Patents by Inventor Michael A. Brueggeman

Michael A. Brueggeman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transfer molded PCMCIA standard cards
    Patent number: 6128195
    Abstract: A transfer molded PC card standard or small form factor card electronic package includes a substrate that has an integrated circuit package thereon and an electrical connector along a side of the substrate. In addition, an upper cover extends over at least a portion of the substrate and the electrical connector. A lower cover extends over at least a portion of the substrate and the electrical connector and a transfer molded encapsulant covers the substrate and a portion of the upper cover and the lower cover. The portion of the upper cover and the lower cover are covered by the encapsulant and includes a first flange attached to a portion of a periphery of the upper cover and a second flange that is attached to a portion of the periphery of the lower cover.
    Type: Grant
    Filed: November 18, 1997
    Date of Patent: October 3, 2000
    Assignee: Hestia Technologies, Inc.
    Inventors: Patrick O. Weber, Michael A. Brueggeman
  • Method of transfer molding electronic packages and packages produced thereby
    Patent number: 5766986
    Abstract: A printed wiring board with either a pin grid array, a ball grid array, a land grid array, etc. of electrical contacts is prepared with a heat sink in the usual manner. A passage is provided either in the printed wiring board or in the heat sink so that during the transfer molding process, fluid molding compound passes latitudinally under the heat sink into a cavity below the heat sink to encapsulate the package.
    Type: Grant
    Filed: March 18, 1996
    Date of Patent: June 16, 1998
    Assignee: Hestia Technologies, Inc.
    Inventors: Patrick O. Weber, Michael A. Brueggeman
  • Transfer modlded electronic package having a passage means
    Patent number: 5652463
    Abstract: A printed wiring board with either a pin grid array, a ball grid array, a land grid array, etc. of electrical contacts is prepared with a heat sink in the usual manner. A passage is provided either in the printed wiring board or in the heat sink so that during the transfer molding process, fluid molding compound passes latitudinally under the heat sink into a cavity below the heat sink to encapsulate the package.
    Type: Grant
    Filed: May 26, 1995
    Date of Patent: July 29, 1997
    Assignee: Hestia Technologies, Inc.
    Inventors: Patrick O. Weber, Michael A. Brueggeman
  • Semiconductor structure having alpha particle resistant film and method of making the same
    Patent number: 4653175
    Abstract: An applique of a prepatterned film of alpha particle resistant material, such as polyimide, is applied to a semiconductor wafer. The prepatterned film covers only the critical areas e.g. those affected by alpha particle impingement. Bond pads and scribe streets are not covered by the applique.
    Type: Grant
    Filed: March 4, 1986
    Date of Patent: March 31, 1987
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Michael Brueggeman, James W. Clark, William S. Phy