Patents by Inventor Michael A. Howey

Michael A. Howey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6613239
    Abstract: A method 10 for making multi-layer electronic circuit boards having metallized apertures 34, 36 which may be selectively and electrically grounded or isolated from an electrical ground plane.
    Type: Grant
    Filed: April 17, 2001
    Date of Patent: September 2, 2003
    Assignee: Visteon Global Tech., Inc.
    Inventors: Andrew Z. Glovatsky, Robert E. Belke, Delin Li, Lakhi N. Goenka, Mohan R. Paruchuri, Marc A. Straub, Richard K. McMillan, Ram S. Raghava, Thomas B. Krautheim, Michael A. Howey, Vivek A. Jairazbhoy
  • Patent number: 6585538
    Abstract: A connector system for printed circuit boards uses extensions of the traces of the printed circuit board as connector pins by supporting the malleable traces with isolated support pillars. This eliminates the need for electrical junctions between the connector and the printed circuit board. The support pillars provide the necessary mechanical properties for the connector pins. The conductive trace may be adhered to one side of the support or may be draped over the top to cover both sides and may be plated with the material of the support to provide a uniform electrical conductivity over the surface of the formed pin.
    Type: Grant
    Filed: April 20, 2000
    Date of Patent: July 1, 2003
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Harvinder Singh, Vijay Patel, Michael Howey, Bharat Patel, Jin Zhou
  • Publication number: 20020151210
    Abstract: A connector system for printed circuit boards uses extensions of the traces of the printed circuit board as connector pins by supporting the malleable traces with isolated support pillars. This eliminates the need for electrical junctions between the connector and the printed circuit board. The support pillars provide the necessary mechanical properties for the connector pins. The conductive trace may be adhered to one side of the support or may be draped over the top to cover both sides and may be plated with the material of the support to provide a uniform electrical conductivity over the surface of the formed pin.
    Type: Application
    Filed: April 20, 2000
    Publication date: October 17, 2002
    Inventors: Harvinder Singh, Vijay Patel, Michael Howey, Bharat Patel, Jin Zhou
  • Publication number: 20020148809
    Abstract: A method 10 for making multi-layer electronic circuit boards having metallized apertures 34, 36 which may be selectively and electrically grounded or isolated from an electrical ground plane.
    Type: Application
    Filed: April 17, 2001
    Publication date: October 17, 2002
    Inventors: Andrew Z. Glovatsky, Robert E. Belke, Delin Li, Lakhi N. Goenka, Mohan R. Paruchuri, Marc A. Straub, Richard K. McMillan, Ram S. Raghava, Thomas B. Krautheim, Michael A. Howey, Vivek A. Jairazbhoy
  • Patent number: 5522157
    Abstract: Stacks (16) of sheet material are moved on a conveyor (12, 14) between air manifolds (18, 20) and guide pins (19, 21); so that, drying gas is directed between the sheets of the stacks to cause the stacks to expand to form fluffed stacks 28 through which air moves readily to dry the sheets. A compression roller (26) is used to expel air from the fluffed stack and return the stack essentially to its original height. A reduction in tendency to curl is achieved in low relative humidity environments for sheets of photographic film.
    Type: Grant
    Filed: October 11, 1994
    Date of Patent: June 4, 1996
    Assignee: Eastman Kodak Company
    Inventors: Michael A. Howey, Eric M. Leonard, Michael Long, James A. White