Abstract: An apparatus and method are provided for the automatic operation of a manipulator to move a test head or peripheral into position for proper alignment and docking of the test head with the peripheral. Examples of peripherals include a handler and a prober. Sensors are provided to obtain relative positional information of the test head in the relation to the peripheral, allowing a controller to issue instructions to the manipulator to correct differences in each of the six degrees of freedom between the mating surfaces of the test head and the manipulator.

Abstract: An apparatus and method are provided for the automatic operation of a manipulator to move a test head or peripheral into position for proper alignment and docking of the test head with the peripheral. Examples of peripherals include a handler and a prober. Sensors are provided to obtain relative positional information of the test head in the relation to the peripheral, allowing a controller to issue instructions to the manipulator to correct differences in each of the six degrees of freedom between the mating surfaces of the test head and the manipulator.

Abstract: A subassembly to aid in changing the interface unit for an automatic test system. The disclosed embodiment shows an automatic test system with a handler and a tester. The interface unit is a device interface board (DIB). The subassembly allows the DIB to be easily accessed, yet can be properly aligned to the test system. No special tools are required to change the DIB.

Abstract: A semiconductor test system that includes a tester, a material handling unit and a manipulator that positions the tester relative to the material handling unit. The manipulator is in the form of a cart that can be wheeled to the material handling unit. The cart is attached to the mateiral handling unit to provide course positioning of the tester relative to the handling unit. Major motion of the test head is constrained to an axis perpendicular to the mating interface of the material handling unit. However, compliant motion, with up to six degrees of freedom, is possible in a complaint zone near the handler. In this way, alignment units on the tester and material handling unit can accurately control the final positioning of the tester relative to the material handling unit.

Abstract: A semiconductor test system that includes a tester, a material handling unit and a manipulator that positions the tester relative to the material handling unit. The manipulator is in the form of a cart that can be wheeled to the material handling unit. The cart is attached to the mateiral handling unit to provide course positioning of the tester relative to the handling unit. Major motion of the test head is constrained to an axis perpendicular to the mating interface of the material handling unit. However, compliant motion, with up to six degrees of freedom, is possible in a complaint zone near the handler. In this way, alignment units on the tester and material handling unit can accurately control the final positioning of the tester relative to the material handling unit.

Abstract: A subassembly to aid in changing the interface unit for an automatic test system. The disclosed embodiment shows an automatic test system with a handler and a tester. The interface unit is a device interface board (DIB). The subassembly allows the DIB to be easily accessed, yet can be properly aligned to the test system. No special tools are required to change the DIB.

Abstract: An interface between a test head portion of automatic test equipment and handling device such as a prober. The interface employs preloaded kinematic couplings between the test head and handling device and between the probe card and the test head. These couplings allow the probe card to be repeatedly positioned relative to the component in the handling device. They also reduce forces on the probe card to prevent distortion of the probe card. The interface provide seperate mechanical and electrical loops such that mechanical position is not dependant on the electrical structure.

Abstract: A kinematic coupling for a test system with a test head which must be docked with a handling device. The coupling is implemented with a plurality of modules attached to the test head. Each module has one kinematic surface and is designed to mate with another kinematic surface on the handling device. Each module includes a motor which can extend or retract the kinematic surface. These modules allow docking of the test head to the handling device with a final motion perpendicular to the handler. They also allow the tilt angle between the test head and the handler to be adjusted to achieve planarization.

Abstract: An interface between a test head portion of automatic test equipment and a handling device such as a prober. The interface employs preloaded kinematic couplings between the test head and the handling device and between the probe card and the test head. These couplings allow the probe card to be repeatedly positioned relative to the component in the handling device. They also reduce forces on the probe card to prevent distortion of the probe card. The interface provides separate mechanical and electrical loops such that mechanical precision is not dependant on the electrical structure.