Abstract: In various embodiments, high temperature printed circuit boards are disclosed. In one embodiment, a high temperature printed circuit board (PCB) comprises a first reinforced pre-impregnated layer and a second reinforced pre-impregnated layer. The first reinforced pre-impregnated layer and the second reinforced pre-impregnated layer comprise a plurality of glass fibers having a warp and a weft and impregnated with a polyimide high-temperature resin adhesive. A flexible metal-clad polyimide laminate material is located between the first reinforced pre-impregnated layer and the reinforced second pre-impregnated layer. The flexible metal-clad polyimide laminate material comprises a plurality of conductive traces. A polyimide film is disposed over the first pre-impregnated layer and the second pre-impregnated layer.

Abstract: Scent emitting blind operating apparatus including a hollow rod, defining an inner chamber, with a closed end and an open end, with the inner chamber of the rod being designed to receive and hold scented material. A blind engaging plug is removably positioned in the open end of the hollow rod for operative engagement with a blind so as to position the inner chamber generally vertically with the closed end directed downwardly. A sleeve of absorbent material is frictionally engaged over the closed end of the hollow rod and an opening is formed through the hollow rod and positioned to communicate the inner chamber with the absorbent material for directing scented material from the inner chamber into the absorbent material.