Abstract: Systems and methods may use a drone swarm to increase cargo capacity. A drone swarm may include a networked drone system or two or more drones, such as a parent drone and a child drone. A method may include receiving support component balance information captured by an inertial measurement unit on the support component supported by a parent drone, adjusting movement of the parent drone according to a control system using the support component balance information, receiving an indication of a low battery in a drone in the networked drone system, the indication including an identification of a replacement drone to replace the drone with the low battery in the networked drone system, and sending a reconfiguration command to at least one child drone to incorporate the replacement drone in the networked drone system.

Abstract: An embodiment of an integrated circuit die with staggered bond pads and optimized driver layout includes a staggered array of bond pads with an outer ring of bond pads and an inner ring of bond pads. Driver/ESD circuit cells for the outer ring of bond pads are located to the outside of the bond pads (between the outer ring of bond pads and the nearest die edge). The driver/ESD cells for the inner ring of bond pads are located to the inside of the bond pads (between the inner ring of bond pads and the die core). The integrated circuit die is coupled to a lead frame via bond wires.

Abstract: An embodiment of an integrated circuit die with staggered bond pads and optimized driver layout includes a staggered array of bond pads with an outer ring of bond pads and an inner ring of bond pads. Driver/ESD circuit cells for the outer ring of bond pads are located to the outside of the bond pads (between the outer ring of bond pads and the nearest die edge). The driver/ESD cells for the inner ring of bond pads are located to the inside of the bond pads (between the inner ring of bond pads and the die core). The integrated circuit die is coupled to a lead frame via bond wires.

Abstract: The I/O buffer layout of a pad-limited die comprises a pad ring having four partially-overlapping I/O-buffer arrays arranged in a pinwheel pattern at the periphery of a square die. To enable electrical interconnection of transversely-overlapping I/O buffers with the core logic of the die, overlapping I/O buffers of adjacent I/O-buffer arrays are separated by routing channels and the circuitry of longitudinally-overlapping buffers is abridged so that each of these buffers is capable of performing only a limited range of functions.