Abstract: An improved plating tank having a tank separator which segregates the tank into an upper tank and a lower tank. A plating chamber attached to the tank separator encases a rack having one or more surfaces for supporting semiconductor wafers to be plated. A chamber passage formed of an inner surface of the chamber is connected between an opening in the tank separator and the upper tank to allow solution pumped from the lower tank to the upper tank to pass through the tank separator opening into the chamber passage and to flow over the anodes and the wafers.