Abstract: Generally speaking, a system with a metallic component and a thermoplastic component is disclosed. The metallic component may include a metallic outer surface and the thermoplastic component may be formed around the metallic outer surface to create a seal between the thermoplastic housing and the metallic component. In some embodiments, the thermoplastic component may include an inner surface and an outer surface where the inner surface is formed adjacent to an in contact with the metallic outer surface. Embodiments may also include a sealing ring positioned on the outer surface of the thermoplastic housing to provide a compressive spring force to the thermoplastic housing, where the force applied to the thermoplastic housing improves the seal between the thermoplastic component and the metallic component. In a further embodiment, the metallic component is a metallic cold plate and the thermoplastic component is a thermoplastic pump housing. Other embodiments are disclosed and claimed.

Abstract: A wireless communication system (20) includes a base station (22) that is capable of communicating with a plurality of mobile stations (24). The base station includes a modular device (50) that allows flexibility in locating the various operative electronic components (52, 54, 56, 58) of the base station. Disclosed examples include a radio frequency head module (55) that packages components traditionally associated and located with a radio in a manner that allows them to be located with the Tx and Rx portions of the radio or at a remote location. One example includes a radio frequency coupling for communications between the radio (54) and the radio frequency head module (55). Other examples include intermediate frequency couplings (70, 74).

Abstract: According to some embodiments, systems for an integrated pump and reservoir may be provided. In some embodiments, a pump may comprise a housing defining an inlet to accept a fluid and an outlet to evacuate the fluid, an impeller disposed within the housing, wherein the impeller is to move the fluid toward the outlet, a motor to power the impeller, a reservoir hydraulically coupled to the inlet, and a cold plate disposed at least partially within the housing.

Abstract: According to some embodiments, systems for low cost coaxial liquid cooling may be provided. In some embodiments, a system may comprise an axis. The system may further comprise a heat exchanger coupled to a pump, wherein the heat exchanger and the pump are oriented with respect to the axis.

Abstract: According to some embodiments, systems for an integrated cold plate and heat exchanger may be provided. In some embodiments, a device may comprise a cold plate to transfer heat to a fluid and a heat spreader integral with the cold plate, the heat spreader to accept heat from an electronic device. In some embodiments, the heat spreader and the cold plate are monolithic.

Abstract: According to some embodiments, a first sealing portion is provided on a valve shaft to seal a chamber. The first sealing portion may, for example, seal the chamber when the valve shaft is inserted a first distance into an opening of the chamber. A second sealing portion may also be provided on the valve shaft to seal the chamber when the valve shaft is inserted a second distance into the opening.

Abstract: According to some embodiments, a method, system, and apparatus to provide thermal management control. In some embodiments, the method includes receiving, by a control mechanism, a plurality of temperature representative signals from a plurality of temperature sensors, receiving a command signal from the control mechanism by an output weighting matrix mechanism, and controlling at least one thermal cooling device with at least one weighted output signal from the output weighting matrix mechanism.

Abstract: According to some embodiments, systems for low cost liquid cooling may be provided. In some embodiments, a system may comprise a core having a first end and a second end, wherein the core defines a cavity extending between the first and second ends, a plurality of fins extending outwardly from the core between the first and second ends, an inlet to accept a fluid, an outlet to evacuate the fluid, and a shaped element disposed within the cavity of the core, wherein the shaped element is to direct the fluid within the cavity. According to some embodiments, the system may further comprise a pump that may comprise a housing defining an inlet to accept the fluid and an outlet to evacuate the fluid, an impeller disposed within the housing, wherein the impeller is to move the fluid toward the outlet, a motor to power the impeller, and a cold plate disposed at least partially within the housing.

Abstract: According to some embodiments, systems for an improved heat exchanger may be provided. In some embodiments, a heat exchanger may comprise a core defining a cavity, a plurality of fins extending outwardly from the core, and an element disposed within the cavity of the core, wherein the element is to direct fluid within the cavity.

Abstract: According to some embodiments, systems for an integrated pump and cold plate may be provided. In some embodiments, a pump may comprise a housing defining an inlet to accept a fluid and an outlet to evacuate the fluid, an impeller disposed within the housing, wherein the impeller is to move the fluid toward the outlet, a motor to power the impeller, and a cold plate disposed at least partially within the housing. In some embodiments, the pump may also or alternatively comprise a motor to power the impeller, wherein the motor comprises a rotor and at least two magnets disposed within the housing and at least two electromagnetic coils disposed outside of the housing.

Abstract: In some embodiments, a passive noise attenuator reduces fan noise in an electronic system. Other embodiments are disclosed and claimed.

Abstract: An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.

Abstract: Disclosed is a focal balloon having at least one reference zone and a focal zone. In one embodiment, the reference zone and focal zone are inflatable to a first generally cylindrical profile at a first pressure. At a second, greater pressure, the focal section expands to a second, greater diameter, while the reference zone remains substantially at the first diameter. In an alternate embodiment, the focal zone and the reference zone are inflatable to their respective predetermined diameters at the inflation pressure, in the absence of constricting lesions or anatomical structures. Multiple lobed and drug delivery embodiments are also disclosed.

Abstract: Disclosed is a focal balloon having at least one reference zone and a focal zone. In one embodiment, the reference zone and focal zone are inflatable to a first generally cylindrical profile at a first pressure. At a second, greater pressure, the focal section expands to a second, greater diameter, while the reference zone remains substantially at the first diameter. In an alternate embodiment, the focal zone and the reference zone are inflatable to their respective predetermined diameters at the inflation pressure, in the absence of constricting lesions or anatomical structures. Multiple lobed and drug delivery embodiments are also disclosed.

Abstract: A heat sink (and method of forming a heat sink) is provided that includes a core having a central axis and a plurality of cooling fins arranged about the core. Each fin has a base and a tip. The fins may be shaped to capture a tangential component of air from the fan. At least one portion (such as upper portion) of the fins may be bent. A lower portion of each fin may also be bent.

Abstract: A retention mechanism for an electronic assembly which has a substrate and a heat sink. The retention mechanism includes a substrate slot that receives the substrate and a heat sink slot that receives the heat sink. There may be two retention mechanisms that are attached to a printed circuit board adjacent to an electrical connector. There may be two heat sink slots symmetrically located about the substrate slot so that the mechanism can be mounted to a left side or a right side of the connector. The symmetric slots eliminate the need for a left side mechanism and a right side mechanism. The retainer mechanism may also have a nut retainer that captures a nut that is used to attach the mechanism to the printed circuit board. The nut retainer allows the nut to be transported with the retainer mechanism during an assembly process.

Abstract: Disclosed is a balloon catheter having an inflatable balloon having a radiation carrier such as a radiation delivery layer thereon. In one embodiment, the radiation delivery layer comprises one or more layers of metal foil, such as gold. The foil is irradiated, and the balloon is thereafter positioned at a treatment site in a vessel and expanded to bring the metal foil layer into close proximity with the vessel wall. In another embodiment, the radiation carrier is in the form of a dopant in the balloon material. Methods of using the balloon include radiation dosing a site following a balloon dilatation or other procedure, and simultaneously performing balloon angioplasty and radiation dosing.

Abstract: Disclosed are sources and methods for delivering a radioactive dose to a site in a body lumen. The sources are preferably mounted on a balloon or other expandable or deployable mechanical structure. The source and methods enable delivery of a clinically significant dose of radiation into a vessel wall in a relatively short time while using a relatively low activity. The sources also enable delivery of a substantially uniform dose into the vessel wall, whether or not such delivery is through the wall of a stent.

Abstract: A retention mechanism for an electronic assembly which has a substrate and a heat sink. The retention mechanism includes a substrate slot that receives the substrate and a heat sink slot that receives the heat sink. There may be two retention mechanisms that are attached to a printed circuit board adjacent to an electrical connector. There may be two heat sink slots symmetrically located about the substrate slot so that the mechanism can be mounted to a left side or a right side of the connector. The symmetric slots eliminate the need for a left side mechanism and a right side mechanism. The retainer mechanism may also have a nut retainer that captures a nut that is used to attach the mechanism to the printed circuit board. The nut retainer allows the nut to be transported with the retainer mechanism during an assembly process.

Abstract: A retention mechanism for an electronic assembly which has a substrate and a heat sink. The retention mechanism includes a substrate slot that receives the substrate and a heat sink slot that receives the heat sink. There may be two retention mechanisms that are attached to a printed circuit board adjacent to an electrical connector. There may be two heat sink slots symmetrically located about the substrate slot so that the mechanism can be mounted to a left side or a right side of the connector. The symmetric slots eliminate the need for a left side mechanism and a right side mechanism. The retainer mechanism may also have a nut retainer that captures a nut that is used to attach the mechanism to the printed circuit board. The nut retainer allows the nut to be transported with the retainer mechanism during an assembly process.