Abstract: Technologies are described for a distributed audio system configured to switch operating modes. In some examples, the distributed audio system may include a device configured to execute first instructions from a first memory corresponding to operation in a first mode, receive a signal to switch modes, and, responsive to receiving the signal, switch a select signal corresponding to the first memory to select a second memory. Responsive to selecting the second memory, the device may be configured to execute second instructions from the second memory corresponding to operation in a second mode. The device may enter a registration mode to register portable parts to the device.

Abstract: Technologies are described for a distributed audio system configured to switch operating modes. In some examples, the distributed audio system may include a device configured to execute first instructions from a first memory corresponding to operation in a first mode, receive a signal to switch modes, and, responsive to receiving the signal, switch a select signal corresponding to the first memory to select a second memory. Responsive to selecting the second memory, the device may be configured to execute second instructions from the second memory corresponding to operation in a second mode. The device may enter a registration mode to register portable parts to the device.

Abstract: Technologies are described for a distributed audio system configured to switch operating modes. In some examples, the distributed audio system may include a device configured to execute first instructions from a first memory corresponding to operation in a first mode, receive a signal to switch modes, and, responsive to receiving the signal, switch a select signal corresponding to the first memory to select a second memory. Responsive to selecting the second memory, the device may be configured to execute second instructions from the second memory corresponding to operation in a second mode. The device may enter a registration mode to register portable parts to the device.

Abstract: One or more wireless speaker units can be distributed through a room, such as a classroom. One or more instructor units can communicate with the speaker unit via base station. Audio pathways can selectively be provided between speaker units, between speaker units and instructor units and between instructor units. A remote control can be used to control the available audio pathways.

Abstract: A door assembly and method for making a door assembly that has a front steel skin with a predetermined embossed pattern, a back steel skin that has a substantially textured flush surface and a polystyrene core one side of which has an embossed design substantially identical to the embossed design of the front steel skin and a back surface that is substantially flush. The front and back steel skins have a pressure sensitive hot melt adhesive applied thereto and the center polystyrene core is attached between the front and back steel skins and passed through a series of pinch rollers to apply predetermined pressure to the front and back skins to secure the front and back skins to the polystyrene core. The front and back skins are preheated to a predetermined temperature sufficient to maintain the pressure sensitive hot melt glue in a soft and tacky state.

Abstract: A door assembly and method for making a door assembly that has a front steel skin with a predetermined embossed pattern, a back steel skin that has a substantially textured flush surface and a polystyrene core one side of which has an embossed design substantially identical to the embossed design of the front steel skin and a back surface that is substantially flush. The front and back steel skins have a pressure sensitive hot melt adhesive applied thereto and the center polystyrene core is attached between the front and back steel skins and passed through a series of pinch rollers to apply predetermined pressure to the front and back skins to secure the front and back skins to the polystyrene core. The front and back skins are preheated to a predetermined temperature sufficient to maintain the pressure sensitive hot melt glue in a soft and tacky state.