Abstract: Moisture curable RTV-1 silicone elastomers with hydrophilic surfaces are produced from crosslinkable compositions containing a polyoxyethylene ether glycol terminated with both a C6-22 hydrocarbon group and an alkoxysilyl group.

Abstract: Compounds of the formula where R1 each individually is identical or different and is a hydrocarbon radical, R2 each individually is hydrogen or a methyl radical, n is an integer from 6 to 11, and m is 0 or 1, with the proviso that the sum of the number of carbon atoms in the three radicals R1 in the compound of the formula (I) is 6 to 24, can be admixed with curable polymer compositions to form products with hydrophilic surfaces, or can be applied to surfaces to render them hydrophilic.

Abstract: Various methods, devices, and systems are described for cloud federation in a cloud computing network including bridging computing resources between an enterprise and a cloud or among multiple clouds. These techniques involve generating an image of the host system and decoupling it from its underlying computing resources so that it can be migrated across disparate computing resources in a seamless manner. In one embodiment, an enterprise workload can be bridged with cloud resources to receive software as a service. In other embodiments, bridging is performed across multiple public or private clouds, each potentially having disparate computing resources. In addition, users can access and use these cloud services through a web browser or other network interface anywhere in the cloud computing network as if the services were installed locally on their own computer.

Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a method for forming a microelectronic device includes attaching a microelectronic die to a support member by forming an attachment feature on at least one of a back side of the microelectronic die and the support member. The attachment feature includes a volume of solder material. The method also includes contacting the attachment feature with the other of the microelectronic die and the support member, and reflowing the solder material to join the back side of the die and the support member via the attachment feature. In several embodiments, the attachment feature is not electrically connected to internal active structures of the die.

Abstract: The present disclosure describes compounds of Formula (I) wherein m is 1 to 6, n is 6 to 10 and R1 is a straight or branch chain siloxane, their use in methods to modify the surface of hydrophobic substrates to render the substrates superhydrophilic and surface-modified substrates.

Abstract: An amperometric probe suitable for monitoring chlorine levels in water is described. The probe has low power consumption and maintenance requirements rendering it particularly suitable for long periods of operation in remote locations with portable power supplies.

Abstract: An improved stacked-die package includes an interposer which improves the manufacturability of the package. A semiconductor package includes a package substrate having a plurality of bond pads; a first semiconductor device mounted on the package substrate, the first semiconductor device having a plurality of bond pads provided thereon; an interposer mounted on the first semiconductor device, the interposer having a first interposer bond pad and a second interposer bond pad, wherein the first and second interposer bond pads are electrically coupled; a second semiconductor device mounted on the interposer, the second semiconductor device having a plurality of bond pads provided thereon; a first bond wire connected to one of the plurality of bond pads on said first semiconductor and to the first interposer bond pad; and a second bond wire connected to the second interposer bond pad and to one of the plurality of bond pads on the semiconductor device.

Abstract: The present disclosure describes compounds of Formula (I) wherein m is 1 to 6, n is 6 to 10 and R1 is a straight or branch chain siloxane, their use in methods to modify the surface of hydrophobic substrates to render the substrates superhydrophilic and surface-modified substrates.

Abstract: The present invention relates to novel silicon-based polymers, particularly silicon-based polymers having citrate groups, and their use as chelating agents, for forming nanostructures, as surfactants, as reducing agents and as stabilizers.

Abstract: An improved stacked-die package includes an interposer which improves the manufacturability of the package. A semiconductor package includes a package substrate having a plurality of bond pads; a first semiconductor device mounted on the package substrate, the first semiconductor device having a plurality of bond pads provided thereon; an interposer mounted on the first semiconductor device, the interposer having a first interposer bond pad and a second interposer bond pad, wherein the first and second interposer bond pads are electrically coupled; a second semiconductor device mounted on the interposer, the second semiconductor device having a plurality of bond pads provided thereon; a first bond wire connected to one of the plurality of bond pads on said first semiconductor and to the first interposer bond pad; and a second bond wire connected to the second interposer bond pad and to one of the plurality of bond pads on the semiconductor device.

Abstract: Various methods, devices, and systems are described for cloud federation in a cloud computing network including bridging computing resources between an enterprise and a cloud or among multiple clouds. These techniques involve generating an image of the host system and decoupling it from its underlying computing resources so that it can be migrated across disparate computing resources in a seamless manner. In one embodiment, an enterprise workload can be bridged with cloud resources to receive software as a service. In other embodiments, bridging is performed across multiple public or private clouds, each potentially having disparate computing resources. In addition, users can access and use these cloud services through a web browser or other network interface anywhere in the cloud computing network as if the services were installed locally on their own computer.

Abstract: A personal growth system and method for personal growth are provided. The personal growth system may be web-enabled and may include a communication interface operable to communicate with an endpoint user interface. The user interface generally includes a display area. The personal growth program is operable to generate, for a user in the display area, a first information request for the user and to obtain first user input relating to the user's current state of being. The personal growth system also may include a recommendation database defining guided experiences, each of which may include at least one instruction that leads the user through the guided experience. The personal growth system may communicate applicable guided experiences to the endpoint based on the first user input. The instructions of the guided experiences may specify an act intended to generate a result.

Abstract: Microelectronic devices and methods for manufacturing microelectronic devices are described herein. An embodiment of one such method includes attaching a plurality of singulated microelectronic dies to a removable support member with an active side of the individual dies facing toward the support member, depositing a flowable material onto the dies and a portion of the removable support member such that the flowable material covers a back side of the individual dies and is disposed between adjacent dies, and removing the support member from the active sides of the dies.

Abstract: Packaged semiconductor components, apparatus for packaging semiconductor devices, methods of packaging semiconductor devices, and methods of manufacturing apparatus for packaging semiconductor devices. One embodiment of an apparatus for packaging semiconductor devices comprises a first board having a front side, a backside, arrays of die contacts, arrays of first backside terminals electrically coupled to the die contacts, arrays of second backside terminals, and a plurality of individual package areas that have an array of the die contacts, an array of the first backside terminals, and an array of the second backside terminals.

Abstract: An improved stacked-die package includes an interposer which improves the manufacturability of the package. A semiconductor package includes a package substrate having a plurality of bond pads; a first semiconductor device mounted on the package substrate, the first semiconductor device having a plurality of bond pads provided thereon; an interposer mounted on the first semiconductor device, the interposer having a first interposer bond pad and a second interposer bond pad, wherein the first and second interposer bond pads are electrically coupled; a second semiconductor device mounted on the interposer, the second semiconductor device having a plurality of bond pads provided thereon; a first bond wire connected to one of the plurality of bond pads on said first semiconductor and to the first interposer bond pad; and a second bond wire connected to the second interposer bond pad and to one of the plurality of bond pads on the semiconductor device.

Abstract: A packaged insulation product is provided comprising at least one insulation product oriented for storage or transportation and disposed in a package, wherein the package comprises a vapor-permeable membrane.

Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a method for forming a microelectronic device includes attaching a microelectronic die to a support member by forming an attachment feature on at least one of a back side of the microelectronic die and the support member. The attachment feature includes a volume of solder material. The method also includes contacting the attachment feature with the other of the microelectronic die and the support member, and reflowing the solder material to join the back side of the die and the support member via the attachment feature. In several embodiments, the attachment feature is not electrically connected to internal active structures of the die.