Abstract: A disinfection apparatus, typically an autonomous or semi-autonomous robot which has a germicidal light source, a controller for controlling emission of germicidal light from the germicidal light source and a moveable support to which the germicidal light source is attached which is moveable across a surface. The apparatus may also have a detector which detects the presence of an object in the vicinity of the apparatus wherein the controller controls the direction of germicidal light from the light source in response to the detection of one or more said object.

Abstract: A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moiré alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

Abstract: A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise more alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

Abstract: A method of manufacturing a nanoelectromechanical resonator allows for uniform tuning of a resonant frequency. The nanoelectromechanical resonator can be mass produced and used to sense the presence of a selected gas.

Abstract: A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise more alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

Abstract: A method of manufacturing a nanoelectromechanical resonator allows for uniform tuning of a resonant frequency. The nanoelectromechanical resonator can be mass produced and used to sense the presence of a selected gas.

Abstract: A microscale selective laser sintering (?-SLS) that improves the minimum feature-size resolution of metal additively manufactured parts by up to two orders of magnitude, while still maintaining the throughput of traditional additive manufacturing processes. The microscale selective laser sintering includes, in some embodiments, ultra-fast lasers, a micro-mirror based optical system, nanoscale powders, and a precision spreader mechanism. The micro-SLS system is capable of achieving build rates of at least 1 cm3/hr while achieving a feature-size resolution of approximately 1 ?m. In some embodiments, the exemplified systems and methods facilitate a direct write, microscale selective laser sintering ?-SLS system that is configured to write 3D metal structures having features sizes down to approximately 1 ?m scale on rigid or flexible substrates. The exemplified systems and methods may operate on a variety of material including, for example, polymers, dielectrics, semiconductors, and metals.

Abstract: An example metrology device can include a first stage including a microelectromechanical (MEMS) device having a probe, and a second stage configured to hold a sample. The metrology device can also include a kinematic coupler for constraining the first stage in a fixed position relative to the second stage. The probe of the MEMS device can be aligned with a portion of the sample when the first stage is constrained in the fixed position relative to the second stage.

Abstract: Disclosed herein are devices, systems and methods for in-line, nanoscale metrology. One system comprises monolithic flexure mechanisms with integrated actuators that allow movement and positioning in two axes, with an extremely high degree of accuracy, of a structure comprising one or more scanning probes. This structure is suspended to prevent any destructive interference from a sample, which can be stationary or moving at a nonzero rate, and rigid or flexible in mechanical behavior. This system can be activated at startup and quickly actuate the structure to approach the surface of the sample. Once the system achieves the desired proximity between the one or more probes and the sample, the system maintains that position of the structure to a high degree of accuracy regardless of any disturbances. This array can be moved at varying speeds laterally to match the velocity of any continually moving substrates, thus enabling scanning of moving substrates.

Abstract: This invention relates to a microelectromechanical device for mechanical characterization of a specimen. In one embodiment the device may incorporate a substrate, at least one first flexure bearing and at least one second flexure bearing, both being supported on the substrate. First and second movable shuttles may be used which are supported above the substrate by the flexure bearings so that each is free to move linearly relative to the substrate. Ends of the movable shuttles are separated by a gap. A thermal actuator may be connected to one end of the first movable shuttle, and operates to cause the first movable shuttle to move in a direction parallel to the surface of the substrate in response to a signal applied to the thermal actuator. A first capacitive sensor may be formed between the first movable shuttle and the substrate, and a second capacitive sensor formed between the second movable shuttle and the substrate.

Abstract: This invention relates to a microelectromechanical device for mechanical characterization of a specimen. In one embodiment the device may incorporate a substrate, at least one first flexure bearing and at least one second flexure bearing, both being supported on the substrate. First and second movable shuttles may be used which are supported above the substrate by the flexure bearings so that each is free to move linearly relative to the substrate. Ends of the movable shuttles are separated by a gap. A thermal actuator may be connected to one end of the first movable shuttle, and operates to cause the first movable shuttle to move in a direction parallel to the surface of the substrate in response to a signal applied to the thermal actuator. A first capacitive sensor may be formed between the first movable shuttle and the substrate, and a second capacitive sensor formed between the second movable shuttle and the substrate.

Abstract: Disclosed herein are devices, systems and methods for in-line, nanoscale metrology. One system comprises monolithic flexure mechanisms with integrated actuators that allow movement and positioning in two axes, with an extremely high degree of accuracy, of a structure comprising one or more scanning probes. This structure is suspended to prevent any destructive interference from a sample, which can be stationary or moving at a nonzero rate, and rigid or flexible in mechanical behavior. This system can be activated at startup and quickly actuate the structure to approach the surface of the sample. Once the system achieves the desired proximity between the one or more probes and the sample, the system maintains that position of the structure to a high degree of accuracy regardless of any disturbances. This array can be moved at varying speeds laterally to match the velocity of any continually moving substrates, thus enabling scanning of moving substrates.

Abstract: An example metrology device can include a first stage including a microelectromechanical (MEMS) device having a probe, and a second stage configured to hold a sample. The metrology device can also include a kinematic coupler for constraining the first stage in a fixed position relative to the second stage. The probe of the MEMS device can be aligned with a portion of the sample when the first stage is constrained in the fixed position relative to the second stage.

Abstract: An example passive wafer alignment device can include a stage for holding a wafer, a plurality of pins arranged on the stage, the pins being arranged to contact respective portions of the wafer, and a preload device arranged on the stage. The preload device can be configured to apply a preload force to the wafer. In addition, two of the pins can be arranged to contact respective portions of a flat edge of the wafer, and a third pin and the preload device can be arranged to contact respective portions of a curved edge of the wafer. The third pin and the preload device can be arranged at respective locations on the stage to optimally constrain the wafer to the stage.

Abstract: An example metrology device can include a plurality microelectromechanical (MEMS) devices, where each of the MEMS devices has a probe, and a plurality of flexure elements configured to independently displace the MEMS devices. Each of the flexure elements can be coupled to a respective MEMS device, and each of the flexure elements can be configured to displace the respective MEMS device in at least one direction.

Abstract: A microscale selective laser sintering (?-SLS) that improves the minimum feature-size resolution of metal additively manufactured parts by up to two orders of magnitude, while still maintaining the throughput of traditional additive manufacturing processes. The microscale selective laser sintering includes, in some embodiments, ultra-fast lasers, a micro-mirror based optical system, nanoscale powders, and a precision spreader mechanism. The micro-SLS system is capable of achieving build rates of at least 1 cm3/hr while achieving a feature-size resolution of approximately 1 ?m. In some embodiments, the exemplified systems and methods facilitate a direct write, microscale selective laser sintering ?-SLS system that is configured to write 3D metal structures having features sizes down to approximately 1 ?m scale on rigid or flexible substrates. The exemplified systems and methods may operate on a variety of material including, for example, polymers, dielectrics, semiconductors, and metals.

Abstract: Exemplified microscale selective laser sintering (?-SLS or micro-SLS) systems and methods facilitate modeling of the nanoparticle powder bed by simulating the interactions between particles during the powder spreading operation. In particular, the exemplified methods and system use multiscale modeling techniques to accurately predict the formation and mechanical/electrical properties of parts produced by selective laser sintering of powder beds. Discrete element modeling is used for nanoscale particle interactions by implementing the different forces dominant at nanoscale. A heat transfer analysis is used to predict the sintering of individual particles in the powder beds in order to build up a complete structural model of the parts that are being produced by the SLS process.