Patents by Inventor Michael A. Brayan

Michael A. Brayan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cleaving process to fabricate multilayered substrates using low implantation doses
    Patent number: 6500732
    Abstract: A method of forming substrates. The method includes providing a donor substrate; and forming a cleave layer comprising a cleave plane on the donor substrate. The cleave plane extends from a periphery of the donor substrate through a center region of the substrate. The method also includes forming a device layer on the cleave layer. The method also includes selectively introducing a plurality of particles along the periphery of the cleave plane to form a higher concentration region at the periphery and a lower concentration region in the center region. Selected energy is provided to the donor substrate to initiate a cleaving action at the higher concentration region at the periphery of the cleave plane to cleave the device layer at the cleave plane.
    Type: Grant
    Filed: July 27, 2000
    Date of Patent: December 31, 2002
    Assignee: Silicon Genesis Corporation
    Inventors: Francois J. Henley, Michael A. Brayan, William G. En