved and plate cooling simplified. The tails plate is liquid-cooled to a lower temperature which permits the product plate to be radiatively cooled by it simplifying product plate cooling and lowering its temperature to reduce the tendency for the product plate deposit to separate during temperature cycling. In one embodiment plate surfaces are cleaned of impurities in a vacuum by allowing the temperature of the tails plates to reach the relatively low operating temperature prior to proceeding with the deposition. In another embodiment plate surfaces are provided with rough surfaces to promote air penetration during deposit stripping, which permits the formation of a brittle, more easily severed bond between plate and deposit.Type: GrantFiled: June 30, 1983Date of Patent: February 23, 1988Assignee: Jersey Nuclear-Avco Isotopes, Inc.Inventors: Paul N. Arendt, Michael A. Bayne, Lester M. Finch
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Patent number: 4305801Abstract: A line-of-sight method of depositing a film having substantially 100% of theoretical density on a substrate. A pressure vessel contains a target source having a surface thereof capable of emitting particles therefrom and a substrate with the source surface and the substrate surface positioned such that the source surface is substantially parallel to the direction of the particles impinging upon the substrate surface, the distance between the most remote portion of the substrate surface receiving the particles and the source surface emitting the particles in a direction parallel to the substrate surface being relatively small. The pressure in the vessel is maintained less than about 5 microns to prevent scattering and permit line-of-sight deposition. By this method the angles of incidence of the particles impinging upon the substrate surface are in the range of from about 45.degree. to 90.degree. even when the target surface area is greatly expanded to increase the deposition rate.Type: GrantFiled: April 16, 1980Date of Patent: December 15, 1981Assignee: The United States of America as represented by the United States Department of EnergyInventors: James W. Patten, Edwin D. McClanahan, Michael A. Bayne